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Nabeya

Ayao Nabeya, Susono-Shi JP

Patent application numberDescriptionPublished
20100236918FILM FORMING APPARATUS AND FILM FORMING METHOD - A film formation apparatus and film formation method that improve film thickness uniformity. A rotation mechanism holds a target having a sputtered surface in a state inclined relative to a surface of a substrate. The rotation mechanism rotatably supports the target about an axis extending along a normal of the sputtered surface. The target supported by the rotation mechanism is sputtered to form a thin film on the surface of the substrate. When forming the thin film, the rotation mechanism maintains the rotational angle of the target.09-23-2010

Kenichi Nabeya, Kawasaki JP

Patent application numberDescriptionPublished
20100251194APPARATUS FOR AIDING DESIGN OF SEMICONDUCTOR DEVICE AND METHOD - An apparatus for aiding a design of a semiconductor device including a plurality of wirings, the apparatus has a display, a memory that stores information corresponding to the wirings, and a processor that obtains a power consumption value of each wiring in reference to the information about the wirings stored in the memory, and displays each of the wirings on the display in a manner that each wiring is distinguishable as to the obtained power consumption value of the each wiring.09-30-2010

Osamu Nabeya, Chigasaki-Shi JP

Patent application numberDescriptionPublished
20090061748Substrate holding apparatus - The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.03-05-2009

Patent applications by Osamu Nabeya, Chigasaki-Shi JP

Shunichi Nabeya, Tsukuba-Shi JP

Patent application numberDescriptionPublished
20110318488ORGANORUTHENIUM COMPOUND FOR CHEMICAL DEPOSITION AND CHEMICAL DEPOSITION PROCESS USING THE ORGANORUTHENIUM COMPOUND - An object of the present invention is to provide an organoruthenium compound which has good film formation characteristics as an organoruthenium compound for chemical deposition, has a high vapor pressure, and can easily form a film even when hydrogen is used as a reactant gas. The present invention relates to an organoruthenium compound, dicarbonyl-bis(5-methyl-2,4-hexanediketonato)ruthenium (II) which can have isomers 1 to 3, wherein the content of the isomer 2 is 30% by mass or more, the content of the isomer 3 is 30% by mass or less, and the balance is the isomer 1.12-29-2011