| Patent application number | Description | Published |
| 20100065728 | Apparatus and method for setting group of sensor node - An apparatus for setting a group of a sensor node and a method thereof. According to the apparatus and the method, intensity of a communication signal output from a sensor node is lowered, and the sensor node is set as a group of a master if the communication signal is received in the master, so that the sensor node can be exactly set as belonging to the group of the master. | 03-18-2010 |
| 20110120694 | Air conditioner and communication method thereof - An air conditioner in which a Carrier Sensing Multiple Access/Collision Avoidance (CSMA/CA) algorithm is provided on a bidirectional RS-485 communication line, and a communication method thereof. The air conditioner includes an RS-485 communication module to transmit and receive data in an RS-485 communication mode, and a microcomputer to determine presence or absence of data on a communication line when data to be transmitted is generated, occupy the communication line if no data is present on the communication line, and then transmit the generated data to the communication line. | 05-26-2011 |
| 20110291487 | Indoor unit and method thereof and air conditioning system having the same - An indoor unit performs a control operation to not supply power to a load device through a power/communication line simultaneously with other indoor units. An air conditioning system may includes an indoor unit including a microcomputer to output a power application signal to supply power to a load device through a power/communication line, and a duplicate power application prevention unit to interrupt the power application signal from the microcomputer when the power is simultaneously applied to the power/communication line by a different indoor unit, to prevent the power from being duplicately applied to the power/communication line. | 12-01-2011 |
| 20120033745 | Power device and safety control method thereof - An air conditioner includes at least one indoor unit and a wired controller connected to the indoor unit through two lines to receive power from the indoor unit and to perform data communication with the indoor unit. Each of the indoor unit and the wired controller includes a communication unit that modulates a low-frequency communication signal into a high-frequency communication signal and transmits the high-frequency signal and demodulates a received high-frequency signal into a low-frequency signal. When a plurality of indoor units and a wired controller perform communication, a communication signal is transmitted after being modulated into a high-frequency signal and linking the high-frequency signal with DC power. This reduces the inductance of an inductor required to separate the linked high-frequency signal into DC power and a communication signal and the capacitance of a capacitor required to link the signal with DC power, reducing PCB size and inductor and capacitor costs. | 02-09-2012 |
| Patent application number | Description | Published |
| 20080237622 | Light emitting device and package having the same - There is provided a light emitting device that can minimize reflection or absorption of emitted light, maximize luminous efficiency with the maximum light emitting area, enable uniform current spreading with a small area electrode, and enable mass production at low cost with high reliability and high quality. A light emitting device according to an aspect of the invention includes a light emitting lamination including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a conductive substrate at one surface thereof. Here, the light emitting device includes a barrier unit separating the light emitting lamination into a plurality of light emitting regions, a first electrode structure, and a second electrode structure. The first electrode structure includes a bonding unit, contact holes, and a wiring unit connecting the bonding unit to the contact holes. | 10-02-2008 |
| 20100171140 | SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a semiconductor light emitting device that minimizes reflection or absorption of emitted light, maximizes luminous efficiency with the maximum light emitting area, enables uniform current spreading with a small area electrode, and enables mass production with high reliability and high quality. A semiconductor light emitting device according to an aspect of the invention includes first and second conductivity type semiconductor layers, an active layer formed therebetween, first electrode layer, and a second electrode part electrically connecting the semiconductor layers. The second electrode part includes an electrode pad unit, an electrode extending unit, and an electrode connecting unit connecting the electrode pad unit and electrode extending unit. | 07-08-2010 |
| 20100193828 | LIGHT EMITTING DEVICE AND PACKAGE HAVING THE SAME - There is provided a light emitting device that can minimize reflection or absorption of emitted light, maximize luminous efficiency with the maximum light emitting area, enable uniform current spreading with a small area electrode, and enable mass production at low cost with high reliability and high quality. A light emitting device according to an aspect of the invention includes a light emitting lamination including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a conductive substrate at one surface thereof. Here, the light emitting device includes a barrier unit separating the light emitting lamination into a plurality of light emitting regions, a first electrode structure, and a second electrode structure. The first electrode structure includes a bonding unit, contact holes, and a wiring unit connecting the bonding unit to the contact holes. | 08-05-2010 |
| 20110297992 | SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a semiconductor light emitting device that minimizes reflection or absorption of emitted light, maximizes luminous efficiency with the maximum light emitting area, enables uniform current spreading with a small area electrode, and enables mass production with high reliability and high quality. A semiconductor light emitting device according to an aspect of the invention includes first and second conductivity type semiconductor layers, an active layer formed therebetween, first electrode layer, and a second electrode part electrically connecting the semiconductor layers. The second electrode part includes an electrode pad unit, an electrode extending unit, and an electrode connecting unit connecting the electrode pad unit and electrode extending unit. | 12-08-2011 |
| Patent application number | Description | Published |
| 20100243628 | SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME - A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate. | 09-30-2010 |
| 20100267307 | SEALING APPARATUS AND METHOD OF MANUFACTURING FLAT DISPLAY DEVICE USING THE SAME - A sealing apparatus and a method of manufacturing a flat display device using the sealing apparatus. The sealing apparatus to attach a first substrate and a second substrate to each other using an attachment member disposed between the first and second substrates, the sealing apparatus comprises a stage on which the first substrate is seated, a halogen lamp irradiating light, and a reflector reflecting light irradiated from the halogen lamp to the attachment member. | 10-21-2010 |
| 20110146575 | EVAPORATION SOURCE AND DEPOSITION APPARATUS HAVING THE SAME - An evaporation source is disclosed. In one embodiment, the evaporation source includes: i) a crucible being open on one side thereof and configured to store a deposition material and ii) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, wherein each of the nozzles has a sidewall configured to spray the deposition material therethrough, wherein the side wall has an inclined portion. The evaporation source also includes i) a heater configured to heat the crucible and ii) a housing configured to accommodate the crucible, the nozzle section, and the heater, wherein the nozzle section has a maximum spray angle less than about 60°. | 06-23-2011 |