Patent application number | Description | Published |
20080199988 | CONDUCTIVE PATTERN FORMATION METHOD - The objective of the present invention is to offer a method for forming a conductive pattern on a substrate and solder protrusions on the conductive pattern. The pitch of the conductive pattern corresponds to the pitch of electrodes on a semiconductor chip. | 08-21-2008 |
20090017582 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - This invention includes a method for manufacturing a semiconductor device by which implementation of a finer pitch for a semiconductor chip can be handled, and the creation of voids inside an under-filling resin can be reduced in order to realize highly reliable flip-chip mounting. It involves a step in which multiple electrodes arranged two-dimensionally on one side of a semiconductor chip are connected to corresponding conductive regions on a substrate; a step in which an under-filling resin is injected between the one surface of the semiconductor chip and the substrate; and a step in which the under-filling resin is melted at a temperature higher than its glass transition temperature while under a prescribed pressure and cured. | 01-15-2009 |
20090146298 | SEMICONDUCTOR DEVICE HAVING SOLDER-FREE GOLD BUMP CONTACTS FOR STABILITY IN REPEATED TEMPERATURE CYCLES - A semiconductor device has a chip ( | 06-11-2009 |
20090197373 | Semiconductor Device Singulation Method - The objective of the invention is to provide a semiconductor device manufacturing method with which the generation of burrs can be suppressed while increasing the singulation speed of the package. In a manufacturing method of a QFN package of the present invention, a molding prepared by sealing a lead frame with plural semiconductor chips carried on it en bloc with a resin; the operation comprises the following processing steps: a first singulation processing step S | 08-06-2009 |
20100032802 | Assembling of Electronic Members on IC Chip - The objective of this invention is to provide an assembling method for electronic members characterized by the fact that electronic members can be joined reliably and easily without using solder paste. The semiconductor device of the present invention has the following parts: silicon substrate | 02-11-2010 |
20100090334 | Electronic Part Manufacturing Method - The objective of this invention is to prevent the generation of defects pertaining to placement of solder balls on the terminal placement parts of the electronic part main body. The solder ball | 04-15-2010 |
20100269333 | Method for Mounting Flip Chip and Substrate Used Therein - The objective of this invention is to provide an ultrasonic flip-chip mounting method with little variance in the formed electrode joints between a semiconductor chip and a substrate. The ultrasonic method for mounting a flip chip of the present invention may include a step for forming several bump electrodes ( | 10-28-2010 |
20110045641 | Semiconductor Device Having Solder-Free Gold Bump Contacts for Stability in Repeated Temperature Cycles - A semiconductor device has a chip ( | 02-24-2011 |