Muzzy
Alec Muzzy, Woodinville, WA US
Patent application number | Description | Published |
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20140108405 | USER-SPECIFIED IMAGE GROUPING SYSTEMS AND METHODS - Digital images may be filtered according to a first user-selectable filtering metadata dimension. The filtered digital images may also be grouped according to a second user-selectable pivoting metadata dimension. A group of the filtered digital images may additionally be selected and focused on. The focused group of filtered digital images may be further filtered and grouped according to further user-selectable metadata dimensions. | 04-17-2014 |
Christopher Muzzy, Burlington, VT US
Patent application number | Description | Published |
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20090149013 | METHOD OF FORMING A CRACK STOP LASER FUSE WITH FIXED PASSIVATION LAYER COVERAGE - A crack stop void is formed in a low-k dielectric or silicon oxide layer between adjacent fuse structures for preventing propagation of cracks between the adjacent fuse structures during a fuse blow operation. The passivation layer is fixed in place by using an etch stop shape of conducting material which is formed simultaneously with the formation of the interconnect structure. This produces a reliable and repeatable fuse structure that has controllable passivation layer over the fuse structure that is easily manufactured. | 06-11-2009 |
Christopher D. Muzzy, Essex Junction, VT US
Patent application number | Description | Published |
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20110012249 | IC CHIP PACKAGE HAVING IC CHIP WITH OVERHANG AND/OR BGA BLOCKING UNDERFILL MATERIAL FLOW AND RELATED METHODS - An IC chip package, in one embodiment, may include an IC chip including an upper surface including an overhang extending beyond a sidewall of the IC chip, and underfill material about the sidewall and under the overhang. The overhang prevents underfill material from extending over an upper surface of the IC chip. In another embodiment, a ball grid array (BGA) is first mounted to landing pads on a lower of two joined IC chip packages. Since the BGA is formed on the lower IC chip package first, the BGA acts as a dam for the underfill material thereon. The underfill material extends about the respective IC chip and surrounds a bottom portion of a plurality of solder elements of the BGA and at least a portion of respective landing pads thereof. | 01-20-2011 |
20110193218 | Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture - A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall. | 08-11-2011 |
20140077367 | SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS OF MANUFACTURE - A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall. | 03-20-2014 |
James W. Muzzy, Lakewood, CO US
Patent application number | Description | Published |
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20110192807 | METHOD, APPARATUS AND SYSTEMS FOR TREATING CONTAMINANTS IN A WASTE FLUID - The invention relates to a method, apparatus and system for the treatment of organic and inorganic waste in a waste fluid. The method involves a co-current plug flow of fluid in a reactor in which ozone mass transfer conforms to the effective life of the ozone used in the treatment. Hydroxide and hydrogen peroxide can be added to the waste fluid. The combined fluids to be treated travel the reactor through a series of surfaces in a packed reactor. The apparatus includes a diffuser for ozone which assists in the co-current plug flow of fluids. The diffuser can have a porosity of about 10 microns. The invention further envisions a compact system for efficient treatment of waste fluids. | 08-11-2011 |
20110247378 | Low-Carbon Fertilizers and Processes for Producing the Same - Novel low-carbon fertilizers and processes useful for the production of the novel low-carbon fertilizers are disclosed. | 10-13-2011 |
Norman Everett Muzzy, Cedar Falls, IA US
Patent application number | Description | Published |
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20080236693 | EXHAUST PIPE ASSEMBLY - The invention relates to an exhaust pipe assembly. There is a need for an exhaust pipe assembly which transmits less noise to the environment. The exhaust pipe assembly includes a hollow exhaust pipe, and a hollow shield which surrounds at least a portion of the pipe. The shield is supported from and separated from the pipe by a plurality of elastomeric support elements which are interposed between the pipe and the shield. Each support element includes a larger body positioned between the pipe and the shield, and a smaller stem which projects from the body and extends into a bore formed in the shield. Each support element is preferably formed by injecting an elastomeric material through a corresponding one of the bores to form the body in the space between the pipe and the shield. | 10-02-2008 |
20100071919 | MECHANICAL HITCH CONTROL UNIT - A mechanical hitch control system for a vehicle includes a draft force sensing member, a mechanical hitch control unit, a hitch valve actuator, and a cable transmitting a draft force signal to the hitch control unit. A draft cam is coupled to the draft force sensing and setting members. A position cam is coupled to the position setting member and to a hitch position sensing member. A draft pickup cam is coupled to the draft cam and pivotally mounted on the hitch position setting member. At least one of the cams is operatively engagable with the hitch valve actuator. The cams are enclosed by housing with an opening covered by a removable side plate. The cams and levers are coupled to input members which are inserted through the side plate. The assembled cams, levers and input members are then installed into the housing through the opening. | 03-25-2010 |