| Patent application number | Description | Published |
|---|
| 20080314619 | Conductive paste, printed circuit board, and manufacturing method thereof - A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability. | 12-25-2008 |
| 20080314633 | Printed circuit board - A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface of the insulation layer to be flush with the upper surface, and a second circuit pattern formed in the lower surface of the insulation layer to be flush with the lower surface; a solder resist layer formed on the insulation layer; a via hole and a bump integrally formed on the second circuit pattern through the via hole and the via land such that it protrudes from the insulation layer to be higher than the solder resist layer. | 12-25-2008 |
| 20080315431 | Mounting substrate and manufacturing method thereof - A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting. | 12-25-2008 |
| 20090011220 | Carrier and method for manufacturing printed circuit board - A carrier and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing a printed circuit board may include: forming a first circuit pattern on each of a pair of release layers, which are attached respectively to either side of a base layer by adhesive layers; detaching the pair of release layers from the base layer; stacking and pressing the pair of release layers onto either side of an insulation substrate such that the first circuit patterns are buried in the insulation substrate; and separating the pair of release layers. By forming a circuit pattern on each of a pair of release layers with a single process, and transferring the circuit pattern into each side of an insulation substrate, the manufacturing process can be shortened and circuit patterns can be formed to a high density. | 01-08-2009 |
| 20090056119 | Method of fabricating multilayer printed circuit board - Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey. | 03-05-2009 |
| 20090101510 | High density printed circuit board and method of manufacturing the same - The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems occurring in a conventional method of manufacturing a printed circuit board because a conventional CCL is not used as a raw material. The high density printed circuit board includes a first insulating layer having a constant thickness, and a pair of first circuit layers embedded in two sides of the first insulating layer, respectively. | 04-23-2009 |
| 20090233400 | Rigid-flexible printed circuit board manufacturing method for package on package - A manufacturing method for rigid-flexible multi-layer printed circuit board including: a flexible substrate of which circuits are formed on both sides and which is bendable; a rigid substrate which is laminated on the flexible substrate and circuits are formed on both sides and a cavity within which a semiconductor chip is mounted is formed; and a bonding sheet adhering the flexible substrate and the rigid substrate and having a insulating property. When the same numbers of the semiconductor chips are mounted or the POP is embodied, the whole thickness of the package can be lower. Also, two more semiconductor chips can be mounted using the space as the thickness of the core layer, and the structure impossible when the number of semiconductor chip mounted on the bottom substrate becomes two from one in conventional technology can be embodied. | 09-17-2009 |
| 20090250260 | High density circuit board and manufacturing method thereof - The present invention relates to a high density circuit board for increasing the density of a circuit by impregnating fine circuit patterns inside a top part of a substrate, and a method for manufacturing the same. | 10-08-2009 |
| 20100018633 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom | 01-28-2010 |
| 20100024212 | Method of fabricating multilayer printed circuit board - A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey. | 02-04-2010 |
| 20100108372 | Electronic component package and manufacturing method thereof - An electronic component package and a manufacturing method thereof. The electronic component package includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In addition, the electronic component package includes a portion of the insulation layer being removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer. | 05-06-2010 |
| 20100154210 | Method of manufacturing a printed circuit board having embedded electronic components - A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet. | 06-24-2010 |
