Patent application number | Description | Published |
20110156531 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes a piezoelectric substrate and an IDT electrode disposed thereon. The IDT electrode includes a metal laminate. The metal laminate includes a first metal layer made of Al or an Al-based alloy, a second metal layer made of a metal or alloy different from that used in the first metal layer, a Cu layer, and a Ti layer. The Cu layer and the Ti layer are disposed between the first and second metal layers. The Cu layer is located on the first metal layer side. | 06-30-2011 |
20120326809 | ELASTIC WAVE RESONATOR AND LADDER FILTER - To enhance a heat dissipation property and achieve stabilization of a resonance characteristic in an elastic wave resonator including an IDT electrode weighted so as to have a plurality of apodization local maximum value portions, the elastic wave resonator includes an IDT electrode located on a piezoelectric substrate, the IDT electrode is apodization-weighted so that a plurality of local maximum values occur in apodization in an elastic wave propagation direction, heat dissipation electrodes are provided in at least one apodization local minimum value portion occurring in the elastic wave propagation direction in the IDT electrode, and when it is assumed that direction dimension widths of the heat dissipation electrodes in the elastic wave propagation direction are A and the dimension of about ½ of a wave length of a propagating elastic wave is B, B | 12-27-2012 |
20130234558 | ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An acoustic wave device includes a first electrode film arranged on a top surface of a piezoelectric substrate and defining electrodes including IDT electrodes and a second electrode film arranged to extend from the top surface of the piezoelectric substrate to a portion of a top surface of the first electrode film. The second electrode film defines electrodes including a wiring electrode | 09-12-2013 |
20140332395 | MANUFACTURING METHOD OF ELECTRONIC COMPONENT - A manufacturing method of an electronic component allows an intermediate inspection during a manufacturing process and includes forming element electrodes and feed lines such that pad portions of the element electrodes and the corresponding one of the feed lines faces each other via a gap in a plan view, and such that the feed lines are located below the pad portions 11 | 11-13-2014 |
20140333391 | ELASTIC WAVE DEVICE - An elastic wave device includes a resonator and an inductor. One end of the inductor is connected to the resonator, and the other end of the inductor is connected to a ground electrode or a signal electrode. The elastic wave device includes a chip and a mounting substrate. The chip includes a piezoelectric substrate and an interdigital transducer electrode provided on the piezoelectric substrate so define the resonator. The chip is mounted on the mounting substrate. The inductor is provided to the mounting substrate. A dummy electrode to which the one end side of the inductor is connected and the ground electrode or the signal electrode are provided on a surface of the mounting substrate that is opposite to the chip. | 11-13-2014 |
20140333392 | FILTER DEVICE - A filter device includes a piezoelectric substrate, an IDT arranged on a major surface of the piezoelectric substrate to define a surface acoustic wave resonator, a wiring electrode that is electrically connected to the IDT, and an acoustic member located on a major surface of the piezoelectric substrate near or adjacent to the IDT and that has an acoustic impedance different from that of the piezoelectric substrate. The wiring electrode that is to be disposed in the vicinity of the IDT is located on the acoustic member. | 11-13-2014 |
20150243875 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member. | 08-27-2015 |
20150249438 | ELASTIC WAVE DEVICE - An elastic wave device includes a piezoelectric substrate, an IDT electrode, and a cover member. The IDT electrode is provided on the piezoelectric substrate. The cover member is provided above the piezoelectric substrate and separate from the IDT electrode. The cover member includes a first cover member and a second cover member. The second cover member is laminated on a side of the first cover member opposite to the piezoelectric substrate. The glass transition point of the first cover member is higher than that of the second cover member. | 09-03-2015 |