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Mitsuhiro Nakao
Mitsuhiro Nakao, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090206435 | Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging device - A method of manufacturing a solid state imaging device having photoelectric conversion devices, the method including: 1) forming a plurality of color filters differing in color from each other, 2) forming a transparent resin layer on the color filters, 3) forming an etching control layer on the transparent resin layer, the etching control layer being enabled to be etched at a different etching rate from the etching rate of the transparent resin layer, 4) forming a lens master on the etching control layer by using a heatflowable resin material, 5) transferring a pattern of the lens master to the etching control layer by dry etching to form an intermediate micro lens, and 6) transferring a pattern of the intermediate micro lens to the transparent resin layer by dry etching to form the transfer lenses. | 08-20-2009 |
| 20100261303 | Manufacturing method for solid state image pickup device - A method of manufacturing a solid state image pickup device including photoelectric conversion elements which are two-dimensionally arranged in a semiconductor substrate, and a color filter having a plurality of color filter patterns differing in color from each other and disposed on a surface of the semiconductor substrate according to the photoelectric conversion elements. The method includes successively subjecting a plurality of filter layers differing in color from each other to a patterning process to form the plurality of color filter patterns. At least one color filter pattern to be formed at first among the plurality of color filter patterns is formed by dry etching, and the rest of the plurality of the color filter pattern is formed by photolithography. | 10-14-2010 |
Mitsuhiro Nakao, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20100139308 | Damper, Air Conditioning Unit and Vehicular Air Conditioning System - Provided are a damper in which strange sound (whistling sound) generated when the damper has a small opening degree is suppressed, an air conditioning unit, and an air conditioner for vehicle. The damper has a wall surface ( | 06-10-2010 |
| 20100163209 | Air Conditioning Unit and Vehicle Air Conditioning Apparatus - An air conditioning unit capable of suppressing a low frequency noise and a vehicle air conditioning apparatus are provided. The air conditioning unit includes a fan ( | 07-01-2010 |
| 20100226766 | Centrifugal Blower - It is intended to provide a centrifugal blower capable of suppressing the generation of noise including periodic noise that is caused by interference between a tongue and an impeller. The centrifugal blower is provided with an impeller ( | 09-09-2010 |
Mitsuhiro Nakao, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080231518 | Antenna device and radio communication device - First and second wires are formed so that the further away from a semiconductor chip, the greater the distance between the first and second wires. This prevents currents flowing through the first and second wires from cancelling out each other, and further enables a metallic plate to be disposed as far away from the semiconductor chip as possible. In addition, configuring the metallic plate to have a constant width that is wider than the diameters of the first and second wires results in a wide connection range, thereby ensuring connection even when mounting misalignments occur between the wires and the metallic plate. | 09-25-2008 |
| 20080237863 | Semiconductor device and manufacturing method of semiconductor device - A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided. | 10-02-2008 |
| 20100181367 | WIRE BONDING APPARATUS AND WIRE BONDING METHOD - A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire | 07-22-2010 |
Mitsuhiro Nakao, Kanagawa-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20100096437 | BONDING METHOD - A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load. | 04-22-2010 |