Patent application number | Description | Published |
20080251805 | HEAT DISSIPATION PACKAGE FOR HEAT GENERATION ELEMENT - A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure of heat outside and electricity inside. Consequently, there is no limitation caused by electrical elements surrounding the heat dissipation carrier, so as to enhance the expandability of the heat dissipation carrier and improve the efficiency for heat dissipation of the heat generation element. | 10-16-2008 |
20090242919 | LIGHT EMITTING DEVICE - A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer. | 10-01-2009 |
20090316412 | LAMP APPARATUSES - A lamp apparatus include a lamp body, at least an alternating current light-emitting diode and a plug. The alternating current light-emitting diode is disposed on a lamp body. The plug is electrically connected to the alternating current light-emitting diode. In lamp apparatuses utilizing AC LED, heat generated thereby is almost concentrated on chips. Compared with conventional lamp apparatuses utilizing DC LEDs, heat generated thereby is distributed on chips and outer rectifier. In lamp apparatuses utilizing AC LEDs, heat generated thereby is almost concentrated on chips because AC LEDs operate directly with AC electric power, omitting a rectifier and preventing power loss during operation of power rectification. Therefore, the heat accumulated on the chips of the AC LEDs is enough to be used to evaporate essential oil. In another embodiment, the invention utilizes low-resistance pure water surrounding the AC LED to dissipate its heat. | 12-24-2009 |
20100006868 | AC LED device and method for fabricating the same - An AC LED device and method for fabricating the same are disclosed. An exemplary embodiment of the AC LED device includes at least two separate AC LED unit chips, wherein each of the AC LED unit chip includes a substrate having a first light emitting module and a second light emitting module. Each of the first and second light emitting modules includes a plurality of light emitting micro diodes connected between a first conductive electrode and a second conductive electrode, wherein the amount of light emitting micro diodes emitting light during a positive half cycle of an AC charge is equal to that during a negative half cycle of an AC charge. A plurality of conductive wires is respectively and electrically connected to the separate AC LED unit chips without passive devices. | 01-14-2010 |
20100148206 | LED package and method of assembling the same - An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier. | 06-17-2010 |
20110273073 | MULTI-FACET LIGHT EMITTING LAMP - A multi-facet light emitting lamp including a first light source plate, a second light source plate, and a plurality of airflow channels is provided. The first light source plate has at least one first connecting terminal. The second light source plate has at least one second connecting terminal. The first connecting terminal is connected with the second connecting terminal, and an inner space is formed between the first light source plate and the second light source plate. The inner space and a space outside the multi-facet light emitting lamp are connected by the airflow channels. | 11-10-2011 |
20110284878 | LIGHT EMITTING DIODE MODULE, AND LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens. | 11-24-2011 |
20110284879 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE - A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided. | 11-24-2011 |
20120032588 | LIGHT SOURCE DEVICE - A light source device having a good heat dissipation capability is disclosed, in which heat generated by a light emitting device is conducted to a base fabricated by a porous material through a heat conducting mask or a heat conducting pipe. Due to a large area contact between the heat conducting mask or the heat conducting pipe and the base, the heat can be evenly conducted to the base, so that the base can absorb the heat and dissipate the heat to external, so as to improve a heat dissipation efficiency. Moreover, in the light source device of the disclosure, heat exchange of the light emitting device can be directly carried on through air convection, so that the heat generated by the light emitting device can be taken away from the light source device through heat exchange of cool air. | 02-09-2012 |
20120077274 | CHEMICAL OR BIOCHEMICAL ANALYSIS APPARATUS AND METHOD FOR CHEMICAL OR BIOCHEMICAL ANALYSIS - A chemical or biochemical analysis apparatus includes: a computer processor; at least one controller electrically coupled to the computer processor; at least one first base configured with a plurality of dispensing tube assemblies arranged in alignment and electrically coupled to the at least one controller, independently; at least one second base configured with a plurality of the detectors arranged in alignment and electrically coupled to the at least one controller; and a stage, for carrying the at least one multi-well strip having a plurality of wells arranged in alignment and for transporting the multi-well strip to pass through and underneath the plurality of dispensing tube assemblies and the plurality of the detectors arranged in order, electrically coupled to the at least one controller. | 03-29-2012 |
20140145215 | AC LED device and method for fabricating the same - An AC LED device and method for fabricating the same are disclosed. An exemplary embodiment of the AC LED device includes at least two separate AC LED unit chips, wherein each of the AC LED unit chip includes a substrate having a first light emitting module and a second light emitting module. Each of the first and second light emitting modules includes a plurality of light emitting micro diodes connected between a first conductive electrode and a second conductive electrode, wherein the amount of light emitting micro diodes emitting light during a positive half cycle of an AC charge is equal to that during a negative half cycle of an AC charge. A plurality of conductive wires is respectively and electrically connected to the separate AC LED unit chips without passive devices. | 05-29-2014 |