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März
Alfred März, Schrecksbach DE
| Patent application number | Description | Published |
|---|---|---|
| 20100024458 | Air Conditioning and/or Heating System With An Assembled Housing - The invention relates to an air conditioning and/or heating system ( | 02-04-2010 |
Alfred März, Schrecksbach DE
| Patent application number | Description | Published |
|---|---|---|
| 20100024458 | Air Conditioning and/or Heating System With An Assembled Housing - The invention relates to an air conditioning and/or heating system ( | 02-04-2010 |
Martin März, Nürnberg DE
| Patent application number | Description | Published |
|---|---|---|
| 20090219694 | Power Electronics Assembly - The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element. | 09-03-2009 |
Martin März, Nürnberg DE
| Patent application number | Description | Published |
|---|---|---|
| 20090219694 | Power Electronics Assembly - The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element. | 09-03-2009 |
Monika März, Alzenau DE
| Patent application number | Description | Published |
|---|---|---|
| 20090312498 | PROCESS FOR PREPARING HYDROXY-TELECHELIC ATRP PRODUCTS - The present invention relates to the in situ hydroxyl end group functionalization of polymer chains which have been prepared by means of atom transfer radical polymerization, and to the simultaneous removal of transition metals from polymer solutions. | 12-17-2009 |
| 20100010178 | METHOD FOR THE PRODUCTION OF TELECHELIC POLYMERS - The present invention relates to the coupling of two polymer chains to give end group-functionalized polymers, the simultaneous precipitation of transition metals from polymer solutions and to the removal of halogen atoms from polymer chain ends. | 01-14-2010 |
Monika März, Alzenau DE
| Patent application number | Description | Published |
|---|---|---|
| 20090312498 | PROCESS FOR PREPARING HYDROXY-TELECHELIC ATRP PRODUCTS - The present invention relates to the in situ hydroxyl end group functionalization of polymer chains which have been prepared by means of atom transfer radical polymerization, and to the simultaneous removal of transition metals from polymer solutions. | 12-17-2009 |
| 20100010178 | METHOD FOR THE PRODUCTION OF TELECHELIC POLYMERS - The present invention relates to the coupling of two polymer chains to give end group-functionalized polymers, the simultaneous precipitation of transition metals from polymer solutions and to the removal of halogen atoms from polymer chain ends. | 01-14-2010 |