Patent application number | Description | Published |
20080207848 | Organopolysiloxane and Curable Silicone Composition that Contains Aforementioned Organopolysiloxane - A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO | 08-28-2008 |
20090203837 | Curable Silicone Composition And Electronic Components - A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R | 08-13-2009 |
20090214870 | Curable Silicone Composition And Electronic Device Produced Therefrom - A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R | 08-27-2009 |
20090247681 | Curable Silicone Composition And Cured Product Therefrom - A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R | 10-01-2009 |
20100113667 | Curable Silicone Composition and Electronic Component - A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability. | 05-06-2010 |