Patent application number | Description | Published |
20090285083 | ACTIVATION SYSTEM AND METHOD FOR ACTIVATING AN OPTICAL ARTICLE - An optical article comprising a plurality of optically detectable marks disposed on a surface of the optical article; a removable electrical device disposed on the surface of the optical article; wherein the electrical device is operatively coupled to the optical article; and wherein the electrical device is configured to interact with an activation signal when brought in direct contact with a communication device that applies the activation signal to the electrical device. A removable electrical device is also provided. A system and a method for activation are also provided. | 11-19-2009 |
20100072090 | PACKAGING FOR AN OPTICAL ARTICLE - A packaging for an optical article comprises an electrical device configured to be in contact with the optical article; and an electrical circuit element configured to interact with an activation signal provided by a communication device configured to interact with the electrical device. A system and a method of packaging are also provided. | 03-25-2010 |
20100073167 | SECURITY TAG FOR OPTICAL MEDIA AND PROCESSES FOR FABRICATION AND ATTACHMENT - An activation system for optical media in one embodiment includes a tag having at least one pair of conductors with at least one heating element coupled to the conductors. The heating element is oriented proximate one or more activation regions on the optical media, and wherein the heating element activates the optical media. The tag in one embodiment is an elongate flexible tag material with a number of conductors that couple on one end to heating elements wherein the heating elements are disposed within a media case such that they are proximate activation regions on a media article. | 03-25-2010 |
20100128439 | THERMAL MANAGEMENT SYSTEM WITH GRAPHENE-BASED THERMAL INTERFACE MATERIAL - A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane of the heat sink to maximize heat transfer. The heat source and the heat sink can be any physical structure that emits and absorbs thermal energy, respectively. The graphene paper may be bonded to the heat source and the heat sink using a bonding agent, such as a thermally conductive material, and the like. The graphene paper may be formed in several different configurations, such as a spring structure, and the like. | 05-27-2010 |
20110153228 | PHOTON IMAGING SYSTEM FOR DETECTING DEFECTS IN PHOTOVOLTAIC DEVICES, AND METHOD THEREOF - A method includes supplying current to at least one photovoltaic device via a current source and detecting emitted photon radiations from the at least one photovoltaic device via a radiation detector. The method also includes outputting a signal corresponding to the detected emitted photon radiations from the radiation detector to a processor device, and processing the signal corresponding to the detected emitted photon radiations via the processor device to generate one or more two-dimensional photon images. The method further includes analyzing the one or more two-dimensional photon images to determine at least one defect in the at least one photovoltaic device. | 06-23-2011 |
20130082376 | 3D INTEGRATED ELECTRONIC DEVICE STRUCTURE INCLUDING INCREASED THERMAL DISSIPATION CAPABILITIES - A microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is phsyically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein. | 04-04-2013 |
20130107487 | ELASTIC CONFORMAL TRANSDUCER APPARATUS | 05-02-2013 |
20130319759 | FINE-PITCH FLEXIBLE WIRING - A flexible wire assembly includes a plurality of elongated conductors and insulators each having a quadrilateral cross section and alternatingly laminated together, the flexible wire assembly having a wire width measured across the conductor and insulators, a wire height equivalent to the height of the conductors and insulators, and a wire length which is measured in a longitudinal direction orthogonal to the wire width and the wire height, wherein the wire length is one or more orders of magnitude greater than the wire width and the wire height; and a first device comprising a plurality of bond pads spaced to define a bond pad pitch, wherein the flexible wire assembly is coupled to the first device at the bond pads such that spacing of the conductor conductors is matched to the bond pad pitch. | 12-05-2013 |
20140005517 | SENSOR ASSEMBLY FOR USE IN MEDICAL POSITION AND ORIENTATION TRACKING | 01-02-2014 |
20140005527 | METHOD AND SYSTEM FOR DYNAMIC REFERENCING AND REGISTRATION USED WITH SURGICAL AND INTERVENTIONAL PROCEDURES | 01-02-2014 |
20140170811 | METHOD OF FABRICATING A 3D INTEGRATED ELECTRONIC DEVICE STRUCTURE INCLUDING INCREASED THERMAL DISSIPATION CAPABILITIES - A method of fabricating a microelectronic device structure including increased thermal dissipation capabilities. The structure including a three-dimensional (3D) integrated chip assembly that is flip chip bonded to a substrate. The chip assembly including a device substrate including an active device disposed thereon. A cap layer is physically bonded to the device substrate to at least partially define a hermetic seal about the active device. The microelectronic device structure provides a plurality of heat dissipation paths therethrough to dissipate heat generated therein. | 06-19-2014 |
20140188422 | CALBRATION OF A SENSOR ASSEMBLY FOR USE IN MEDICAL POSITION/ORIENTATION TRACKING - A position and orientation system and method is provided. A magnetoresistance sensor is provided having a sensor array configured to measure magnetic fields and a metallic coil positioned within the magnetoresistance sensor. In certain embodiments, the magnetic coil may be used to generate a known magnetic field that, when measured by the sensor array, may be used to determine or update a calibration constant for the system. | 07-03-2014 |