Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Mitsuhiro Iwata
Mitsuhiro Iwata, Annaka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110071236 | Method for reducing a surface glossiness of an organopolysiloxane-cured article - A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., and a particle size of up to 200 μm, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface. | 03-24-2011 |
Mitsuhiro Iwata, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100062211 | EPOXY RESIN COMPOSITION FOR FIBER REINFORCED COMPOSITE MATERIAL - The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a | 03-11-2010 |
Mitsuhiro Iwata, Nara-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090101064 | Droplet Applying Apparatus - The droplet applying apparatus includes a base | 04-23-2009 |
| 20090219311 | Droplet Applying Apparatus, Method for Measuring Gap of Droplet Ejecting Section and Method for Adjusting Gap of Droplet Ejecting Section - A droplet applying apparatus includes a base | 09-03-2009 |
Mitsuhiro Iwata, Kanagawa-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090068395 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL - Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin composition for use in a self-adhesive prepreg for a face sheet of a honeycomb panel. The epoxy resin composition enables to increase self-adhesiveness of the prepreg, while improving workability and appearance quality of the prepreg. The epoxy resin composition is characterized by containing an epoxy resin (A) which is in a liquid state at room temperature; a thermoplastic resin (B) which dissolves in the epoxy resin (A) at a temperature not less than 90° C.; thermosetting resin particles (C) which do not completely dissolve in the epoxy resin (A) at a temperature less than 90° C. and has a softening point of not less than 120° C.; and a curing agent (D). | 03-12-2009 |
| 20090098335 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL - Provided is an epoxy resin composition for fiber-reinforced composite materials, which is improved in toughness necessary for improving the strength of self-adhesion of a matrix resin for use in a prepreg for a face sheet of a honeycomb panel. The epoxy resin composition, which comprises: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D), is characterized in that the epoxy resin composition after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases. | 04-16-2009 |
| 20090130379 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL - Provided is an epoxy resin composition for fiber-reinforced composite materials, which serves as a matrix resin for a prepreg. This epoxy resin composition is improved in tackiness stability during storage, while maintaining mechanical characteristics. The epoxy resin composition for fiber-reinforced composite materials is characterized by containing 25 to 50 parts by weight of an amine curing agent (B) selected from aliphatic polyamines, alicyclic polyamines and aromatic polyamines, and 1 to 20 parts by weight of an organic acid dihydrazide compound (C) having a melting point of not less than 150° C., per 100 parts by weight of an epoxy resin (A). | 05-21-2009 |
Mitsuhiro Iwata, Takasaki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090020213 | SILICONE RUBBER COMPOSITION FOR SEALING STITCHED AIR BAG - A silicone rubber composition for sealing a stitched air bag, wherein the composition exhibits excellent adhesion to cured silicone rubber. A silicone rubber composition for sealing a stitched air bag, in which the composition is used as a sealing material at those sections of a silicone rubber-treated base fabric that are superimposed with the treated surfaces facing each other and then stitched together to form a bag shape during formation of the air bag, and comprises: | 01-22-2009 |
Mitsuhiro Iwata, Ehime JP
| Patent application number | Description | Published |
|---|---|---|
| 20110221878 | INTRAORAL CAMERA - The intraoral camera of the present invention comprises a main body case ( | 09-15-2011 |
Mitsuhiro Iwata, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110239678 | Flare nut and refrigerant pipe set, air conditioner, and freezer including the same - A flare nut includes a nut main body having a outer surface and a circular cylinder portion provided so as to extend from the nut main body to one opening end of an insertion hole along the insertion hole in a circular cylindrical shape having a major diameter smaller than the nut main body. | 10-06-2011 |