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Nachiket R. Raravikar
Nachiket R. Raravikar, Gilbert, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090061125 | THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING A CARBON COATING TO SAME, AND METHOD OF REDUCING A CONTACT RESISTANCE OF SAME - A thermally and electrically conductive structure comprises a carbon nanotube ( | 03-05-2009 |
| 20090231777 | NANOLITHOGRAPHIC METHOD OF MANUFACTURING AN EMBEDDED PASSIVE DEVICE FOR A MICROELECTRONIC APPLICATION, AND MICROELECTRONIC DEVICE CONTAINING SAME - A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate ( | 09-17-2009 |
| 20100035063 | Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same - A thermally and electrically conductive structure comprises a carbon nanotube ( | 02-11-2010 |
| 20100264536 | SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material. | 10-21-2010 |
| 20110151624 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die - A coating for a microelectronic device comprises a polymer film ( | 06-23-2011 |
Nachiket R. Raravikar, Chandler, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080237822 | Microelectronic die having nano-particle containing passivation layer and package including same - A microelectronic die and a package including the die. The die comprises a die substrate including a base and a die passivation layer disposed on the base. The die passivation layer includes a nanocomposite including a matrix and nanoparticles dispersed within the matrix. | 10-02-2008 |
| 20090005486 | METHOD TO FABRICATE SELF-HEALING MATERIAL - A self-healing composite material and a method to fabricate the self-healing microcapsules are illustrated. The self-healing microcapsules may be fabricated by mixing nanoscale material with a self-healing agent to form a self-healing mixture. The self-healing mixture may be encapsulated to form self-healing capsules which may be dispersed in a polymer to fabricate self-healing material. | 01-01-2009 |
| 20090321922 | SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material. | 12-31-2009 |
Nachiket R. Raravikar, Arizona, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20080305321 | IN-SITU FUNCTIONALIZATION OF CARBON NANOTUBES - An embodiment of the present invention is a technique to functionalize carbon nanotubes in situ. A carbon nanotube (NT) array is grown or deposited on a substrate. The NT array is functionalized in situ with a polymer by partial thermal degradation of the polymer to form a NT structure. The functionalization of the NT structure is characterized. The functionalized NT structure is processed according to the characterized functionalization. | 12-11-2008 |