Patent application number | Description | Published |
20110109287 | SEMICONDUCTOR PACKAGE AND DC-DC CONVERTER - According to one embodiment, a semiconductor package includes a chip, a plurality of bumps, a source frame, a drain frame, and a mold member. The chip has a lateral transistor formed inside the chip and has a top source electrode exposed on a first surface of the chip and a top drain electrode exposed on the first surface of the chip. The plurality of bumps are mounted on each of the top source electrode and the top drain electrode. The source frame is connected to the top source electrode through the bumps. The drain frame is connected to the top drain electrode through the bumps. The mold member embeds at least a part of each of the chip, the bumps, the source frame and the drain frame. | 05-12-2011 |
20110109295 | SEMICONDUCTOR DEVICE AND DC-DC CONVERTER - According to one embodiment, a semiconductor device includes a first switching element and a second switching element. The first switching element has a first threshold voltage and a first gate electrode connected to a first gate wiring. The second switching element has a second threshold voltage and a second gate electrode connected to a second gate wiring. The second threshold voltage has a larger absolute value than the first threshold voltage. The second gate wiring has a larger resistance per unit length than the first gate wiring. | 05-12-2011 |
20120013316 | DC-DC CONVERTER - According to one embodiment, a DC-DC converter includes a mounting substrate and a semiconductor device. The semiconductor device includes a first switch element, a second switch element, a first interconnect layer receiving an input potential, a second interconnect layer connected with an inductor, a third interconnect layer receiving a reference potential, and a fourth interconnect layer connected with the inductor. These layers are disposed side by side in one direction on one layer. The mounting substrate includes a fifth interconnect pattern receiving an input potential and disposed adjacently on one side of a mounting region of the semiconductor device, a sixth interconnect pattern receiving a reference voltage and disposed adjacently on the one side of the mounting region, and a seventh interconnect pattern disposed adjacently on one other side opposite to the one side of the mounting region. | 01-19-2012 |
Patent application number | Description | Published |
20090022379 | Method for Quantifying Organ Motion, Apparatus Therefor, Method for Estimating Organ Position, Apparatus Therefor, Method for Irradiating Radiation, Apparatus Therefor, and Apparatus for Detecting Abnormal Organ - A plurality of CT images of an organ ( | 01-22-2009 |
20100128956 | PET SCANNER AND IMAGE RECONSTRUCTION METHOD THEREOF - A plurality of detector rings in which detectors arranged densely or spatially in a ring shape or in a polygonal shape are arranged, with an open space kept in the body axis direction, coincidences are measured for some of or all of detector pairs connecting the detector rings apart from the open space to perform three-dimensional image reconstruction, thereby imaging the open space between the detector rings as a tomographic image. Therefore, the open space is secured, with the deteriorated quality of an image suppressed, thus making it possible to easily gain access to a patient under PET scanning from outside a gantry and also provide irradiation of particle beams for cancer treatment as well as X-ray CT scanning. | 05-27-2010 |
20110084211 | DETECTOR-SHIFT TYPE COMBINED RADIATION THERAPY/PET APPARATUS - In beam monitoring for detecting annihilation radiations produced by radiation irradiation in radiation therapy for cancer which is performed by irradiating the affected area by X-rays, gamma rays, or particle beams, a detector-shift type combined radiation therapy/PET apparatus is provided with an open PET device that includes a plurality of shiftable multi-ring detector rings; and a radiation irradiation device that is capable of irradiation with a radiation beam through between the detector rings. The apparatus changes the positions of the detector rings, performs irradiation with the radiation beam through between the detector rings, and then performs radiation measurement. | 04-14-2011 |