Patent application number | Description | Published |
20080220290 | Magnetic recording medium and manufacturing method for the same - To provide a magnetic recording medium manufacturing method capable of transferring a pattern that can serve as a source for forming anodized alumina-nanoholes with high precision and realizing high productivity, and a large-capacity magnetic recording medium capable of achieving high density recording. The method includes forming a metallic layer on a concavo-convex pattern formed on a surface of a mold; bonding a substrate using an adhesive to a surface of the metallic layer on the side opposite to the mold; separating the mold from the metallic layer; forming, through nanohole formation treatment, a porous layer in which a plurality of nanoholes are formed to orient in a direction substantially perpendicular to a substrate plane by using as a nanohole source a concavo-convex pattern which has been formed by transferring the concavo-convex pattern in the mold to the metallic layer; and charging a magnetic material inside the nanoholes. | 09-11-2008 |
20080292805 | METHOD FOR MANUFACTURING STAMPER, METHOD FOR MANUFACTURING NANOHOLE STRUCTURE, AND METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM - According to an aspect of an embodiment, a method for manufacturing a stamper for duplicating a pit pattern on a substrate includes forming on another substrate, a layer of a material insoluble to a liquid of a suspension of particles in a pattern having a plurality of land portions and a plurality of groove portions between the land portions, and dipping the another substrate having the layer of the material having the pattern in the liquid of the suspension of the particles so that the particles are adhered to the groove portions. The-method further includes forming a mold having a plurality of pits corresponding to the particles by transferring the shapes of the particles on the another substrate to the mold, and forming a stamper having a plurality of protrusions corresponding to the pits by transferring the shapes of the pits of the molds to the stamper. | 11-27-2008 |
20090042392 | Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing apparatus is configured to simultaneously polish both surfaces of a work and includes a sun gear provided around a rotational axis of one of a pair of polishing surfaces, a carrier having a hole configured to house the work, and including teeth so as to serve as a planetary gear which rotates and revolves around the sun gear, and a first dustproof mechanism that includes a first elastic member that contacts one surface of the carrier opposite to one of the polishing surfaces between the sun gear and the hole in the carrier. | 02-12-2009 |
20090042486 | Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing method configured to simultaneously polish both surfaces of a work includes the steps of inserting the work into a hole in a carrier and fixing the work with a fixing member, attaching the carrier to a polishing apparatus, polishing both surfaces of the work simultaneously, and detaching the carrier from the polishing apparatus after the polishing step, and attaching the carrier to an immediate cleaning apparatus. | 02-12-2009 |
20090042487 | Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units configured to detect rotation rates of the stools, a pressurizing unit configured to compress the work between the pair of the stools, a slurry supply unit configured to supply a slurry to the stool, and a control unit configured to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stool, and a supply amount of the slurry supplied by the slurry supply unit. | 02-12-2009 |
20090045550 | TRANSCRIPTION MOLD FIXATION APPARATUS AND SUBSTRATE REMOVING METHOD - According to an aspect of an embodiment, a transcription mold fixation apparatus includes a support base, a magnet, a pin, and a regulating mechanism. The support base receives, on a surface thereof, a transcription mold having a center hole formed therein and containing a magnetic material, and the support base has a through hole aligned to the center hole. The magnet is incorporated in the support base, and fixes the transcription mold to the surface of the support base. The pin extends through the through hole. The regulating mechanism causes the magnet to be spaced apart from the magnetic material. | 02-19-2009 |
20090075574 | Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method - A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole. | 03-19-2009 |
20090127224 | METHOD OF PRODUCING A NANO-STRUCTURE AND METHOD OF PRODUCING A MAGNETIC RECORDING MEDIUM - According to an aspect of an embodiment, a manufacturing method for a nano-structure comprises the steps of: arranging nano-particles on a substrate having a surface provided with a projecting pattern and a recessing pattern; forming cavities under the nano-particles; and polishing the surfaces in which the cavities are formed. | 05-21-2009 |
20090206513 | METHOD OF MANUFACTURING MOLDED PRODUCT AND METHOD OF MANUFACTURING STORAGE MEDIUM - A method of manufacturing a molded product includes forming a coat film for covering and concealing particles with the surface of a board while filling the gaps among the particles, and separating the coat film for holding the particles on the reverse side from the board. The coat film and the particles are etched from the reverse side of the separated coat film, the particles are removed from the coat film, and an array of dents carved by the particles is formed on the reverse side of the coat film. A film is formed on the reverse side of the coat film, and a molded product having an array of protrusions on the surface is formed from the film. | 08-20-2009 |
20090218718 | MANUFACTURING METHOD FOR A MOLD - According to an aspect of an embodiment, a manufacturing method for a mold includes a step of forming a protection film having fluidity on a front surface of a base material on which concave/convex patterns are partitioned, and a step of punching a mold from the base material by causing a male mold to come into a female mold while overlapping a punching surface of the male mold on a back surface of the base material. | 09-03-2009 |
20110041879 | CLEANING APPARATUS AND CLEANING METHOD - A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object. | 02-24-2011 |
20110240059 | CLEANING APPARATUS AND METHOD - A cleaning apparatus includes a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned, an agitator to induce agitation in the cleaning solution supplied to the object, an oscillating unit to oscillate the agitator, a drive unit to move any one of the object and the agitator so as to change a clearance between the object and the agitator, a detection unit to detect impedance of the oscillator, and a control unit to control the clearance by controlling the drive unit based on the impedance. | 10-06-2011 |
20120031592 | ELECTRONIC COMPONENT REPAIR METHOD, ELECTRONIC COMPONENT REPAIR DEVICE, AND HEAT TRANSFER PLATE - An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating. | 02-09-2012 |
20120060356 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component. | 03-15-2012 |
20120090195 | APPARATUS AND METHOD FOR HEATING ELECTRONIC COMPONENT - An apparatus for heating an electronic component, the apparatus includes a table on which a printed board is placed, a heating head having a contact surface that comes into contact with the upper surface of a rectangular electronic component mounted on the upper surface of the printed board, a discharge portion that jets heated air; and a first passage that guides the air discharged from the discharge portion to the four vertexes of the electronic component. | 04-19-2012 |