Patent application number | Description | Published |
20130009320 | Semiconductor package and method of manufacturing the same - There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip. | 01-10-2013 |
20130015544 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAMEAANM HAN; Myeong WooAACI HwaseongAACO KRAAGP HAN; Myeong Woo Hwaseong KRAANM Yoo; Do JaeAACI SuwonAACO KRAAGP Yoo; Do Jae Suwon KRAANM Lee; Jung AunAACI SuwonAACO KRAAGP Lee; Jung Aun Suwon KRAANM Yoon; Jung HoAACI AnyangAACO KRAAGP Yoon; Jung Ho Anyang KRAANM Park; Chul GyunAACI YonginAACO KRAAGP Park; Chul Gyun Yongin KR - There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. | 01-17-2013 |
20130015563 | Semiconductor packageAANM Lee; Jung AunAACI SuwonAACO KRAAGP Lee; Jung Aun Suwon KRAANM Han; Myeong WooAACI HwaseongAACO KRAAGP Han; Myeong Woo Hwaseong KRAANM Yoo; Do JaeAACI SuwonAACO KRAAGP Yoo; Do Jae Suwon KRAANM Park; Chul GyunAACI YonginAACO KRAAGP Park; Chul Gyun Yongin KR - There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna. | 01-17-2013 |
20130076570 | RF MODULE - There is provided an RF module performing radio communications and allowing for a significantly reduced distance between an antenna and a semiconductor chip. To this end, the RF module includes a semiconductor chip; and a substrate including an anntenna unit formed by a circuit pattern thereon, and having a surface on which the semiconductor chip is mounted to be electrically connected to the antenna unit. | 03-28-2013 |
20130082891 | DIPOLE ANTENNA - There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate. | 04-04-2013 |
20130084904 | APPARATUS AND METHOD FOR SUPER HIGH-SPEED WIRELESS COMMUNICATIONS - There are provided an apparatus and a method for super high-speed wireless communications. The apparatus includes a signal processor transmitting data to be transmitted through a predetermined super high-speed communications network when the super high-speed communications network is connected and transmitting data to be transmitted through a predetermined high-speed communications network when the super high-speed communications network is disconnected; a super high-speed wireless communications unit converting the data transmitted from the signal processor to a super high-speed wireless signal suitable for transmission through the super high-speed communications network; and a high-speed wireless communications unit converting the data transmitted from the signal processor to a high-speed wireless signal suitable for transmission through the high-speed communications network. | 04-04-2013 |
20130127669 | DIELECTRIC CAVITY ANTENNA - There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line. | 05-23-2013 |
20130169376 | DIFFERENTIAL MODE AMPLIFIER DRIVING CIRCUIT - There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal. | 07-04-2013 |
20130217181 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A method of manufacturing a semiconductor package, the method including: disposing a plurality of semiconductor chips; forming a sealing part sealing the plurality of semiconductor chips; forming a substrate part on at least one surface of the sealing part; and forming an antenna part on the sealing part or the substrate part. | 08-22-2013 |
20130292809 | SEMICONDUCTOR PACKAGE - A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip. | 11-07-2013 |