Patent application number | Description | Published |
20130162115 | FLAT-TYPE VIBRATION MOTOR - There is provide a flat-type vibration motor capable of significantly reducing the generation of injection burrs during an injection molding process of an injection molding material, the flat-type vibration motor according to the present invention including: a rotor including a first substrate having a circuit pattern formed on a surface thereof and a holder coupled to the first substrate by injection molding; and a shaft including the rotor rotatably coupled thereto and forming a rotational axis of the rotor, wherein the circuit pattern may include a sealing pattern formed along an outline of the holder. | 06-27-2013 |
20130187503 | SINGLE PHASE INDUCTION VIBRATION MOTOR - There is provided a single phase induction vibration motor including: a bottom member having a shaft and a permanent magnet; a rotating member rotatably coupled to the shaft; a coil member disposed on the rotating member; and a magnetic member disposed on the rotating member to determine a stationary position of the rotating member, wherein the magnetic member is disposed to partially overlap with a region in which the permanent magnet is positioned, based on a horizontal surface of the rotating member. | 07-25-2013 |
20130342034 | LINEAR VIBRATOR - There is provided a linear vibrator including: a fixed part including a case open at one side thereof and providing an internal space therein and a bracket coupled to the case; a vibrating part disposed in the internal space and including a magnet having a hollow part and a mass body coupled to an outer peripheral surface of the magnet; an elastic member having one end coupled to the vibrating part and the other end coupled to the fixed part; a shaft having upper and lower portions fixed to one surface of the case and the bracket, respectively, and penetrating through the hollow part of the magnet; a coil provided on an outer peripheral surface of the shaft and generating electromagnetic force; and a bush disposed on the coil and concentrating the electromagnetic force generated therein in a single direction. | 12-26-2013 |
20140152148 | APPARATUS FOR GENERATING VIBRATIONS - There is provided an apparatus for generating vibrations including: a housing having an internal space; a direction changing member installed in the housing so as to be disposed in the internal space; a piezoelectric actuator including a piezoelectric element fixed to the direction changing member such that a horizontal deformation thereof is restrained, and deforming the direction changing member by a horizontal deformation thereof; and a vibrator fixed to the direction changing member and vertically displaced in a vertical direction according to a vertical deformation of the piezoelectric actuator. | 06-05-2014 |
Patent application number | Description | Published |
20140053170 | SPINDLE MOTOR AND DISK DRIVING DEVICE - There is provided a spindle motor for a 2.5″ type disk driving device, including: a base having a stator core seating part protruding upwardly in an axial direction; a stator core including a ring-shaped coreback part, a tooth part, and a front end part; and a coil wound around the stator core, wherein when a length of the stator core from an inner end portion of the coreback part to the endmost part of the front end part is defined as L and a height of the wound coil from the lowermost edge of the coil in an axial direction to the uppermost edge thereof is defined as H, a ratio (H/L) of the height of the wound coil to the length of the stator core in which back electromotive force (B-EMF) is 0.35 V/Krpm or more when the supply of power is stopped satisfies 0.524≦H/L≦0.703. | 02-20-2014 |
20140175913 | SPINDLE MOTOR - A spindle motor includes a stator including a base member having a stator core installed thereon; and a rotor including a rotor hub in which a driving magnet facing the stator core is installed. The rotor hub includes a disk-shaped body, a magnet mounting part extended from edge of the body in a downward axial direction and having the driving magnet installed on an inner surface thereof, and a disk support part extended from the magnet mounting part in radial direction. A magnetic center of the driving magnet is higher than that of the stator core in the axial direction in order to generate force directed in the downward axial direction through interaction with the stator core. The magnet mounting part includes a vortex generation suppressing part disposed on a lower edge portion thereof to decrease noise and vibrations generated by flow of air during rotation of the rotor hub. | 06-26-2014 |
20140175928 | SPINDLE MOTOR - There is provided a spindle motor including a stator including a base member in which a stator core is fixedly installed, and a rotor including a rotor hub in which a driving magnet disposed to face the stator core is installed, wherein the driving magnet is installed on a magnet mounting part provided in the rotor hub so that the magnetic center thereof in an axial direction is disposed in a position higher than that of the magnetic center of the stator core in the axial direction in order to generate force directed in a downward axial direction by interaction with the stator core, and the stator core is formed of a soft magnetic material and includes protrusion parts formed at a front end portion thereof disposed to face the driving magnet and extended therefrom in the axial direction. | 06-26-2014 |
Patent application number | Description | Published |
20090152121 | THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. | 06-18-2009 |
20140002226 | INDUCTOR AND METHOD OF MANUFACTURING THE SAME | 01-02-2014 |
20140034367 | EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg. | 02-06-2014 |
20140063427 | RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME - There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter. | 03-06-2014 |
20140077129 | EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg. | 03-20-2014 |
20140079924 | RESIN COMPOSITION FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING CORE LAYER AND PREPREG USING THE SAME - The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics. | 03-20-2014 |
20140106147 | PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties. | 04-17-2014 |
20140127483 | COPPER-CLAD LAMINATE. METHOD FOR MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed circuit board, a CCL manufactured by the method, and a printed circuit board having the CCL applied thereto, the method including: forming a first resin coated copper foil (first RCC foil) and a second resin coated copper foil (second RCC foil) by coating an insulating composition on one surface of each of two copper foils to form insulating layers, respectively, followed by drying of the first and second RCC foils; forming a copper-clad laminate (CCL) by laminating and pressing the first RCC foil and the second RCC foil while the insulating layers of the first and second RCC foils face each other and a glass fiber is placed therebetween; and hardening the copper-clad laminate. | 05-08-2014 |
