| Patent application number | Description | Published |
|---|
| 20080264082 | Ice making device and refrigerator having the same - An ice making device and a refrigerator having the ice making device include an ice making tray having ice making grooves opened at upper sides thereof to receive water and a cool air flow channel disposed below the ice making grooves and along which cool air flows. Cool air is uniformly supplied from one side to the other side of the ice making tray along the cool air flow channel, and therefore, the ice making process is completed in a reduced time. | 10-30-2008 |
| 20090293533 | Refrigerator - A refrigerator includes an ice maker disposed at one side of a storage chamber for storing food, a folding shelf disposed at the ice maker to be folded in a vertical direction or unfolded in a horizontal direction to efficiently use a space formed on the side of the ice maker, a shelf supporting member fixed to the ice maker to rotatably support the folding shelf, and a locking part disposed at the shelf supporting member to support the folding shelf when the folding shelf is unfolded to be arranged in a horizontal direction. When the folding shelf disposed in the storage chamber is folded in a vertical direction, there is formed a space capable of storing containers or food products having a great height. When the folding shelf is unfolded in a horizontal direction, containers or food products having a small height may be put on the folding shelf. Thus, a storage space of the refrigerator may be more efficiently used. | 12-03-2009 |
| 20110000249 | ICE MAKING DEVICE AND REFRIGERATOR HAVING THE SAME - A refrigerator includes a main body which forms an external appearance and has a storage chamber to be opened at a front side, and an ice making device which is disposed in the storage chamber to make ice. The ice making device includes an ice making tray which has ice making grooves for making ice, an ejector which rotates and separates the ice made in the ice making grooves, blocking members which are disposed at an upper portion of one side of the ice making grooves to prevent the ice separated from the ice making grooves through the other side of the ice making grooves from returning to the ice making grooves, and a guide member which is disposed above the other side of the ice making tray to guide the ice separated from the other side of the ice making grooves by the ejector toward the blocking members. | 01-06-2011 |
| Patent application number | Description | Published |
|---|
| 20110140132 | Light-Emitting Device - Provided are a light-emitting device, a light-emitting device package, and a method for fabricating the light-emitting device. The light-emitting device includes a first light-emitting structure; an insulation layer having non-conductivity, in which a current does not flow, on the first light-emitting structure; a second light-emitting structure on the insulation layer; and a common electrode simultaneously and electrically connected to the first light-emitting structure and the second light-emitting structure. | 06-16-2011 |
| 20110186882 | LIGHT EMITTING DEVICE, METHOD OF FABRICATING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided are a light emitting device, a method of manufacturing the light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a reflective layer including a first GaN-based semiconductor layer having a first refractive index, a second GaN-based semiconductor layer having a second refractive index less than the first refractive index, and a third GaN-based semiconductor layer having a third refractive index less than the second refractive index and a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer on the reflective layer. | 08-04-2011 |
| 20110210359 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING UNIT - Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting unit. The light emitting device includes a conductive support substrate, a protection layer on the conductive support substrate, the protection layer having an inclined top surface, a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer on the conductive support substrate and the protection layer, and an electrode on the light emitting structure layer. A portion of the protection layer is disposed between the conductive support substrate and the light emitting structure layer. | 09-01-2011 |
| 20110220945 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME - Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a first semiconductor layer doped with N type dopants, a first active layer on the first semiconductor layer, a second semiconductor layer doped with P type dopants on the first active layer, a second active layer on the second semiconductor layer, and a third semiconductor layer doped with N type dopants on the second active layer. A thickness of the second semiconductor layer is in a range of about 2000 Åto about 4000 Å, and doping concentration of the P type dopants doped in the second semiconductor layer is in a range of about 10 | 09-15-2011 |
| 20110220946 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided is a light emitting device. The light emitting device includes a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, a second conductive type semiconductor layer on the active layer, an undoped semiconductor layer disposed on the second conductive type semiconductor layer and comprising a plurality of first holes, and a third conductive type semiconductor layer disposed on the undoped semiconductor layer and comprising a plurality of second holes. | 09-15-2011 |
| 20110229999 | FABRICATION METHOD OF LIGHT EMITTING DEVICE - Provided is a method for fabricating a light emitting device. The method for fabricating the light emitting device includes forming a buffer layer including a compound semiconductor in which a rare-earth element is doped on a substrate, forming a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, which are successively stacked on the buffer layer, forming a first electrode layer on the light emitting structure, removing the substrate, and forming a second electrode layer under the light emitting structure. | 09-22-2011 |
| 20110240958 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - A light emitting device according to the embodiment includes a conductive support substrate; a second conductive semiconductor layer on the conductive support substrate; an active layer on the second conductive semiconductor layer; a first conductive semiconductor layer on the active layer, the first conductive semiconductor layer including a GaN layer, an InGaN layer, and a roughness formed with selectively removed the GaN and InGaN layers; and an electrode layer on the first conductive semiconductor layer. | 10-06-2011 |
| 20120080660 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME - A light emitting diode is disclosed. The disclosed light emitting diode includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer. The first-conductivity-type semiconductor layer, active layer, and second-conductivity-type semiconductor layer are disposed to be adjacent to one another in a same direction. The active layer includes well and barrier layers alternately stacked at least one time. The well layer has a narrower energy bandgap than the barrier layer. The light emitting diode also includes a mask layer disposed in the first-conductivity-type semiconductor layer, a first electrode disposed on the first-conductivity-type semiconductor layer, and a second electrode disposed on the second-conductivity-type semiconductor layer. The first-conductivity-type semiconductor layer is formed with at least one recess portion. | 04-05-2012 |
