Patent application number | Description | Published |
20090134492 | METHODS AND DEVICES FOR FABRICATING TRI-LAYER BEAMS - Methods and devices for fabricating tri-layer beams are provided. In particular, disclosed are methods and structures that can be used for fabricating multilayer structures through the deposition and patterning of at least an insulation layer, a first metal layer, a beam oxide layer, a second metal layer, and an insulation balance layer. | 05-28-2009 |
20090296309 | MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VARIABLE CAPACITORS AND ACTUATION COMPONENTS AND RELATED METHODS - Micro-electro-mechanical system (MEMS) variable capacitors and actuation components and related methods are provided. A MEMS variable capacitor can include first and second feed lines extending substantially parallel to one another. Further, MEMS variable capacitors can include first and second capacitive plates being spaced apart from the first and second feed lines. The first and second capacitive plates can be separately movable with respect to at least one of the first and second feed lines for varying the capacitance between the first and second feed lines over a predetermined capacitance range. | 12-03-2009 |
20100032775 | THIN-FILM LID MEMS DEVICES AND METHODS - Thin film encapsulation devices and methods for MEMS devices and packaging are provided. For a MEMS device encapsulated by a sacrificial layer, a lid layer can be deposited over the MEMS device without touching the MEMS device. The lid layer can be patterned and etched with a distribution of release etch holes, which provide access to the sacrificial layer encapsulating the MEMS device. The sacrificial material can be removed through the release etch holes, and the release etch holes can be filled with a seal layer. The seal layer can be removed from the substrate except where it seals the etch holes, leaving a series of plugs that can prevent other materials from entering the MEMS device cavity. In addition, a seal metal layer can be deposited and patterned so that it covers and encloses the plugged etch holes, and a barrier layer can cover the entire encapsulation structure. | 02-11-2010 |
20110175687 | TUNABLE MATCHING NETWORK CIRCUIT TOPOLOGY DEVICES AND METHODS - Methods and devices for modifying a tunable matching network are disclosed. In one aspect, a method of modifying a tunable matching network can include connecting one or more shunt inductors to a tunable matching network exhibiting parasitic capacitance to ground, whereby high-frequency performance of the tunable matching network is improved. | 07-21-2011 |
20120169565 | Tunable radio front end and methods - Tunable radio front end systems and methods are disclosed in which the tunable radio front end includes a first tunable impedance matching network, a second tunable impedance matching network, a transmission signal path, and a reception signal path. The transmission signal path can include a first tunable filter in communication with the first tunable impedance matching network, a tunable power amplifier connected to the first tunable filter, and a radio transmitter connected to the tunable power amplifier. The reception signal path can include a second tunable filter in communication with the second tunable impedance matching network, a tunable low-noise amplifier connected to the second tunable filter, and a radio receiver connected to the tunable low-noise amplifier. | 07-05-2012 |
20120286892 | MEMS TUNABLE NOTCH FILTER FREQUENCY AUTOMATIC CONTROL LOOP SYSTEMS AND METHODS - Tunable notch filters and control loop systems and methods can include a tunable notch filter providing a stop band, a sensing circuit in communication with the tunable notch filter and adapted to determine a phase change between a reference signal and a signal reflected from the tunable notch filter, and a control loop in communication with the tunable notch filter and the sensing circuit, the control loop being operable to adjust the tunable notch filter to modify the phase change. | 11-15-2012 |
20120293187 | SIMPLE AND MINIMALLY INVASIVE METHODS AND SYSTEMS FOR SENSING AND COMPUTING LOAD IMPEDANCE - Systems and methods for direct load impedance computation for a two-port network are disclosed. For a two-port network connected between a first port and a second port, a method can include defining an equivalent PI network including a first equivalent network element in communication with the first port, a second equivalent network element in communication with the second port, and a third equivalent network element connected between the first port and the second port. A linear passive load can be connected to the second port of the two-port network, currents through the linear passive load, the second equivalent network element, and the third equivalent network element can be measured, and a load impedance of the linear passive load can be determined based on predetermined values of a voltage at the first port and a voltage at the second port. | 11-22-2012 |
20120314335 | SYSTEMS AND METHODS FOR CURRENT DENSITY OPTIMIZATION IN CMOS-INTEGRATED MEMS CAPACITIVE DEVICES - The present subject matter relates to the use of current splitting and routing techniques to distribute current uniformly among the various layers of a device to achieve a high Q-factor. Such current splitting can allow the use of relatively narrow interconnects and feeds while maintaining a high Q. Specifically, for example a micro-electromechanical systems (MEMS) device can comprise a metal layer comprising a first portion and a second portion that is electrically separated from the first portion. A first terminus can be independently connected to each of the first portion and the second portion of the metal layer, wherein the first portion defines a first path between the metal layer and the first terminus, and the second portion defines a second path between the metal layer and the first terminus. | 12-13-2012 |
