Patent application number | Description | Published |
20110100431 | Tandem Solar Cell and Fabricating Method thereof - A tandem solar cell and fabricating method thereof are disclosed. The steps of the fabricating method comprises: a top inverted solar cell having a plurality of inverted solar sub-cells is provided; a bottom normal solar cell having a plurality of normal solar sub-cells accompanying with the inverted solar sub-cells is provided; and processing fit process of the top inverted solar cell and the bottom normal solar cell is executed, wherein an interlayer is disposed between the bottom normal solar cell and the top inverted solar cell, and the interlayer includes a plurality of conductive dots. The plurality of inverted solar sub-cells and normal solar sub-cells are placed with an offset distance from each other, and a plurality of solar sub-cells are formed after the pressing fit process, and the plurality of solar sub-cells are series/parallel connection each other by electrically connecting the plurality of conductive dots. | 05-05-2011 |
20110100465 | Organic Solar Cell with Oriented Distribution of Carriers and Manufacturing Method of the Same - The present invention provides an organic solar cell with oriented distribution of carriers, which forming variation of distribution of electron donors and electron acceptors between active sub-layers of an active layer by utilizing buffer layer method, for improving carrier extraction efficiency and thus effectively enhancing performance of the organic solar. The present invention also provides a method for manufacturing an organic solar cell with oriented distribution of carriers. | 05-05-2011 |
20110151646 | MICROWAVE ANNEALING METHOD FOR DEVICE PROCESSING WITH PLASTIC SUBSTRATE - The present invention provides a microwave annealing method for a plastic substrate. The method comprises pulsed microwave annealing to an organic photo-voltaic device to avoid warpage and degradation of the plastic substrate. Utilizing pulsed microwave annealing method can improve the wettability of the organic layer on the plastic substrate verified by contact angle measurement, and achieving the organic solar cell fabricated with higher power conversion efficiency. | 06-23-2011 |
20130056070 | APPARATUS AND METHOD FOR ENHANCING INVERTED ORGANIC SOLAR CELLS BY UTILIZING LIGHT ILLUMINATION - Disclosed is an apparatus and method for generating inverted organic solar cells and which required no electron selective layer, were fabricated and their power conversion efficiency was found to improve irreversibly with post-processing light soaking for a period. X-Ray photoelectron spectroscopy characterization further revealed segregation in surface composition at the interface and was found to explain the current density-voltage measurements. In addition, the light soaked devices were found to exhibit an extended lifetime as compared to conventional devices. Since no electron selective layer was required, light soaking may be considered as a cost-effective method to achieve efficient inverted organic solar cells. | 03-07-2013 |
20130168643 | LIGHT DETECTING ARRAY STRUCTURE AND LIGHT DETECTING MODULE - A light detecting array structure and a light detecting module are provided. The light detecting array structure includes a plurality of first electrodes, a plurality of second electrodes, a first carrier selective layer, a second carrier selective layer, and a light-absorbing active layer. The second electrodes are disposed on one side of the first electrodes. Between the first electrodes and the second electrodes, a first carrier selective layer, a light-absorbing active layer and a second carrier selective layer are disposed. The light detecting module includes the light detecting array structure and a control unit. The control unit is coupled to the first electrodes and second electrodes, selectively provides at least two cross voltages between each of the first electrodes and each of the second electrodes, and reads photocurrents flowing through the first electrodes and second electrodes. | 07-04-2013 |
Patent application number | Description | Published |
20110237019 | Method for Improving the Efficiency of Flexible Organic Solar Cells - The present invention discloses a method for improving the efficiency of flexible organic solar cells. The steps of the method comprise: a conductive film-coated flexible substrate is provided; and a hole blocking layer is formed on the flexible substrate by atomic layer deposition, or an active layer is formed first then a hole blocking layer is formed on the active layer by atomic layer deposition. Atomic layer deposition can control the thickness of the hole blocking layer precisely and form uniformly surface in a large area, so that the power conversion efficiency of the flexible organic solar cell is increasing effectively. | 09-29-2011 |
20110320145 | METHOD FOR PARAMETERS EXTRACTION OF SOLAR CELLS - The present invention discloses a method for extracting of solar cell parameters. After illuminating the solar cell by different simulated solar luminosity with different illumination intensity, measured current and measured voltages of the solar cell are acquired and the series resistance of the solar cell is extracted based on the measured current and measured voltages. The root mean square error (RMSE) is used to determine the series resistance of the solar cell. Therefore, the parameters of the solar cell are extracted without presuming current-voltage functional form. | 12-29-2011 |
