| Patent application number | Description | Published |
|---|
| 20080199757 | POLYMER COMPRISING TERMINAL SULFONIC ACID GROUP, AND POLYMER ELECTROLYTE AND FUEL CELL USING THE SAME - The present invention is related to a polymer comprising terminal sulfonic acid groups, which has a high ionic conductivity and good structural stability, does not decompose even under low humidity conditions, and is inexpensive to produce. Furthermore, the present invention is related to a polymer electrolyte and a fuel cell using the same. The polymer of the present invention has a substituent comprising a terminal sulfonic acid group comprising Formula (1) at a side chain: | 08-21-2008 |
| 20080283829 | Organic insulator composition including a hydroxyl group-containing polymer, dielectric film and organic thin film transistor using the same - An organic insulator composition including a crosslinking agent and a hydroxyl group-containing oligomer or hydroxyl group-containing polymer is provided. A dielectric film and an organic thin film transistor (OTFT) using an organic insulator composition are also provided. A dielectric film may include a compound having hydroxyl group-containing oligomers or hydroxyl group-containing polymers linked by crosslinking using a crosslinking agent having at least two vinyl ether groups. An organic thin film transistor may include a gate electrode on a substrate, a gate insulating layer on the gate electrode, source and drain electrodes on the gate insulating layer and an organic semiconductor layer contacting the gate insulating layer, wherein the gate insulating layer includes an dielectric film as described above. | 11-20-2008 |
| 20090042999 | COMPOSITION FOR POLYURETHANE FOAM, POLYURETHANE FOAM MADE FROM THE COMPOSITION, AND METHOD FOR PREPARING POLYURETHANE FOAM - Example embodiments provide a composition for a polyurethane foam including a silane precursor and/or polysilsesquioxane resin, and a preparation method of the polyurethane foam. A polyurethane foam having improved mechanical properties and insulation characteristic can be obtained by including the silane precursor and/or a polysilsesquioxane in the formation of the polyurethane foam. | 02-12-2009 |
| 20090092800 | COMPOSITION FOR PREPARING MODIFIED POLYIMIDE/CLAY NANOCOMPOSITES AND PREPARATION METHOD OF MODIFIED POLYMIDE/CLAY NANOCOMPOSITES USING THE SAME - Example embodiments provide a composition for preparing modified polyimide/clay nanocomposites. The composition comprises a modified polyamic acid terminated with groups at both ends of the backbone and a layered clay compound. Example embodiments provide a method for preparing modified polyimide/clay nanocomposites using the composition. Polyimide/clay nanocomposites prepared by the method exhibit excellent thermal properties. Therefore, the polyimide/clay nanocomposites can find many useful applications as materials for next-generation substrates that are small in size and thickness and light in weight. | 04-09-2009 |
| 20090111949 | LIQUID CRYSTAL POLYESTER RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein is a liquid crystal polyester resin composition and a printed circuit board using the composition. The composition comprises a liquid crystal polyester, a polybenzimidazole and an aprotic solvent. The composition exhibits good thermal stability and has a low dielectric constant. The composition can be advantageously used as a material for printed circuit boards (PCBS) used in semiconductor packages, mobile devices and LCD devices. | 04-30-2009 |
| 20090117348 | COMPOSITION FOR PRODUCING BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - Compositions for producing a board and a printed circuit board produced using the composition are provided. The compositions can be used for the production of a variety of printed circuit boards. | 05-07-2009 |
| 20090151987 | COMPOSITION FOR PRODUCING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition. | 06-18-2009 |
| 20090308643 | CROSSLINKABLE THERMOSET MONOMER, COMPOSITION FOR PRODUCING PRINTED CIRCUIT BOARD COMPRISING THE THERMOSET MONOMER AND PRINTED CIRCUIT BOARD USING THE COMPOSITION - Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition. | 12-17-2009 |
| 20100124037 | THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME - A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material. | 05-20-2010 |
| 20100139961 | COMPOSITION FOR PRODUCING A BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: | 06-10-2010 |
| 20100159231 | THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME - Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. | 06-24-2010 |
| 20100215973 | MALEIMIDE BASED COMPOUND, COMPOSITION FOR FORMING BOARD, AND BOARD FABRICATED USING THE SAME - Disclosed is a composition for forming a board. The composition includes a maleimide-based compound including at least three maleimide groups and a liquid crystalline polymer or oligomer. A prepreg and a board are each fabricated using the composition. | 08-26-2010 |
| 20100285243 | COMPOSITION INCLUDING BENZOXAZINE-BASED COMPOUND FOR FORMING BOARD AND BOARD FABRICATED USING THE SAME - Disclosed is a composition for forming a board including a benzoxazine-based compound and a liquid crystal polymer or oligomer, and a board fabricated using the same. A board comprising the composition including the benzoxazine-based compound and the liquid crystal compound, and a prepreg comprising the cured composition, are also disclosed | 11-11-2010 |
