Patent application number | Description | Published |
20080286994 | PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS - According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted. | 11-20-2008 |
20080303145 | Printed Circuit Board, Printed Circuit Board Manufacturing Method and Electronic Device - According to one embodiment, there is provided a printed circuit board which comprises a printed wiring board, a semiconductor package having a number of solder bonding members arranged on its back side and mounted on the printed wiring board by the solder bonding members being soldered to the wiring board, and reinforcing members which are formed of a reinforcing material having a solder flux function and locally reinforce the solder bonding members in a number of places on the semiconductor package mounting portion of the printed wiring board. | 12-11-2008 |
20090001538 | PRINTED WIRING BOARD STRUCTURE, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC APPARATUS - According to one embodiment, a printed wiring board structure comprises a printed wiring board having first and second component mounting surfaces at front and back sides thereof, respectively, each for mounting a semiconductor package loading a semiconductor chip loaded on a substrate as a mounting component, a first semiconductor package mounted on the first component mounting surface, and a second semiconductor package mounted on the second component mounting surface, wherein the first and second semiconductor packages have a positional relationship such that the substrates are partially overlapped via the printed wiring board, and the semiconductor chips are not overlapped. | 01-01-2009 |
20090001575 | Printed Circuit Board, Mounting Method of Electronic Component, and Electronic Apparatus - According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding. | 01-01-2009 |
20090243949 | COMMUNICATION MODULE AND ELECTRONIC APPARATUS - According to an aspect of the present invention, there is provided a communication module including: a substrate including a recess, the recess including a bottom face and an opening portion; a MEMS device including a directional antenna, the MEMS device disposed in the recess and including a planar portion; and a supporting section configured to support the MEMS device so that an angle between the planar portion and the bottom face is changeable, the supporting section configured to electrically connect the substrate to the directional antenna. | 10-01-2009 |
20090314536 | PRINTED CIRCUIT BOARD, ELECTRIC INSTRUMENT, AND SEMICONDUCTOR PACKAGE - A printed circuit board, an electronic instrument, and a semiconductor package are provided that are excellent in bonding strength and easy in rework. The printed circuit board includes a printed wiring board, an electronic device that is the semiconductor package, and an adhesion part. A protection member of the electronic device is arranged along the periphery of a mounting surface of a package body so as to abut a mounting surface of the printed wiring board. The adhesion part is provided in a stepped part defined by a peripheral wall of the electronic device and part of the mounting surface of the printed wiring board in the vicinity of the electronic device. | 12-24-2009 |
20100244224 | SEMICONDUCTOR CHIP MOUNTING BODY, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP MOUNTING BODY AND ELECTRONIC DEVICE - According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip. | 09-30-2010 |
20100290200 | ELECTRONIC DEVICE - According to one embodiment, an electronic device is provided with a conductive member, a printed wiring board including an insulating base member, and a metal foil member provided on one surface of the base member, a fixing member which fixes the printed wiring board to the conductive member, and a conductive adhesive member which covers a surface of the metal foil member and electrically connects the metal foil member to the fixing member. | 11-18-2010 |
20100309628 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism. | 12-09-2010 |
20100328904 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate. | 12-30-2010 |
20110026230 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component. | 02-03-2011 |
20130194515 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first component, and a second component. The circuit board includes a first surface and a second surface opposite the first surface. The first component includes an attaching portion on the first surface. The second component located on the second surface and includes a portion at a position corresponding to the attaching portion. | 08-01-2013 |
20130194516 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, and a surface-mounted component. The circuit board includes a cutout. The surface-mounted component is along an edge of the cutout on the circuit board. | 08-01-2013 |
20130194517 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board including a first surface and a second surface opposite the first surface in the housing, a surface-mounted component on the first surface, a first reinforcing portion on the second surface, and a second reinforcing portion on the second surface. The surface-mounted component includes a corner, a first side, and a second side opposite the first side. The first reinforcing portion is at a position corresponding to the component between the first side and the second side. The second reinforcing portion includes a portion at a position corresponding to the corner. | 08-01-2013 |