20130025666 | Novel Thin Film Solar Cell Structure - The present invention provides a kind of structure of a thin film solar cell, including: a transparent conductive layer, a first electrode, a second electrode, a conductive layer of metal, and a photoelectric conversion layer, wherein changing the structures of said first electrode and said second electrode can improve the efficiency of the cell. Because the distribution of electric potential is not uniform in the transparent conductive layer, it will reduce the efficiency of the cell. We can solve this problem by changing the electrode structures of the cell, and improve the efficiency of the cell. | 01-31-2013 |
20130025667 | Electrode Structure for Improving Efficiency of Solar Cells - The present invention provides an improved electrode structure for improving efficiency of solar cells, and the structure of the solar cells includes a back electrode, a transparent conducting glass layer, a photoelectric conversion layer, and a grid electrode. The transparent conducting glass layer includes a light-penetrated surface for accepting light. The photoelectric conversion layer is disposed between the back electrode and the transparent conducting glass layer to convert light energy into electric energy. The grid electrode is embedded in the transparent conducting glass layer to solve the problems of uneven electric potential for decreasing uneven voltage on the light-penetrated surface and further increasing efficiency of the solar cells. | 01-31-2013 |
Patent application number | Description | Published |
20110193241 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided, which includes: a substrate having an upper surface and a lower surface; a hole extending from the upper surface toward the lower surface; an insulating layer located overlying a sidewall of the hole; and a material layer located overlying the sidewall of the hole, wherein the material layer is separated from the upper surface of the substrate by a distance and a thickness of the material layer decreases along a direction toward the lower surface. | 08-11-2011 |
20120080706 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a substrate having a surface; a reflective layer partially covering the surface of the substrate; an insulating layer formed on the surface of the substrate and the reflective layer; a conducting layer formed on the insulating layer, wherein at least a portion of a direct projection of the conducting layer on the surface does not overlap with a direct projection of the reflective layer on the surface, and the conducting layer does not electrically contact with the reflective layer; and a chip disposed on the surface of the chip, wherein the chip has at least an electrode electrically connected to the conducting layer. | 04-05-2012 |
20120104445 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a substrate having a surface; a first conducting layer located on the surface; a second conducting layer located on the surface, wherein the first conducting layer and the second conducting layer are electrically insulated from each other; a first reflective layer conformally located on the first conducting layer and at least partially covering a side of the first conducting layer; a second reflective layer conformally located on the second conducting layer and at least partially covering a side of the second conducting layer; and a chip disposed on the surface of the substrate and having at least a first electrode and a second electrode, wherein the first electrode is electrically connected to the first conducting layer, and the second electrode is electrically connected to the second conducting layer. | 05-03-2012 |
20120184070 | METHOD FOR FORMING CHIP PACKAGE - An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least two conducting pads are disposed on the first surface of the substrate; partially removing the substrate from the second surface of the substrate to form at least two holes extending towards the first surface, wherein the holes correspondingly and respectively align with one of the conducting pads; after the holes are formed, partially removing the substrate from the second substrate to form at least a recess extending towards the first surface, wherein the recess overlaps with the holes; forming an insulating layer on a sidewall and a bottom of the trench and on sidewalls of the holes; and forming a conducting layer on the insulating layer, wherein the conducting layer electrically contacts with one of the conducting pads. | 07-19-2012 |
20120193811 | INTERPOSER AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides an interposer which includes: a substrate having a first surface and a second surface; a first hole extending from the first surface towards the second surface; a second hole extending from the first surface towards the second surface, wherein a width of the first hole is different from a width of the second hole; an insulating layer located on the substrate and extending onto a sidewall of the first hole and a sidewall of the second hole; and a conducting layer located on the insulating layer on the substrate and extending onto the sidewall of the first hole, wherein there is substantially no conducting layer in the second hole. | 08-02-2012 |