Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Moribayashi

Akira Moribayashi, Tokyo JP

Patent application numberDescriptionPublished
20100106818SYSTEM AND METHOD FOR MANAGING SYSTEM RESOURCES IN A NETWORK ENVIRONMENT - A method for managing system resources in a network environment. The method begins by reading from a first log timestamp T04-29-2010
20100138510SYSTEM AND METHOD FOR MANAGING SYSTEM RESOURCES IN A NETWORK ENVIRONMENT - A method for managing system resources in a network environment. The method begins by reading from a first log both timestamp T06-03-2010

Shigeru Moribayashi, Kanagawa JP

Patent application numberDescriptionPublished
20090010296Optical transceiver module and method for manufacturing same - An optical transceiver module and a method for manufacturing thereof, which are adopted for providing a reduced manufacturing cost and an improved signal quality, are achieved. The optical transceiver module 01-08-2009
20100239212OPTICAL MODULE - An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.09-23-2010
20100302543METHOD OF MANUFACTURING OPTICAL RECEIVER MODULE AND APPARATUS FOR MANUFACTURING THE SAME - The core adjusting process includes a procedure of searching for the position in which the photocurrent of the light-receiving element reaches its peak in each of the X-, Y-, and Z-directions. In the searching procedure, the light emitted from a multimode fiber of a MCP is gathered by a lens and is transmitted to the light-receiving element. A check is then made to determine whether, at in both directions of the search direction, there exist a first and second attenuation positions in which the photocurrent shows a predetermined attenuation relative to a peak value in a search range. If there exist the attenuation positions, a peak position is determined to be a position located within a second predetermined range from the middle point between the attenuation positions, and the relative positions of the receptacle and the CAN package are adjusted to the peak position.12-02-2010

Patent applications by Shigeru Moribayashi, Kanagawa JP

Toshiyuki Moribayashi, Osaka JP

Patent application numberDescriptionPublished
20090173770Lead-free solder alloy and electoronic component using this lead-free solder alloy - Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented.07-09-2009