20130314175 | MIXED-TECHNOLOGY COMBINATION OF PROGRAMMABLE ELEMENTS - The present subject matter relates to systems and methods for arranging and controlling programmable combinations of tuning elements in which more than one form of switching technology is combined in a single array. Specifically, such an array can include one or more first switchable elements including a first switching technology (e.g., one or more solid-state-controlled devices) and one or more second switchable elements including a second switching technology that is different than the first switching technology (e.g., one or more micro-electro-mechanical capacitors). The one or more first switchable elements and the one or more second switchable elements can be configured, however, to deliver a combined variable reactance. | 11-28-2013 |
20140008738 | MEMS DIE AND METHODS WITH MULTIPLE-PRESSURE SEALING - The present subject matter relates to systems and methods for sealing one or more MEMS devices within an encapsulated cavity. A first material layer can be positioned on a substrate, the first material layer comprising a first cavity and a second cavity that each have one or more openings out of the first material layer. At least the first cavity can be exposed to a first atmosphere and sealed while it is exposed to the first atmosphere while not sealing the second cavity. The second cavity can then be exposed to a second atmosphere that is different than the first atmosphere, and the second cavity can be sealed while it is exposed to the second atmosphere. | 01-09-2014 |
20140015589 | METHODS, DEVICES, AND SYSTEMS FOR SWITCHED CAPACITOR ARRAY CONTROL TO PROVIDE MONOTONIC CAPACITOR CHANGE DURING TUNING - The present subject matter relates to methods, devices, and systems for switched capacitor array control. For an array of two-state elements that can be independently positioned in either an active state or an inactive state, the methods, devices, and systems can determine a linear number D of elements in the active state needed to achieve a total combined activity corresponding to a desired behavior, compare a number A of elements in an active state to the linear number D of elements needed to achieve the desired behavior, activate a first number n of inactive elements, and deactivate a second number m of active elements, wherein the difference between the first number n and the second number m is equal to the difference between the linear number D of elements needed to achieve the desired behavior and the present number A of elements in an active state. | 01-16-2014 |
20140054728 | SEMICONDUCTOR STRUCTURES PROVIDED WITHIN A CAVITY AND RELATED DESIGN STRUCTURES - Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension. | 02-27-2014 |
20140211366 | MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VARIABLE CAPACITOR APPARATUSES AND RELATED METHODS - Systems, devices, and methods for micro-electro-mechanical system (MEMS) tunable capacitors can include a fixed actuation electrode attached to a substrate, a fixed capacitive electrode attached to the substrate, and a movable component positioned above the substrate and movable with respect to the fixed actuation electrode and the fixed capacitive electrode. The movable component can include a movable actuation electrode positioned above the fixed actuation electrode and a movable capacitive electrode positioned above the fixed capacitive electrode. At least a portion of the movable capacitive electrode can be spaced apart from the fixed capacitive electrode by a first gap, and the movable actuation electrode can be spaced apart from the fixed actuation electrode by a second gap that is larger than the first gap. | 07-31-2014 |
20140268482 | ACTUATOR PLATE PARTITIONING AND CONTROL DEVICES AND METHODS - Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where each of the one or more actuation electrode being independently controllable, and a movable component spaced apart from the first surface and movable with respect to the first surface. Where the movable component further includes one or more movable actuation electrodes spaced apart from the plurality of fixed actuation electrodes. | 09-18-2014 |
20140285254 | CHARGE PUMP SYSTEMS AND METHODS - Charge pump systems and methods for the operation thereof can be configured for delivering charge to a primary circuit node. A sequential charging pattern of at least a subset of a series-connected plurality of charge-pump stages connected between a supply voltage node and the primary circuit node can be selectively initiated. For example, the sequential charging pattern can be initiated one time for every N cycles of a given clock signal, wherein N is a selectively adjustable integer value greater than or equal to 1. | 09-25-2014 |
20150131197 | SYSTEMS AND METHODS FOR CALIBRATING A TUNABLE COMPONENT - Systems, devices, and methods for adjusting tuning settings of tunable components, such as tunable capacitors, can be configured for calibrating a tunable component. Specifically, the systems, devices and methods can measure a device response for one or more inputs to a tunable component, store a calibration code in a non-volatile memory that characterizes the device response of the tunable component, and adjust a tuning setting of the tunable component based on the calibration code to achieve a desired response of the tunable component. | 05-14-2015 |
20150131492 | ADAPTIVE FILTER RESPONSE SYSTEMS AND METHODS - The present subject matter relates to systems, devices, and methods for adaptively tuning antenna elements and/or associated filter elements to support multiple frequency bands. For example, a tunable filter having an input node and an output node can be selectively tunable to define one or more pass bands associated with one or more first signal bands and one or more reject bands associated with one or more second signal bands. The tunable filter can be configured to pass signals having frequencies within the first signal bands between the input node and the output node and to block signals having frequencies within the second signal bands. Furthermore, the tunable filter can be configured to selectively tune the pass bands to have a minimum pass band insertion loss at any of a variety of frequencies, including frequencies that are greater than and less than frequencies within the reject bands. | 05-14-2015 |