Patent application number | Description | Published |
20090152015 | SUPERABRASIVE MATERIALS AND COMPACTS, METHODS OF FABRICATING SAME, AND APPLICATIONS USING SAME - Embodiments of the present invention relate to superabrasive materials, superabrasive compacts employing such superabrasive materials, and methods of fabricating such superabrasive materials and compacts. One or more embodiments of a superabrasive material include a plurality of first superabrasive regions characteristic of being formed at least partially from a plurality of agglomerates, with each first superabrasive region including a plurality of first superabrasive grains that exhibit a first average grain size, and a matrix through which the plurality of first superabrasive regions is dispersed. The matrix includes a plurality second intercrystalline-bonded superabrasive grains that exhibit a second average grain size. The superabrasive material exhibits one or more of the following characteristics: (1) the first average grain size being less than that of the second average grain size; (2) the plurality of first superabrasive regions exhibiting a selectivity to be preferentially removed from the matrix; or (3) a thermal stability of the plurality of first superabrasive regions being greater than that of the matrix. | 06-18-2009 |
20090152018 | POLYCRYSTALLINE DIAMOND COMPACTS, AND RELATED METHODS AND APPLICATIONS - Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating such PDCs. In an embodiment of a “two-step” manufactured PDC, a PDC includes a substrate and a pre-sintered polycrystalline diamond (“PCD”) table bonded to the substrate. The pre-sintered PCD table includes bonded diamond grains defining interstitial regions. At least a portion of the interstitial regions include at least one material disposed therein selected from a silicon-cobalt alloy, silicon carbide, cobalt carbide, or a mixed carbide of silicon and cobalt. The pre-sintered PCD table lacks an intermediate contaminant region therein that includes at least one type of fabrication by-product generated during the fabrication of the pre-sintered PCD table. | 06-18-2009 |
20100212971 | Polycrystalline Diamond Compact Including A Cemented Tungsten Carbide Substrate That Is Substantially Free Of Tungsten Carbide Grains Exhibiting Abnormal Grain Growth And Applications Therefor - Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table that is substantially free of defects formed due to abnormal grain growth of tungsten carbide grains, and methods of fabricating such PDCs. In an embodiment, a PDC comprises a cemented tungsten carbide substrate including an interfacial surface that is substantially free of tungsten carbide grains exhibiting abnormal grain growth, and a PCD table bonded to the interfacial surface of the cemented tungsten carbide substrate. The PCD table includes a plurality of bonded diamond grains defining a plurality of interstitial regions. At least a portion of the interstitial regions includes a metal-solvent catalyst disposed therein. The PCD table may be substantially free of chromium or the PCD table and the cemented tungsten carbide substrate may each include chromium. | 08-26-2010 |
20110259648 | POLYCRYSTALLINE DIAMOND COMPACT AND METHOD OF MAKING SAME - A polycrystalline diamond compact includes a substrate and a polycrystalline diamond table attached to the substrate. The polycrystalline diamond table includes an upper surface and at least one peripheral surface. Diamond grains of the polycrystalline diamond table define a plurality of interstitial regions. The polycrystalline diamond table includes a region having silicon carbide positioned within at least some of the interstitial regions thereof. In an embodiment, the first region extends over only a selected portion of the upper surface and/or at least a portion of the at least one peripheral surface. In another embodiment, the first region substantially contours the upper surface and a chamfer. | 10-27-2011 |
20120000136 | METHODS OF FABRICATING A POLYCRYSTALLINE DIAMOND STRUCTURE - In an embodiment, a method of fabricating a polycrystalline diamond structure includes forming an assembly including a sintered polycrystalline diamond body positioned between an aluminum-containing layer and a substrate. The method further includes subjecting the assembly to a high-pressure/high-temperature process to form the polycrystalline diamond structure including a polycrystalline diamond table bonded to the substrate. | 01-05-2012 |
20130156357 | BEARING ASSEMBLIES, APPARATUSES, AND MOTOR ASSEMBLIES USING THE SAME - Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements. | 06-20-2013 |
20130313027 | POLYCRYSTALLINE DIAMOND COMPACT - In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table having an upper surface, an interfacial surface, and at least one side surface extending therebetween. The interfacial surface of the polycrystalline diamond table is bonded to the substrate. The polycrystalline diamond table includes bonded diamond grains defining interstitial regions. The polycrystalline diamond table includes a first region extending inwardly from at least a portion of the upper surface and at least a portion of the at least one side surface. The first region spaced from the interfacial surface. The polycrystalline diamond table includes at least a second region extending inwardly from the interfacial surface to the upper surface. The first region includes at least a first infiltrant disposed interstitially between the bonded diamond grains thereof. The second region includes at least a second infiltrant disposed interstitially between the bonded diamond grains thereof. | 11-28-2013 |
20140069022 | METHODS OF FABRICATING POLYCRYSTALLINE DIAMOND COMPACTS - Embodiments relate to methods of manufacturing polycrystalline diamond compacts (“PDCs”). In an embodiment, a method of fabricating a PDC includes positioning a plurality of diamond particles adjacent to a cemented carbide material. The cemented carbide material includes one or more types of tungsten-containing eta phases. The method further includes subjecting the plurality of diamond particles and the cemented carbide material to a high-pressure/high-temperature process effective to sinter the plurality of diamond particles so that a polycrystalline diamond table is formed without tungsten carbide grains of the cemented carbide material exhibiting abnormal grain growth that project into the polycrystalline diamond table. | 03-13-2014 |
20140115971 | POLYCRYSTALLINE DIAMOND COMPACTS AND RELATED METHODS - Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs. | 05-01-2014 |
20140318027 | METHODS OF MAKING POLYCRYSTALLINE DIAMOND COMPACTS - A polycrystalline diamond compact includes a substrate and a polycrystalline diamond table attached to the substrate. The polycrystalline diamond table includes an upper surface and at least one peripheral surface. Diamond grains of the polycrystalline diamond table define a plurality of interstitial regions. The polycrystalline diamond table includes a region having silicon carbide positioned within at least some of the interstitial regions thereof. In an embodiment, the first region extends over only a selected portion of the upper surface and/or at least a portion of the at least one peripheral surface. In another embodiment, the first region substantially contours the upper surface and a chamfer. | 10-30-2014 |
20140339879 | ROAD-REMOVAL SYSTEM EMPLOYING POLYCRYSTALLINE DIAMOND COMPACTS - Embodiments disclosed herein are directed to a system for removing road material. In an embodiment, the system may include a milling drum and at least one pick mounted on the milling drum. The pick may include polycrystalline diamond at least partially forming one or more working surfaces of the pick. | 11-20-2014 |
20140339883 | SHEAR CUTTER PICK MILLING SYSTEM - This disclosure relates to a system for removing road material. In an embodiment, the system may include a milling drum and at least one pick mounted on the milling drum. Furthermore, the pick may include polycrystalline diamond at least partially forming one or more working surfaces of the pick. | 11-20-2014 |
20140367176 | POLYCRYSTALLINE DIAMOND COMPACTS WITH PARTITIONED SUBSTRATE, POLYCRYSTALLINE DIAMOND TABLE, OR BOTH - Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition. | 12-18-2014 |
20140367177 | POLYCRYSTALLINE DIAMOND COMPACTS WITH PARTITIONED SUBSTRATE, POLYCRYSTALLINE DIAMOND TABLE, OR BOTH - Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed. | 12-18-2014 |