Patent application number | Description | Published |
20120086123 | SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER CHANNEL - Semiconductor packages connecting a semiconductor chip to an external device by bumps are provided. The semiconductor packages may include a connection pad on a semiconductor chip, a connecting bump on and configured to be electrically connected to the connection pad and a supporting bump on the semiconductor chip and configured to be electrically isolated from the connection pad. The connection bump may include a first pillar and a first solder ball and the supporting bump may include a second pillar and a second solder ball. The semiconductor packages may further include a solder channel in the second pillar configured to allow a portion of the second solder ball to extend into the solder channel along a predetermined direction. | 04-12-2012 |
20120129333 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME - Provided are a method for manufacturing a semiconductor package and a semiconductor package manufactured using the method. The method includes providing a substrate having a first region and a second region having a higher step difference than the first region, i.e., having a difference in height, forming a mask pattern having a first opening exposing a portion of the first region and a second opening exposing a portion of the second region on the substrate, forming first and second bump material films filling the first and second openings, respectively, and forming the first and second bumps by performing a reflow process on the first and second bump material films, wherein the first opening has a lower portion having the same width with the second opening and a top portion having a width greater than the second opening. | 05-24-2012 |
20120295434 | SOLDER COLLAPSE FREE BUMPING PROCESS OF SEMICONDUCTOR DEVICE - A method of forming bumps of a semiconductor device with reduced solder bump collapse. The method includes preparing a semiconductor substrate in which pads are exposed externally from a passivation layer; forming a seed layer on the semiconductor substrate; forming a photoresist pattern to expose the seed layer on the pads; forming pillars by performing a primary electroplating on a region exposed by the photoresist pattern; forming a solder layer by performing a secondary electroplating on the pillars; removing the photoresist pattern; forming solder bumps, in which solders partially cover surfaces of the pillars, by performing a reflow process on the semiconductor substrate; and removing portions of the seed layer formed in regions other than the solder bumps. | 11-22-2012 |
20130009286 | SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME - A semiconductor chip includes stress-relief to mitigate the effects of differences in coefficients of thermal expansion (CTE) between a printed circuit board (PCB) and a semiconductor chip and a flip-chip package including the semiconductor chip. The semiconductor chip includes a stress-relief buffer coupling a bump and a semiconductor chip pad. | 01-10-2013 |
20130082090 | METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE - Methods of forming connection bumps for semiconductor devices in which rewiring patterns are formed. The method includes preparing a semiconductor substrate on which a pad is partially exposed through a passivation film, forming a seed layer on the pad and passivation film, forming a photoresist pattern including an opening pattern comprising a first opening that exposes a portion of the seed layer on the pad and a second opening that exposes a portion of the seed layer on the passivation film and is separated from the first opening, performing a first electroplating to form filler layers in the opening patterns, performing a second electroplating to form a solder layer on the filler layers, removing the photoresist pattern and performing a reflow process to form a collapsed solder layer that electrically connects the filler layers to each other and a solder bump on the filler layer formed in the second opening. | 04-04-2013 |
20130256876 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion. | 10-03-2013 |
20130292822 | BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AND METHOD OF FORMING THE BUMP STRUCTURE - A bump structure includes a first bump and a second bump. The first bump is disposed on a connection pad of a substrate. The first bump includes a lower portion having a first width, a middle portion having a second width smaller than the first width, and an upper portion having a third width greater than the second width. The second bump is disposed on the upper portion of the first bump. | 11-07-2013 |
20140084457 | BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF FORMING THE SAME - A bump structure may include a body portion spaced apart from a pad disposed on a substrate and a first extension extending from a side of the body portion onto the pad. A second extension extends from another side of the body portion. | 03-27-2014 |
20140151845 | SEMICONDUCTOR DEVICE HAVING FUSE PATTERN - A semiconductor device has improved reliability by preventing a fuse cut through a repair process from being electrically reconnected by electrochemical migration. The semiconductor device includes a substrate, a fuse including a first fuse pattern and a second fuse pattern formed at the same level on the substrate, the first fuse pattern and the second fuse pattern being spaced a first width apart from each other such that a gap in the fuse is disposed at a first location between the first fuse pattern and the second fuse pattern, and a first insulation layer formed on the first fuse pattern and the second fuse pattern, the first insulation layer including an opening above the first location and having a second width smaller than the first width. | 06-05-2014 |
