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Morini, IT
Emilio Morini, Parma IT
| Patent application number | Description | Published |
|---|---|---|
| 20080209857 | Process For Sterile Packaging of Containers With Drop-Dispensers, and Means For Actuating the Process - The process includes a stage of sterilisation of the flagon, the drop-dispenser and the closure cap making up the container, which is preceded by a stage in which the cap and the drop-dispenser are removably anchored together. In a subsequent stage the flagon and the drop-dispenser-cap group are placed in an aseptic environment, and the flagon is filled before the pre-assembled drop-dispenser-cap group is inserted on the flagon. The means for actuating the above process comprise a flagon ( | 09-04-2008 |
Emilio Morini, Colorno IT
| Patent application number | Description | Published |
|---|---|---|
| 20100012660 | CAPSULE WITH A RESERVOIR FOR SUBSTANCES TO BE MIXED WITH LIQUIDS AT TIME OF USE - The invention concerns a capsule ( | 01-21-2010 |
| 20100119644 | MOULD FOR INJECTION MOULDING OF TUBES HAVING SLIM WALLS AND BEING MADE OF PLASTIC - The invention relates to a mould for injecting tubes having slim walls made of a plastic material. The mould, destined to make tubes having an outlet mouth for a product and a lateral wall delimiting the space destined to contain the product to be packed, comprises an upper punch and a lower punch which are inserted in an external body or matrix of the mould to define the space to be filled with the injected plastic material; the upper punch comprises a projection which occupies the internal part of the outlet mouth and extends below the lower end of the mouth; the lower punch comprises a cavity internally of which the projection is inserted; injection channels are afforded between the projection and the cavity, which channels flow into a single injection manifold are reach inlet points to a space of the mould destined to receive the injected material. | 05-13-2010 |
| 20100233394 | PROCESS FOR MAKING PLASTIC CLOSURES AND CLOSURE - A process for realizing plastic capsules ( | 09-16-2010 |
Emilio Morini, Colorno (parma) IT
| Patent application number | Description | Published |
|---|---|---|
| 20080202949 | Reservoir With a Cutter for Substances to be Mixed With Liquids at Moment of Use in Particular for Single-Dose Containers - The reservoir with a cutter for substances to be mixed with liquids at moment of use, in particular for single-dose containers, is of a type comprising a breakable bottom ( | 08-28-2008 |
| 20090272713 | CHILD-PROOF CAPSULE WITH A SYRINGE DOSER - The capsule comprises: an internal capsule ( | 11-05-2009 |
Giampiero Morini, Pedova IT
| Patent application number | Description | Published |
|---|---|---|
| 20110082270 | Pyridazine-modified ziegler-natta catalyst system - A modified Ziegler-Natta catalyst system, a method for preparing the catalyst system, and a process for polymerizing an olefin in the presence of the catalyst system are disclosed. The catalyst system comprises a titanium or vanadium compound, an aluminum compound, and a pyridazine. Improved properties such as increased molecular weight and narrowed molecular weight distribution are obtained. | 04-07-2011 |
Luciano Morini, Firenze IT
| Patent application number | Description | Published |
|---|---|---|
| 20110088839 | MACHINE AND A METHOD FOR FILLING CONTAINMENT PANELS WITH TILES TO FORM MOSAIC PATTERNS - A machine fulfilling containment panels (P; P | 04-21-2011 |
Mario Morini, Broni IT
| Patent application number | Description | Published |
|---|---|---|
| 20100101755 | HEAT EXCHANGER FOR A BOILER - A heat exchanger for a boiler, comprising, within a monolithic structure, at least one pair of mutually opposite manifolds connected by perforated pins inserted within a portion of space which is delimited by the structure and is designed to convey the products of combustion, the manifolds being adapted to provide the circulation of the fluid to be heated between an inlet connector and an outlet connector. | 04-29-2010 |
| 20110094715 | METHOD FOR ANODIZING METALLIC ALLOYS, PARTICULARLY FOR HEAT EXCHANGERS MADE OF ALUMINUM ALLOYS AND THE LIKE FOR CONDENSING BOILERS - A method for anodizing metallic alloys, particularly for heat exchangers made of aluminum alloys and the like for condensing boilers, comprising a step of immersing at least one heat exchanger or the like made of a metallic alloy in a bath of an electrolytic solution functionally associated with a source of electric current through the heat exchanger, the anodizing method then providing for a step of anodizing the heat exchanger immersed in the bath, so as to anodize at least the outer surfaces of the heat exchanger, the method comprising a step of pumping the electrolytic solution into the heat exchanger immersed in the bath for the forced circulation of the electrolytic solution in the internal passage channels of the heat exchanger so as to anodize the inner surfaces of the heat exchanger. | 04-28-2011 |
Monica Morini, Genova IT
| Patent application number | Description | Published |
|---|---|---|
