Patent application number | Description | Published |
20110016272 | VIRTUALIZED DATA STORAGE IN A NETWORK COMPUTING ENVIRONMENT - Methods and systems for load balancing read/write requests of a virtualized storage system. In one embodiment, a storage system includes a plurality of physical storage devices and a storage module operable within a communication network to present the plurality of physical storage devices as a virtual storage device to a plurality of network computing elements that are coupled to the communication network. The virtual storage device comprises a plurality of virtual storage volumes, wherein each virtual storage volume is communicatively coupled to the physical storage devices via the storage module. The storage module comprises maps that are used to route read/write requests from the network computing elements to the virtual storage volumes. Each map links read/write requests from at least one network computing element to a respective virtual storage volume within the virtual storage device. | 01-20-2011 |
20120042114 | APPARATUS AND METHODS FOR MANAGING EXPANDED CAPACITY OF VIRTUAL VOLUMES IN A STORAGE SYSTEM - Methods and apparatus for expanded capacity virtual volumes in a virtualized storage system. A storage controller of the storage system parses a SCSI command block as it is received to generate a tag value indicating a segment of a virtual volume to which the command block is directed. The tag value is used to select one of a plurality of mapping segment objects stored in a memory of the controller. Each mapping segment objects maps logical block addresses of a corresponding segment of a corresponding virtual volume to physical storage addresses on the physical storage devices that comprise the virtual volume. An I/O processing circuit of the controller then processes the SCSI command block in accordance with the mapping information in the selected mapping segment object. In one exemplary embodiment, each segment of a virtual volume comprises 2 terabytes of storage capacity of the virtual volume. | 02-16-2012 |
20130318309 | VIRTUALIZED DATA STORAGE IN A NETWORK COMPUTING ENVIRONMENT - Methods and systems for load balancing read/write requests of a virtualized storage system. In one embodiment, a storage system includes a plurality of physical storage devices and a storage module operable within a communication network to present the plurality of physical storage devices as a virtual storage device to a plurality of network computing elements that are coupled to the communication network. The virtual storage device comprises a plurality of virtual storage volumes, wherein each virtual storage volume is communicatively coupled to the physical storage devices via the storage module. The storage module comprises maps that are used to route read/write requests from the network computing elements to the virtual storage volumes. Each map links read/write requests from at least one network computing element to a respective virtual storage volume within the virtual storage device. | 11-28-2013 |
20140201312 | VIRTUALIZED DATA STORAGE IN A NETWORK COMPUTING ENVIRONMENT - Methods and systems for load balancing read/write requests of a virtualized storage system. In one embodiment, a storage system includes a plurality of physical storage devices and a storage module operable within a communication network to present the plurality of physical storage devices as a virtual storage device to a plurality of network computing elements that are coupled to the communication network. The virtual storage device comprises a plurality of virtual storage volumes, wherein each virtual storage volume is communicatively coupled to the physical storage devices via the storage module. The storage module comprises maps that are used to route read/write requests from the network computing elements to the virtual storage volumes. Each map links read/write requests from at least one network computing element to a respective virtual storage volume within the virtual storage device. | 07-17-2014 |
Patent application number | Description | Published |
20090001557 | Forming a semiconductor package including a thermal interface material - In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed. | 01-01-2009 |
20100044848 | SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING - A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni. | 02-25-2010 |
20110051376 | SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING - A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni. | 03-03-2011 |
20110312131 | Forming A Semiconductor Package Including A Thermal Interface Material - In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed. | 12-22-2011 |