| Patent application number | Description | Published |
|---|
| 20090001490 | Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module - An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 μm. In addition, an illumination module comprising such a component is disclosed. | 01-01-2009 |
| 20090059588 | HOUSING COMPRISING A HOUSING UNDERPART AND METHOD FOR EMITTING ELECTROMAGNETIC RADIATION - A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed. | 03-05-2009 |
| 20090103297 | LED ARRAY - In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips. | 04-23-2009 |
| 20090116209 | Housing for an optoelectronic component emitting electromagnetic radiation, component emitting electromagnetic radiation, and method for the production of a housing or a component - A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An electromagnetic-radiation-emitting component having a housing of this type and a method for producing a corresponding housing or component are additionally described. | 05-07-2009 |
| 20090159912 | HOUSING FOR A LUMINESCENCE DIODE COMPONENT - What is specified is a housing for a luminescence diode component comprising a housing cavity within which is arranged at least one chip mounting region for a luminescence diode chip and which has an output opening. In accordance with one embodiment, the housing has, at least at a vertical distance from the chip mounting region, inner walls which laterally bound the housing cavity and are at a maximum lateral distance of less than or equal to 500 μm from the chip mounting region. What is additionally specified is a housing in which the housing cavity has at least one partial region which is laterally covered by a housing material that laterally delimits the housing cavity. Moreover, a description is given of a luminescence diode component, in particular for a motor vehicle headlight. | 06-25-2009 |
| 20090251918 | LIGHTING DEVICE, AUTOMOTIVE HEADLIGHTS AND METHOD FOR PRODUCING A LIGHTING DEVICE - Disclosed is a lighting device comprising at least one LED and at least one optical element, wherein the LED and the optical element are aligned with each other by means of at least one dowel pin. A method of making such a lighting device is also specified. The described lighting device is particularly well suited for use in a vehicle headlight. | 10-08-2009 |
| 20090302766 | MOTOR VEHICLE HEADLIGHT ELEMENT - A motor vehicle headlight element is specified which has at least one light-emitting diode and at least one control apparatus. The control apparatus is suitable for processing a signal which is dependent on a measurement variable and for applying a current, corresponding to the signal, to the light-emitting diode. The control apparatus and the light-emitting diode are arranged on a common mount. | 12-10-2009 |
| 20100012959 | Optoelectronic Component - An optoelectronic component with a desired color impression in the switched-off state includes, in particular, a semiconductor layer sequence with an active region, that during operation radiates electromagnetic radiation with a first spectrum, and a wavelength conversion layer that is disposed downstream from the semiconductor layer sequence in the beam path of the electromagnetic radiation with the first spectrum, and that at least partially converts a subspectrum of the electromagnetic radiation with the first spectrum into electromagnetic radiation with a second spectrum, and a filter layer that reflects at least a part of the radiation incident from outside onto the optoelectronic component. | 01-21-2010 |
| 20100038666 | Lens Arrangement and LED Display Device - A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens. | 02-18-2010 |
| 20100117103 | Light-Emitting Module and Method of Manufacture for a Light-Emitting Module - A light-emitting module includes a supporting element, a number of optoelectronic semiconductor components mounted on the supporting element for the generation of electromagnetic radiation, and a metallic connecting layer by means of which the optoelectronic semiconductor components are supplied with operating voltage. An insulation layer is arranged in a region of the optoelectronic semiconductor components between the supporting element and the metallic connecting layer. The metallic connecting layer forms a light shade for the optoelectronic semiconductor components, so that the electromagnetic radiation is only emitted in a specified direction. | 05-13-2010 |
| 20100207148 | RADIATION-EMITTING COMPONENT - A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum. | 08-19-2010 |
| 20100230697 | OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF - An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate. | 09-16-2010 |
