| Patent application number | Description | Published |
|---|
| 20090127705 | Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device - There are provided a semiconductor device capable of accurately determining whether a semiconductor chip is bonded to a solid-state device such as the other semiconductor chip parallelly with each other, a semiconductor chip used for the semiconductor device, and a method of manufacturing the semiconductor chip. The semiconductor chip includes a functional bump projected with a first projection amount from the surface of the semiconductor chip and electrically connecting the semiconductor chip to the solid-state device, and a connection confirmation bump projected with a second projection amount, which is smaller than the first projection amount, from the surface of the semiconductor chip and used for confirming the state of the electrical connection by the functional bump. | 05-21-2009 |
| 20100187685 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion ( | 07-29-2010 |
| 20110074017 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MULTILAYER WAFER STRUCTURE - Grooves are formed on the front surfaces of first and second semiconductor wafers each including an aggregate of a plurality of semiconductor chips. The grooves each extend on a dicing line set between the semiconductor chips and to have a larger width than the dicing line. Thereafter the first and second semiconductor wafers are arranged so that the front surfaces thereof are opposed to each other, and the space between the first semiconductor wafer and the second semiconductor wafer is sealed with underfill. Thereafter the rear surfaces of the first and second semiconductor wafers are polished until at least the grooves are exposed, and a structure including the first and second semiconductor wafers and the underfill is cut on the dicing line. | 03-31-2011 |
| Patent application number | Description | Published |
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| 20090136146 | IMAGE PROCESSING DEVICE AND METHOD, PROGRAM, AND RECORDING MEDIUM - The present invention relates to an image processing device and method, a program, and a recording medium whereby the detection precision of a motion vector by the gradient method can be further improved. A counter value computing unit | 05-28-2009 |
| 20090167959 | IMAGE PROCESSING DEVICE AND METHOD, PROGRAM, AND RECORDING MEDIUM - The present invention relates to an image processing device and method, a program, and a recording medium whereby the evaluation regarding the reliability of a motion vector can be performed even in the case of an average brightness level between frames changing greatly. On a frame t+1, a block B | 07-02-2009 |
| 20090213937 | Image processing apparatus and method, program, and recording medium - A compensation allocation unit performs allocation compensation of a motion vector to a pixel to which a motion vector is not allocated by a victor allocation unit. A C/UC area determination unit compares magnitudes of a present DFD, a past DFD, and a future DFD based on a background vector and a DFD based on a compensation allocation vector by an evaluation value calculation unit to determine an area of a target pixel. Regarding the target pixel determined as the pixel in a covered area or an uncovered area, an interpolation method decision unit decides a computation method for a pixel value through which one of a double-sided interpolation and a one-sided interpolation. An interpolation frame generation unit computes the target pixel of the pixel value of the interpolation frame through the method decided by the interpolation method decision unit. | 08-27-2009 |
| 20100128171 | SIGNAL PROCESSING APPARATUS AND METHOD, PROGRAM, AND RECORDING MEDIUM - The present invention relates to a signal processing device and method, a program, and a recording medium configured so as to be able to detect 2-3 pulldown sequences, from various types of input, in a precise manner. A state estimation unit | 05-27-2010 |
