| Patent application number | Description | Published |
|---|
| 20080296712 | Assembling Two Substrates by Molecular Adhesion - The invention relates to an assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, said faces being located facing each other, at least one of the substrates having a surface topography, characterised in that the method comprises steps consisting of:
| 12-04-2008 |
| 20090095399 | METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES - A method for trimming a structure obtained by bonding a first wafer to a second waver on contact faces and thinning the first waver, wherein at least either the first wafer or the second wafer is chamfered and thus exposes the edge of the contact face of the first wafer, wherein the trimming concerns the first wafer. The method includes a) selecting the second wafer from among wafers with a resistance to a chemical etching planned in b) that is sufficient with respect to the first wafer to allow b) to be carried out; b) after bonding the first wafer to the second wafer, chemical etching the edge of the first wafer to form in the first wafer a pedestal resting entirely on the contact face of the second wafer and supporting the remaining of the first wafer; and c) thinning the first wafer until the pedestal is reached and attacked, to provide a thinned part of the first wafer. | 04-16-2009 |
| 20090162991 | PROCESS FOR ASSEMBLING SUBSTRATES WITH LOW-TEMPERATURE HEAT TREATMENTS - The invention relates to a process for producing a bond between a first and a second substrate ( | 06-25-2009 |
| 20090311477 | Compliant Substrate In Particular For Hetero-Epitaxial Depositing - The invention relates to a compliant substrate ( | 12-17-2009 |
| 20100081280 | METHOD OF PRODUCING A MIXED SUBSTRATE - The invention concerns a method of producing a mixed substrate, that is to say a substrate comprising at least one block of material different from the material of the substrate, the method comprising the following successive steps:
| 04-01-2010 |