| 20110144022 | Anti-Angiogenic Peptide - The invention relates to an anti-angiogenic peptide corresponding to a fragment of angiostatin molecule, pharmaceutical compositions containing it and the use thereof in the preventive or therapeutic treatment of diseases involving angiogenesis. | 06-16-2011 |
Sergio Morini, Pavia (pv) IT
| Patent application number | Description | Published |
|---|---|---|
| 20090002060 | NEGATIVE N-EPI BIASING SENSING AND HIGH SIDE GATE DRIVER OUTPUT SPURIOUS TURN-ON PREVENTION DUE TO N-EPI P-SUB DIODE CONDUCTION DURING N-EPI NEGATIVE TRANSIENT VOLTAGE - A high-side driver in a driver circuit for driving a half-bridge stage having high- and low-side power switching devices series connected at a switched node, the high-side driver driving the high-side power switching device. The high-side driver including first and second complementary switched MOSFET series connected at a high-side node, driving the high-side power switching device, one of the MOSFETs having a parasitic bipolar transistor formed between the substrate, an N+ epitaxial region connected to the high-side driver supply voltage and the switched node, with the parasitic transistor having a base electrode formed by the N+ epitaxial region, an emitter electrode formed by the substrate and a collector electrode formed by the switched node, such that if a transient voltage that is negative with respect to the substrate is present at the high-side driver supply voltage, the parasitic transistor will conduct a short circuit current between the switched node and the substrate; a first circuit for controlling the conduction of the first and second MOSFETs to switch the high-side switching device ON and OFF; a diffusion in the N+ epitaxial region in which a terminal connected to the switched node is provided by the diffusion forming the collector of the parasitic transistor; and a second circuit coupled to the diffusion for sensing the high-side driver supply voltage at the epitaxial region and providing a signal to the controller circuit to prevent turn-ON of the high-side power switching device. | 01-01-2009 |
Sergio Morini, Pavia IT
| Patent application number | Description | Published |
|---|---|---|
| 20080278213 | HIGH OHMIC INTEGRATED RESISTOR WITH IMPROVED LINEARITY - An integrated circuit that includes a resistor module with improved linearity is disclosed. The resistor module includes a diffused resistor body of a first conductivity type; a first terminal and a second terminal, each making direct electrical contact with the diffused resistor body; a doped well of a second conductivity type substantially surrounding the diffused resistor body on all but one major surface of the diffused resistor body, the doped well having contact regions; a first amplifier connected to the first terminal and to one contact region of the doped well; and a second amplifier connected to the second terminal and to another contact region of the well, such that the first amplifier and the second amplifier are connected for power supply only to the first terminal and second terminal, respectively. The first and second amplifiers may be unity gain buffer amplifiers or inverting opamps. | 11-13-2008 |
| 20080297212 | START-UP CIRCUITY FOR PROVIDING A START-UP VOLTAGE TO AN APPLICATION CIRCUIT - A startup circuit for providing a startup voltage from a high voltage DC bus voltage to an application circuit, the startup circuit comprising an integrated circuit package for at least a control circuit for driving at least one power switch of the application circuit having a low voltage terminal; a dropping resistor in the integrated circuit package having a first terminal for coupling to the high voltage DC bus and a second terminal, the dropping resistor dropping the high voltage DC bus voltage to a reduced voltage and providing the reduced voltage at the second terminal; further comprising a low voltage regulator coupled to the second terminal for using the reduced voltage for enabling generation of a regulated startup low voltage DC output at a preset level at the low voltage terminal for powering at least one part of the application circuit during startup of the application circuit, wherein the high voltage DC bus voltage is the only voltage source provided externally to the integrated circuit package. | 12-04-2008 |
| 20090102488 | GROUND FAULT DETECTION CIRCUIT FOR USE IN HIGH VOLTAGE MOTOR DRIVE APPLICATIONS - An integrated ground fault detection circuit in accordance with an embodiment of the present application includes a shunt resistor provided on a positive rail of a DC bus, a high voltage pocket including a sensory circuit connected to the shunt resistor and operable to detect a fault condition indicating a short circuit and a transmitter section operable to continuously transmit a fault condition signal indicating the fault condition and a low voltage pocket including a receiver operable to receive the fault condition signal from the sensory circuit and a logic unit, connected to the receiver, and operable to provide a fault output signal indicating the presence of a fault condition based on the fault condition signal. | 04-23-2009 |