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Misra, CA
Karan Misra, Mountain View, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120131474 | Switching of Emails in a Conversation Thread - A method is disclosed for rendering messages in an email application on a client computer. A plurality of email messages is received from a server computer, including a first email message, a second email message and a third email message. The first email message is rendered on the client computer with a first conversation icon that identifies the first email message as being part of an email conversation thread. When the first conversation icon is selected on the first email message, a view is rendered showing one or more email messages in the conversation thread. When the second email message is selected, the second email message is rendered on the client computer with a second conversation icon. When the second conversation icon is selected on the second email message, the view showing the one or more email messages in the conversation thread is rendered. | 05-24-2012 |
| 20120167009 | COMBINING TIMING AND GEOMETRY INFORMATION FOR TYPING CORRECTION - Techniques to automatically correct or complete text are disclosed. A string and keystroke timing information associated with entry of the string, for example via an input device such as a keyboard, are received. A word to suggest as a correction or completion of the string is determined based at least in part on the keystroke timing information. | 06-28-2012 |
Nilendu Misra, Mountain View, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120197726 | METHOD AND SYSTEM FOR SUGGESTING SERVICES TO A USER - A method for presenting a vendor selection to a user of a mobile device, including receiving a notification that a first telephone call is initiated by the user of the mobile device to a telephone number for a vendor; while the first telephone call is active and prior to placing an order with the vendor: extracting a set of matching data for the vendor using the telephone number for the vendor, selecting at least one suggested vendor associated with an offer using a set of matching parameters and the set of matching data, generating a message comprising the vendor and the at least one suggested vendor with the offer; and presenting the message to the user of the mobile device, terminating, prior to placing the order, the first telephone call to the vendor, and initiating a second telephone call to the at least one suggested vendor based on the offer. | 08-02-2012 |
Nipun Misra, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120043023 | SYMMETRIC VHF SOURCE FOR A PLASMA REACTOR - The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution. | 02-23-2012 |
Pranob Misra, Stanford, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120103403 | MULTI-JUNCTION SOLAR CELL WITH DILUTE NITRIDE SUB-CELL HAVING GRADED DOPING - A lattice-matched solar cell having a dilute nitride-based sub-cell has exponential doping to thereby control current-carrying capacity of the solar cell. Specifically a solar cell with at least one dilute nitride sub-cell that has a variably doped base or emitter is disclosed. In one embodiment, a lattice matched multi junction solar cell has an upper sub-cell, a middle sub-cell and a lower dilute nitride sub-cell, the lower dilute nitride sub-cell having doping in the base and/or the emitter that is at least partially exponentially doped so as to improve its solar cell performance characteristics. In construction, the dilute nitride sub-cell may have the lowest bandgap and be lattice matched to a substrate, the middle cell typically has a higher bandgap than the dilute nitride sub-cell while it is lattice matched to the dilute nitride sub-cell. The upper sub-cell typically has the highest bandgap and is lattice matched to the adjacent sub-cell. In further embodiments, a multi junction solar cell according to the invention may comprise four, five or more sub-cells in which the one or more sub-cells may each comprise exponentially doped dilute nitride alloys. | 05-03-2012 |
Pranob Misra, Milpitas, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110232730 | LATTICE MATCHABLE ALLOY FOR SOLAR CELLS - An alloy composition for a subcell of a solar cell is provided that has a bandgap of at least 0.9 eV, namely, Ga | 09-29-2011 |
Rajeev Kumar Misra, Foster City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100131937 | OPTIMIZATION HINTS FOR A BUSINESS PROCESS FLOW - In one embodiment, an optimization hint may be included in a business process flow. An executable process may be generated from the business process flow where the optimization hint is included in the executable process. While executing the executable process, the runtime engine encounters an optimization hint and determines an optimization to perform. The optimization hint may be related to an aspect of a business process being orchestrated by the business process flow. The optimization is then performed while executing the executable process. For example, the runtime engine may start pre-processing the branch while the condition is being evaluated. If the condition evaluates such that the pre-processed branch should be executed, then the runtime engine has already started processing of that branch. The processing is thus optimized in that the runtime engine is not sitting idle while waiting for the condition to be evaluated. | 05-27-2010 |
Raj Mani Misra, Fremont, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080317103 | METHOD AND APPARATUS FOR RECEIVING PLURALITY OF DATA SIGNALS - A transmitter site transmits a plurality of different data signals at a chip rate over a shared spectrum in a code division multiple access communication system. Each transmitted data signal experiences a similar channel response. A combined signal of the transmitted data signals is received. The combined signal is sampled at a multiple of the chip rate. The channel response for the combined signal is determined. A spread data vector is determined using the combined signal samples and the estimated channel response. The data of the different data signals is determined using the spread data vector. | 12-25-2008 |
| 20100254440 | METHOD AND APPARATUS FOR RECEIVING PLURALITY OF DATA SIGNALS - A transmitter site transmits a plurality of different data signals at a chip rate over a shared spectrum in a code division multiple access communication system. Each transmitted data signal experiences a similar channel response. A combined signal of the transmitted data signals is received. The combined signal is sampled at a multiple of the chip rate. The channel response for the combined signal is determined. A spread data vector is determined using the combined signal samples and the estimated channel response. The data of the different data signals is determined using the spread data vector. | 10-07-2010 |
Ronnie Misra, Sunnyvale, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100017188 | Specification Files For Call Translation And Trace - A method and apparatus for storing a function specification file is described. In an exemplary method, the function specification field is capable for providing other software to facilitate execution of an application in a second operating system with the presence of a first operating system and the application is compiled for the first operating system. In another exemplary method, a preprocessor receives the function specification file comprising function definition data for a library function. The preprocessor processes the function definition data to generate header information and function code for the function. In another exemplary method, the preprocessor generates an automatic logging framework for the interposing library based on the function definition data. Further, a function in an interposing library logs calls to a corresponding library function. | 01-21-2010 |
Ronnie G. Misra, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120185435 | ORGANIZING VERSIONING ACCORDING TO PERMISSIONS - Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for storing data according to permissions. In general, one aspect of the subject matter described in this specification can be embodied in methods that include the actions of identifying a version of a data item to be stored; determining permissions associated with the version of the data item; and storing the version of the data item at a storage location that is based on the determined permissions. | 07-19-2012 |
Ronnie G. Misra, Sunnyvale, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120185448 | CONTENT BASED FILE CHUNKING - Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for transferring electronic data. In general, one aspect of the subject matter described in this specification can be embodied in methods that include the actions of identifying a data item to be chunked; determining the type of the data item; determining whether the type of the data item is one of a specified one or more types; if it is determined that the type of the data item is not one of the specified one or more types, performing a first chunking of the data item; and if it is determined that the type of the data item is one of the specified one or more types, performing a second chunking of the data item that is based on the particular content portions of the data item. | 07-19-2012 |
Sudhanshu Misra, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080207100 | Customized polishing pads for CMP and methods of fabrication and use thereof - The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection. | 08-28-2008 |
| 20090053976 | Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof - The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection. | 02-26-2009 |
| 20090311955 | Grooved CMP pad - CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof. | 12-17-2009 |
| 20090318063 | Polishing systems - Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced. | 12-24-2009 |
| 20100273398 | CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION - A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include chip size, pattern density, chip architecture, film material, film topography, and the like. Based on the one or more characteristics of the structure, a value for the one or more chemical or physical properties of the pad is selected. For example, the one or more chemical or physical properties of the pad can include pad material hardness, thickness, surface grooving, pore size, porosity, Youngs modulus, compressibility, asperity, and the like. | 10-28-2010 |