20140147639 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD - Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature. | 05-29-2014 |
20150057393 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME - Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same. | 02-26-2015 |
20150060115 | COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients. | 03-05-2015 |
Patent application number | Description | Published |
20100178046 | CAMERA FLASH LENS AND PORTABLE DEVICE INCLUDING THE SAME - A camera flash lens for a plurality of light emitting diodes (LEDs) mounted on a board and serving as a light source of a camera flash, includes a plurality of annular lenses corresponding to the plurality of LEDs, respectively. The plurality of annular lenses each include an edge portion extending toward the board to reflect and collect light emitted from the edge of a corresponding LED of the plurality of LEDs, and a central portion having an inner surface with a Fresnel shape or a curved shape to collect light emitted from the top of the corresponding LED. | 07-15-2010 |
20120043896 | AC DRIVEN LIGHT EMITTING DEVICE - There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency. | 02-23-2012 |
20120233856 | APPARATUS FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided an apparatus and method for manufacturing a light emitting device package improved in terms of the reliability and process efficiency of a light emitting device. The apparatus includes a heating block including a recessed portion provided in an area in which a light emitting device package is disposed, and a protruding portion disposed within the recessed portion while corresponding to a recess formed in a lower surface of the light emitting device package; and a clamp disposed on a lead frame of the light emitting device package and fixing the lead frame and the light emitting device package to the heating block. | 09-20-2012 |
Patent application number | Description | Published |
20080217639 | Photonic crystal light emitting device using photon-recycling - A photonic crystal light emitting device including: a light emitting diode (LED) light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers; and a first photon-recycling light emitting layer formed on one surface of the first conductive semiconductor layer, opposite to the active layer, wherein the first photon-recycling light emitting layer absorbs a primary light emitted from the LED light emitting structure and emits a light having a different wavelength from that of the primary light, and a photonic crystal structure is formed on an entire thickness of the first photon-recycling light emitting layer. | 09-11-2008 |
20090087141 | Optical coupler - An optical coupler including: a substrate; a cladding layer formed on the substrate; and a slab waveguide formed on the cladding layer, wherein the slab waveguide comprises a first waveguide area on which a laser beam is incident and a second waveguide area having an incident surface capable of converging and outputting the laser beam passing through the first waveguide in a width direction. The optical coupler may optically couple one of an optical fiber and a laser diode with the slab waveguide, and more particularly, and a photonic crystal waveguide, with high efficiency. | 04-02-2009 |
20090133750 | SOLAR CELL - There is provided a solar cell including: a substrate; an energy absorption layer formed on the substrate and having a plurality of nanowire structures, each of the nanowire structures including an n-type semiconductor and a p-type semiconductor joined together; and n-type and p-type electrodes electrically connected to the n-type and p-type semiconductors, respectively. The solar cell exhibits high photoelectric efficiency due to pn junction of the nanowire structures. Further, the solar cell can absorb light falling within a substantially whole range of solar spectrum and does not require an epitaxial growth process, thereby overcoming drawbacks of an epitaxial layer such as crystal defect. | 05-28-2009 |
20090145477 | SOLAR CELL - There is provided a solar cell including: a substrate; and an energy absorption structure formed on the substrate, the energy absorption structure including a metal layer, a semiconductor layer and an insulator formed therebetween, wherein at least one of the metal layer, the semiconductor layer and the insulator is formed of a plurality of nanowire structures. The solar cell has the energy absorption structure formed of a nanowire MIS junction structure to ensure high photoelectric conversion efficiency. Further, the solar cell does not require an epitaxial growth, thereby free from drawbacks of an epitaxial layer such as crystal defects. | 06-11-2009 |
20100078624 | NANOWIRE LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The invention provides a nanowire light emitting device and a manufacturing method thereof. In the light emitting device, first and second conductivity type clad layers are formed and an active layer is interposed therebetween. At least one of the first and second conductivity type clad layers and the active layer is a semiconductor nanowire layer obtained by preparing a layer of a mixture composed of a semiconductor nanowire and an organic binder and removing the organic binder therefrom. | 04-01-2010 |
20100187498 | NANOWIRE LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The invention provides a nanowire light emitting device and a manufacturing method thereof. In the light emitting device, first and second conductivity type clad layers are formed and an active layer is interposed therebetween. At least one of the first and second conductivity type clad layers and the active layer is a semiconductor nanowire layer obtained by preparing a layer of a mixture composed of a semiconductor nanowire and an organic binder and removing the organic binder therefrom. | 07-29-2010 |
20100284125 | Nanowire capacitor and method of manufacturing the same - Provided is a method of manufacturing a nanowire capacitor including forming a lower metal layer on a substrate; growing conductive nanowires on the lower metal layer, the conductive nanowires including metal and transparent electrodes; depositing a dielectric layer on the lower metal layer including the grown conductive nanowires; growing dielectric nanowires on the deposited dielectric layer; and depositing an upper metal layer on the dielectric layer including the grown dielectric nanowires. | 11-11-2010 |
20110315957 | LIGHT EMITTING DEVICE - There is provided a light emitting device of a simpler structure, capable of ensuring a broad light emitting area and a high light emitting efficiency, while manufactured in a simplified and economically efficient process. The light emitting device including: a semiconductor layer; an active layer formed on the semiconductor layer, the active layer comprising at least one of a quantum well structure, a quantum dot and a quantum line; an insulating layer formed on the active layer; and a metal layer formed on the insulating layer. | 12-29-2011 |