Patent application number | Description | Published |
20090061125 | THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING A CARBON COATING TO SAME, AND METHOD OF REDUCING A CONTACT RESISTANCE OF SAME - A thermally and electrically conductive structure comprises a carbon nanotube ( | 03-05-2009 |
20090231777 | NANOLITHOGRAPHIC METHOD OF MANUFACTURING AN EMBEDDED PASSIVE DEVICE FOR A MICROELECTRONIC APPLICATION, AND MICROELECTRONIC DEVICE CONTAINING SAME - A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate ( | 09-17-2009 |
20100035063 | Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same - A thermally and electrically conductive structure comprises a carbon nanotube ( | 02-11-2010 |
20100264536 | SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material. | 10-21-2010 |
20110151624 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die - A coating for a microelectronic device comprises a polymer film ( | 06-23-2011 |
20120141664 | THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING A CARBON COATING TO SAME, AND METHOD OF REDUCING A CONTACT RESISTANCE OF SAME - A thermally and electrically conductive structure comprises a carbon nanotube ( | 06-07-2012 |
20130017650 | COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND METHOD OF MANAGING A THERMAL PROFILE OF A MICROELECTRONIC DIE - A coating for a microelectronic device comprises a polymer film ( | 01-17-2013 |
20140013855 | DEFLECTION SENSOR FOR IN-SITU DEFLECTION MEASUREMENT IN SEMICONDUCTOR DEVICES - A deflection sensor is disclosed herein. The deflection sensor includes a nanotube film adjacent to a substrate, and first and second contacts electrically connectable with the nanotube film. Methods of making and using the deflection sensor are also disclosed. | 01-16-2014 |
20140231265 | Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes - Microelectronic packages may be formed using the co-deposition of carbon nanotubes. The carbon nanotubes may be functionalized to have an appropriate charge so they can be combined with other materials to give suitable properties. The other materials that are co-deposited may include metals, ceramics, and polymers. The electronic package components may be formed including thermal interface materials, vias, trenches, capacitors, memories, substrates, and substrate cores, as a few examples. | 08-21-2014 |
20140332966 | EPOXY-AMINE UNDERFILL MATERIALS FOR SEMICONDUCTOR PACKAGES - Epoxy-amine underfill materials for semiconductor packages and semiconductor packages having an epoxy-amine underfill material are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon. A semiconductor package substrate has a surface with a plurality of contact pads thereon. A plurality of conductive contacts couples the surface of the semiconductor die to the surface of the semiconductor package substrate. An epoxy-amine underfill material is disposed between the surface of the semiconductor die and the surface of the semiconductor package substrate and surrounds the plurality of conductive contacts. The epoxy-amine underfill has high adhesion and is based on a low volatility multi-functional amine species. | 11-13-2014 |