| Patent application number | Description | Published |
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| 20110293342 | HEAT-PRODUCING ELEMENT FOR FIXING DEVICE AND IMAGE FORMING APPARATUS - A heat-producing element for a fixing device to carry out heat-fixing after a toner image having been formed using a pulverized toner is transferred on an image support, a heat-producing element for a fixing device in which a thin-leaf graphite-pulverized material of a volume specific resistance of 10 | 12-01-2011 |
| 20110318077 | HEAT-PRODUCING ELEMENT FOR FIXING DEVICE AND IMAGE FORMING APPARATUS - A heat-producing element for fixing a toner image on an image support, in which the heat-producing element comprises a heat-resistant resin and electrically-conductive fiber having a shape stipulated by conditions 1, 2 and 3.
| 12-29-2011 |
| 20120301194 | HEATING FIXING BELT, FIXING DEVICE AND PROCESS FOR FORMING HEATING FIXING BELT - Disclosed are a heating fixing belt and a fixing device by which good long-term durability is achieved, and a process for forming the heating fixing belt. | 11-29-2012 |
| 20130045034 | HEAT-PRODUCING FIXING BELT AND IMAGE FORMING APPARATUS USING THE SAME - Disclosed is a heat-producing fixing belt of a cylindrical shape which is composed of a heat-producing layer, an elastic layer, and a releasing layer in this sequential order from the inner side, and the heat-producing layer contains a polyimide resin and fabric containing carbon fiber and a pair of electrodes to supply power to the heat-producing layer making contact with the fabric containing carbon fiber are provided on both ends of the cylindrical shape. | 02-21-2013 |
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| 20080202127 | Cooling System for Superconducting Power Apparatus - A cooling system for a superconducting power apparatus including a reservoir tank for reserving a liquefied gas, a circulating pump, a heat exchanger for cooling the liquefied gas, and a circulation loop through which the liquefied gas is circulated, the superconducting power apparatus being cooled by circulating the liquefied gas in a subcooled state using the circulating pump. The cooling system further includes a pressurizing mechanism for pressurizing the liquefied gas in the reservoir tank with the same type of gas as the liquefied gas, wherein a liquid level in the reservoir tank for reserving the liquefied gas in a pressurized state is located above an outlet of a return piping of a circulating liquefied gas at least by a dissolving depth of the pressurizing gas+(plus) a liquid level movement correction amount. | 08-28-2008 |
| 20090221427 | SUPERCONDUCTING WIRE, SUPERCONDUCTING CONDUCTOR, AND SUPERCONDUCTING CABLE - A superconducting wire having at least a superconducting thin film and a stabilizing film formed one on top of another in order on a substrate having a predetermined width and a predetermined length, the superconducting wire having at least one cut made along a direction of the length of the superconducting wire, the superconducting wire being bendable at the cut in a width direction. | 09-03-2009 |
| 20120015816 | CURRENT TERMINAL STRUCTURE OF SUPERCONDUCTING WIRE AND SUPERCONDUCTING CABLE HAVING THE CURRENT TERMINAL STRUCTURE - A current terminal structure of a superconductor has a former, and a superconducting wire wound around the former in one or more layers and including a substrate and a superconducting layer formed on the substrate. A first layer superconducting wire wound around immediately above the former is arranged so that a substrate side thereof becomes outside and a superconducting layer side thereof becomes inside. A surface of the superconducting layer at an end of the first layer superconducting wire, which is directed toward the inside, and part of a surface of the superconducting layer of a connection superconducting wire, which is directed toward the outside, are faced and connected to each other. | 01-19-2012 |
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| 20110232949 | Printed Wiring Board Manufacturing Method and Printed Wiring Board - A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings. | 09-29-2011 |
| 20110308840 | WIRING SUBSTRATE - A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles. | 12-22-2011 |
| 20110308842 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged. | 12-22-2011 |
| 20120106105 | WIRING BOARD HAVING A PLURALITY OF VIAS - A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern. | 05-03-2012 |
| 20120188735 | CIRCUIT BOARD AND ELECTRONIC DEVICE - An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings. | 07-26-2012 |
| 20120234587 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board is disclosed that includes insulating layers, conductive layers stacked with the insulating layers alternately, a through hole penetrating the insulating layers and the conductive layers, a first plate resist part formed on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers, and a plated part formed on a second portion of the inner wall of the through hole other than the first portion. | 09-20-2012 |
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| 20130008821 | HEAT-SHRINKABLE POLYESTER FILM, PACKAGES, AND PROCESS FOR PRODUCTION OF HEAT-SHRINKABLE POLYESTER FILM - Disclosed is a heat-shrinkable polyester film which, even when stored in an outside warehouse which is not temperature-controlled during a hot summer, does not result in the film shrinking (so-called natural shrinkage); which further has a low decrease in shrinkage rate in the main shrinkage direction, and which can be attached aesthetically and efficiently without changing the temperature conditions for causing heat shrinkage when attaching as a label by heat-shrinking the same to a container (e.g., a plastic bottle). The disclosed heat-shrinkable polyester film comprises a polyester resin having ethylene terephthalate as a main component and containing at least 7 mol % of at least one monomer capable of forming an amorphous component in the whole component of polyester resin. In the heat-shrinkable polyester film, the 80° C.-120° C. glycerin shrinkage, the natural shrinkage rate after high temperature aging, and the number of initial break age after high-temperature aging are adjusted within a specific range. | 01-10-2013 |
| 20130034673 | HEAT SHRINKABLE POLYESTER FILM, METHOD FOR PRODUCING SAME, AND PACKAGED BODY - Disclosed is a heat shrinkable polyester film which does not suffer (namely natural shrinkage), is suppressed in decrease of the shrinkage in the main shrinkage direction, and is able to be beautifully and efficiently fitted to a container or the like without changing the temperature conditions for heat shrinkage when the heat shrinkable polyester film is fitted, as a label, to the container or the like by means of heat shrinkage even after high-temperature summer storage in an out door warehouse which has no temperature control system. Specifically disclosed is a heat shrinkable polyester film which is formed from a polyester resin that is mainly composed of ethylene terephthalate and contains 3-12% by mole (inclusive) of one or more monomer components, which can be amorphous components, relative to all the polyester resin components. The heat shrinkable polyester film is characterized in that the shrinkage in 80° C. glycerin, the shrinkage in 130° C. glycerin and the tensile breaking strength in the longitudinal direction are controlled within specific ranges. | 02-07-2013 |
