| Patent application number | Description | Published |
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| 20080224327 | Microelectronic substrate including bumping sites with nanostructures - A microelectronic substrate and a package including the substrate. The substrate comprises: a wafer; circuitry disposed within the wafer and including a plurality of bonding pads; and a plurality of bumping sites disposed on respective ones of the bonding pads, each of the bumping sites comprising a nanolayer including columnar nanostructures. | 09-18-2008 |
| 20080233396 | METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WITH HIGH ELECTRICAL AND THERMAL CONDUCTIVITIES AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming microelectronic devices are described. Those methods may include method of forming a layered nanotube structure comprising a wetting layer disposed on a nanotube, a Shottky layer disposed on the wetting layer, a barrier layer disposed on the Shottky layer, and a matrix layer disposed on the barrier layer. | 09-25-2008 |
| 20090192241 | ALIGNED NANOTUBE BEARING COMPOSITE MATERIAL - A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core. | 07-30-2009 |
| 20100219511 | CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROCESS OF MAKING SAME, PACKAGES CONTAINING SAME, AND SYSTEMS CONTAINING SAME - A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die, an interposer-type structure for a flip-chip, a mounting substrate, or a board. The CNT array is patterned by using a patterned metallic seed layer on the substrate to form the CNT array by chemical vapor deposition. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used. | 09-02-2010 |
| Patent application number | Description | Published |
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| 20090065932 | Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby - Methods and associated structures of forming microelectronic devices are described. Those methods may include coating an interconnect structure disposed on a die with a layer of functionalized nanoparticles, wherein the functionalized nanoparticles are dispersed in a solvent, heating the layer of functionalized nanoparticles to drive off a portion of the solvent, and applying an underfill on the coated interconnect structure. | 03-12-2009 |
| 20110278351 | MAGNETIC PARTICLE ATTACHMENT MATERIAL - The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages. | 11-17-2011 |
| 20120074597 | FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY - Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed. | 03-29-2012 |