20140377909 | SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FABRICATING THE SAME - Semiconductor packages having through electrodes and methods for fabricating the same are provided. The method may comprise providing a first substrate including a first circuit layer, forming a front mold layer on a front surface of the first substrate, grinding a back surface of the first substrate, forming a first through electrode that penetrates the first substrate to be electrically connected to the first circuit layer, providing a second substrate on the back surface of the first substrate, the second substrate including a second circuit layer that is electrically connected to the first through electrode, forming a back mold layer on the back surface of the first substrate, the back mold layer encapsulating the second substrate, and removing the front mold layer. | 12-25-2014 |
Patent application number | Description | Published |
20090141151 | Dynamic range enhancement method and apparatus - A dynamic range enhancement method and apparatus for an imaging device expands a dynamic range of an input image without an associated increase in the amount of image calculations. The dynamic range enhancement method includes producing brightness information and color information from an input image; applying gamma correction and inverse gamma correction to the brightness information to produce a gamma corrected image and an inverse gamma corrected image; comparing variances of the gamma corrected image and the inverse gamma corrected image at identical spots; and expanding a dynamic range of the input image by selecting one of the variances at each spot. The dynamic range of an input image is expanded by applying a post imaging process without increasing calculation amount of the imaging device. | 06-04-2009 |
20090207274 | Apparatus and method for adjusting white balance in a digital imaging device - A method and apparatus for adjusting a white balance in a digital imaging device. The method including the steps of: analyzing a histogram of an image to which a white balance algorithm is to be applied; classifying the image, to which the white balance algorithm is to be applied, according to color distribution determination criteria; and the white balance algorithm is applied to the image in a customized manner based on results of the classification based on color distributions. The apparatus includes an image sensor unit for photographing a subject and for creating an original image; and an image processing unit for finding an achromatic color region through estimation of a color temperature of the original image, for extracting a white point of the achromatic color region, and for adjusting a white balance of the original image. | 08-20-2009 |
20100027886 | METHOD AND APPARATUS FOR ELIMINATING CHROMATIC ABERRATION - A method and apparatus for eliminating chromatic aberration; in an embodiment, only the chrominance signal is filtered in the luminance/chrominance coordinates so as to eliminate the chromatic aberration so that the chromatic aberration can be eliminated regardless of a property of a lens. In addition, there are advantages in not only eliminating the chromatic aberration but also preventing resolution of the original image from being damaged. | 02-04-2010 |
20100110238 | METHOD AND APPARATUS FOR CANCELING CHROMATIC ABERRATION - Provided are a method and apparatus for canceling chromatic aberration. In the method, only chrominance signals are filtered using an asymmetrical mask according to the characteristics of chromatic aberration occurring from among a luminance/chrominance coordinates system. Accordingly, it is possible to cancel chromatic aberration regardless of the characteristics of a lens and prevent the resolution of the original image from degrading. | 05-06-2010 |
20110007969 | METHOD AND APPARATUS FOR CORRECTING LENS SHADING - A lens shading correction method and apparatus are provided for removing vignetting occurring in digital images due to lens shading. A white image captured by an image pickup device and an image pickup unit is separated into reference white images corresponding to color channels. A vignetting center having a maximum light intensity is estimated in each of the reference white images. Multiple reference segments on each of the reference white images are defined. A lens shading correction value corresponding to each pixel constituting the reference segments are calculated using a corresponding light intensity. A lens shading correction function corresponding to each reference segment is derived using a corresponding lens shading correction value. Vignetting of a general image received in a general image processing mode is removed, using the derived multiple lens shading correction functions. | 01-13-2011 |
20110096237 | APPARATUS AND METHOD FOR COLOR ROLLING SUPPRESSION - An apparatus and method for suppressing color rolling are provided. The apparatus includes a digital signal processor which detects first motion information on a current frame and second motion information on at least one of a plurality of neighboring frames, calculates a gain based on the first and second motion information, and applies the gain to at least one channel of the current frame. | 04-28-2011 |
20110188772 | IMAGE SCALING METHOD AND APPARATUS WITH ENHANCEMENT OF IMAGE QUALITY - An image scaling apparatus and method, with enhancement of image quality. The method includes generating a plurality of intermediate pixels positioned near a plurality of resultant pixels to be generated to scale an input image using pixels of the input image; determining the image characteristics of the plurality of resultant pixels using a predetermined region of the input image or the plurality of intermediate pixels within the predetermined region; determining a filter for generating the plurality of resultant pixels based on the image characteristics with respect to the resultant pixels, and generating the plurality of resultant pixels through filtering of the plurality of intermediate pixels using the determined filter. The apparatus includes an intermediate pixel generation unit which generates a plurality of intermediate pixels. A filter determination unit determines a filter for generating the plurality of resultant pixels. A resultant pixel generation unit generates the plurality of resultant pixels. | 08-04-2011 |
