| Patent application number | Description | Published |
|---|
| 20090255719 | WIRING BOARD AND CERAMIC CHIP TO BE EMBEDDED - A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom. | 10-15-2009 |
| 20090268373 | METHOD OF MANUFACTURING CAPACITOR FOR INCORPORATION IN WIRING BOARD, CAPACITOR FOR INCORPORATION IN WIRING BOARD, AND WIRING BOARD - A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed on sides closer to outer peripheral sides of the dielectric layers than to the inner electrode layers and disposed apart from the inner electrode layers. | 10-29-2009 |
| 20100300602 | Method for Manufacturing Ceramic Capacitor - A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion. | 12-02-2010 |
| 20100300740 | Ceramic Capacitor and Wiring Board - A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section. | 12-02-2010 |
| 20110083794 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 04-14-2011 |
| 20110090615 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 04-21-2011 |
| 20110157763 | CAPACITOR FOR INCORPORATION IN WIRING BOARD, WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, AND CERAMIC CHIP FOR EMBEDMENT - A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body. | 06-30-2011 |
