| Patent application number | Description | Published |
|---|
| 20080224160 | High-power light emitting diode and method of manufacturing the same - Provided is a method of manufacturing a high-power LED package, the method including the steps of: preparing a mold having an irregularity pattern; providing a transparent resin solid having an irregularity pattern provided on the surface thereof by using the mold; preparing an irregularity film with the irregularity pattern by cutting a portion of the transparent resin solid; preparing an LED package structure having a cavity in which an LED chip is mounted; filling transparent liquid resin into the cavity having the LED chip mounted therein; mounting the irregularity film on the transparent liquid resin such that the irregularity film projects from the cavity at a predetermined height; and curing the transparent liquid resin having the irregularity film mounted thereon. The irregularity pattern of the irregularity film projects from the cavity at a predetermined height. | 09-18-2008 |
| 20090117357 | CONSTRAINING GREEN SHEET AND MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE - There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic binder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than a powder packing density of the first constraining layer. | 05-07-2009 |
| 20090214881 | LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING DIFFUSION BARRIER LAYER AND METHOD OF MANUFACTURING THE SAME - There is provided a low temperature co-fired ceramic substrate having a diffusion barrier layer to prevent diffusion occurring in a heterojunction during firing and a method of manufacturing the same. A low temperature co-fired ceramic substrate according to an aspect of the invention may include: a first ceramic layer formed of a material having a first dielectric constant; a second ceramic layer formed of a material having a second dielectric constant lower than the first dielectric constant; and a diffusion barrier layer interposed between the first ceramic layer and the second ceramic layer and formed of the first ceramic layer material, the second ceramic layer material, and a barium (Ba) compound, wherein inter-diffusion between the first ceramic layer material and the second ceramic layer material is prevented by using the diffusion barrier layer. | 08-27-2009 |
| 20110042131 | Ceramic substrate and manufacturing method thereof - The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof. | 02-24-2011 |
| 20110043100 | METHOD OF FORMING PHOSPHOR FILM AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME - The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film. | 02-24-2011 |
| 20110079420 | Ceramic multilayer and method for manufacturing the same - The present invention provides a multi-layered ceramic substrate including a first insulating sheet having a first via contact; and a second insulating sheet joined to the first insulating sheet, wherein the second insulating sheet has a second via contact aligned with the first via contact up and down to be joined to the first via contact, wherein the first via contact has a form extended to the inside of the second via contact. | 04-07-2011 |