20120281122 | METHOD AND APPARATUS FOR CANCELING CHROMATIC ABERRATION - Provided are a method and apparatus for canceling chromatic aberration. In the method, only chrominance signals are filtered using an asymmetrical mask according to the characteristics of chromatic aberration occurring from among a luminance/chrominance coordinates system. Accordingly, it is possible to cancel chromatic aberration regardless of the characteristics of a lens and prevent the resolution of the original image from degrading. | 11-08-2012 |
20120321200 | METHOD AND APPARATUS FOR GENERATING SUPER-RESOLUTION IMAGE USING PREDICTION AND STABILIZATION OF HIGH-FREQUENCY INFORMATION OF IMAGE - Image restoration by restoring a high-frequency component of a deteriorated image. A high-frequency image information predicting and stabilizing method includes: determining a shooting area, which is a high-frequency area that includes an overly-restored high-frequency component, in an input image; predicting a high-frequency component of the input image by applying different deterioration models to the shooting area and a remaining area in the input image; and stabilizing a high-frequency component of an edge area by using an edge blur kernel determined to be parallel to an edge direction of the input image. | 12-20-2012 |
20130039573 | DEVICE AND METHOD OF REMOVING CHROMATIC ABERRATION IN IMAGE - A device and method of removing chromatic aberration which occurs in an image generated by capturing a target subject. The chromatic aberration removing device includes a chromatic aberration region detecting unit which detects a chromatic aberration occurrence region in an input image, a coefficient calculating unit which calculates a minimizing pixel value which minimizes a difference between sizes, numbers of pixels or intensities of edges of red, green, and blue (RGB) channels of the chromatic aberration occurrence region, a chroma signal processing unit which removes chromatic aberration in the chromatic aberration occurrence region, and a purple fringing removing unit which removes purple fringing. | 02-14-2013 |
20130242198 | METHOD AND APPARATUS FOR REDUCING NOISE OF VIDEO - A method and apparatus for reducing noise of a video image are provided. The method includes: reducing noise in a difference between a current frame and a previous frame in which temporal noise is reduced; detecting motion information about the current frame based on the difference in which the noise is reduced; reducing temporal noise in the current frame via a weighted sum of the current frame and the previous frame in which the temporal noise is reduced, according to the motion information; and reducing spatial noise in the current frame based on an edge direction of the current frame in which the temporal noise is reduced. | 09-19-2013 |
20140152838 | METHOD AND APPARATUS FOR PROCESSING IMAGE - Exemplary embodiments disclose a method of processing an image. The method includes: offsetting aliasing by analyzing frequency characteristics of at least one color channel and a NIR channel, of a MSFA pattern image; generating a high resolution base image; and offsetting an artifact from the high resolution base image by weighting the high resolution base image and a blur image, based on a pixel difference value between the blur image and the high resolution base image. | 06-05-2014 |
20140153820 | IMAGE PROCESSING APPARATUS AND METHOD OF PROCESSING IMAGE - Provided is an image processing apparatus that can effectively display an image by using an optimized dynamic range compression technique and a method of processing an image by using the same. The method includes: obtaining a first blurred image and a second blurred image from the input image; estimating illuminance of the input image by combining the first blurred image and the second blurred image; generating a dark region amplified image from the input image; generating a bright region conserved image from the input image; applying weights to the dark region amplified image and the bright region conserved image, respectively, according to the estimated illuminance; and combining the weighted dark region amplified image and the weighted bright region conserved image to generate a final image. | 06-05-2014 |
20140153823 | METHOD AND APPARATUS FOR PROCESSING IMAGE - An image processing apparatus includes an adaptive interpolation device which converts a MFA pattern image into a quincuncial pattern image based on difference values, and interpolates color channels and an NIR channel, based on difference values of the converted quincuncial pattern image in vertical and horizontal pixel directions; a frequency compensation device which obtains a high-resolution MFA image using high-frequency and medium-frequency components of a high-resolution base image, based on linear regression analysis and compared energy levels of MFA channel images to an energy level of a base image; and a channel interference suppression device which removes color distortion generated between each channel of the high-resolution MFA image, and another channel of the high-resolution MFA image and a base channel using a weighted average of pixel value differences between each channel of the high-resolution MFA image, and the other channel of the high-resolution MFA image and the base channel. | 06-05-2014 |
20140169671 | APPARATUS AND METHOD FOR COLOR RESTORATION - Provided is a method and apparatus for restoring color of an input image. The method includes: separating multiple band information of a near infrared (NIR) channel from information of the input image by using a correlation between a color channel and the NIR channel in the input image; obtaining estimated invisible light band information of the NIR channel from the multiple band information of the NIR channel and estimated multiple band information of the NIR channel which is estimated from the color channel; estimating invisible light band information of the color channel based on the estimated invisible light band information of the NIR channel; and restoring a visible light band image of the color channel by removing the estimated invisible light band information of the color channel from multiple band information of the color channel included in the information of the input image. | 06-19-2014 |