Mutsuji
Toshihiko Mutsuji, Saitama JP
Patent application number | Description | Published |
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20090282973 | Fume Removal Method for a Reflow Furnace and a Reflow Furnace - In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters. | 11-19-2009 |
20140116847 | Positioning Jig and Method of Adjusting Position - A positioning jig has a circular part with a diameter that is identical with a diameter of a semiconductor wafer and knock-pins for connecting a periphery of base plate around an opening in a base plate of a conveying tool for a semiconductor wafer. These knock-pins are respectively provided in four blades protruded from predetermined positions of the circular portion at least three directions. When adjusting the projection positions of supporting plates, the knock-pins are fitted into the opening of the base plate of the conveying tool for the semiconductor wafer. The supporting plates moves so that the knock-pins come into contact with an outer edge of the circular part of the prepared positioning jig. The adjusted supporting plates are then fixed on the base plate. The semiconductor wafer is mounted on the adjusted and fixed supporting plates so that the semiconductor wafer is positioned. | 05-01-2014 |
Toshihiko Mutsuji, Tokyo JP
Patent application number | Description | Published |
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20110278348 | AUTOMATIC SOLDERING DEVICE AND CARRIER DEVICE - To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. | 11-17-2011 |
Toshihiko Mutsuji, Saitama-Ken JP
Patent application number | Description | Published |
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20150179496 | SEMICONDUCTOR WAFER TRANSFER JIG - The semiconductor wafer conveying tool which can realize the uniform heating to a surface of a semiconductor wafer when heating the semiconductor wafer is a semiconductor wafer conveying tool which holds the semiconductor wafer having a predetermined diameter to convey it wherein the tool is provided with a main body having an opening with a diameter which is larger than a diameter of the semiconductor wafer, and at least three supporting members each having a predetermined length, containing plural pins which are arranged corresponding to the diameter of the semiconductor wafer and being configured to be a holding mechanism for holding the semiconductor wafer concentrically at a projection position from an inner periphery portion of the main body around the opening, as shown in | 06-25-2015 |