Patent application number | Description | Published |
20110075088 | WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE - A wiring board of the present invention has pads disposed in a plurality of rows including: first row pads each being connected to a respective one of the connection wires that is long in length; and second row pads ( | 03-31-2011 |
20110182046 | ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - The present invention provides a reduced size electronic circuit device, a manufacturing method of the same, and a display device having the same made by the manufacturing method. The electronic circuit device of the present invention is an electronic circuit device, wherein a first electronic component and a second electronic component are respectively connected electrically to a third electronic component; the first electronic component is bonded to the third electronic component through a first adhesive layer; the second electronic component is bonded to the third electronic component through the first and second adhesive layers; and one of the first adhesive layer and the second adhesive layer contains an anisotropic conductive material and the other adhesive layer does not contain the anisotropic conductive material. | 07-28-2011 |
20110193239 | SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE PROVIDED WITH THE SAME - Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC ( | 08-11-2011 |
20120006584 | WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE - A wiring board of the present invention ( | 01-12-2012 |
20120080789 | SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended) - Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip including an input bump group, which is composed of a plurality of input bumps aligned in a line along one long side of its bottom surface, and an output bump group, which is composed of a plurality of output bumps arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group is provided in an area between an area where the input bump group is provided and an area where the output bump group is provided, the dummy bump group including a plurality of rectangular dummy bumps which have long side extending along a direction perpendicular to the long sides of the bottom surface. | 04-05-2012 |
20120133876 | LIQUID CRYSTAL PANEL - A region for mounting components such as an IC chip is sufficiently ensured on a glass substrate with which a liquid crystal panel is configured, without reducing the number of panel pieces to be taken from a large panel. A liquid crystal panel is composed of a first glass substrate ( | 05-31-2012 |
20120236230 | DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - Disclosed is a device substrate wherein an insulating layer ( | 09-20-2012 |
20130335940 | ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE - A wiring substrate ( | 12-19-2013 |
20150029436 | DISPLAY APPARATUS - A display apparatus is provided with: a frame; a display panel, which is fixed to the frame; and a plurality of flexible printed circuit boards, which are disposed adjacent to each other, and each of which has one end side pressure bonded to the display panel, and the other end side bent to the frame side, which is the reverse side of the display panel. The display apparatus has adhesive areas wherein a surface of the display panel is adhered and fixed to the frame, the adhesive areas being in areas overlapping the flexible printed circuit boards. In regions among the flexible printed circuit boards adjacent to each other, non-adhesive areas where the surface of the display panel is not adhered and fixed to the frame are provided. | 01-29-2015 |