Patent application number | Description | Published |
20090194259 | VAPOR CHAMBER AND SUPPORTING STRUCTURE THEREOF - In a vapor chamber and a supporting structure thereof, the vapor chamber includes a casing, in which a capillary wick and a supporting structure are accommodated. The supporting structure includes a plate, on which a plurality of channels are disposed at equal intervals and arranged by corresponding to each other. A corrugated piece is formed in each channel and upper and lower sides of the corrugated piece are respectively abutted against the capillary wick, making the capillary wick and inner wall faces of the casing tightly contacted to each other. In addition, a vapor chamber having this kind of supporting structure is provided. Thereby, it is possible to increase the phase-changing amount of the vapor chamber, accelerate the heat-transferring speed, and enhance the heat-conducting performance further. | 08-06-2009 |
20090195984 | COOLING DEVICE - A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element. | 08-06-2009 |
20090205812 | ISOTHERMAL VAPOR CHAMBER AND SUPPORT STRUCTURE THEREOF - In an isothermal vapor chamber and its support structure, the isothermal vapor chamber includes a casing, a capillary wick, a support structure and a working fluid. The capillary wick is disposed in the casing. The support structure is contained in the capillary wick for supporting the capillary wick and the support structure includes two side panels and a plurality of wavy plates are connected between the two side panels. The wavy plate is formed by a plurality of wave peak sections and a plurality of wave valley sections, and the wave peak sections of any two adjacent wavy plates are installed alternately with each other, and any two adjacent wavy plates are partitioned to form a partition channel. The working fluid is filled into the casing and flowed through the partition channel for improving the heat conducting efficiency of the isothermal vapor chamber. | 08-20-2009 |
20100006268 | VAPOR CHAMBER AND SUPPORTING STRUCTURE OF THE SAME - A vapor chamber includes a casing, the working fluid, a wick structure and a supporting structure. The casing has a hollow room for allowing the working fluid to be filled therein. The wick structure is distributed in the hollow room. The supporting structure abuts against an inside surface of the wick structure. The supporting structure includes side plates and a plurality of wavelike pieces connected between the side plates. Each of the wavelike pieces is constituted of a plurality of crests and troughs. The crests of any two neighboring wavelike pieces are arranged in an alternating manner. A penetrating hole is provided at the crests and the troughs respectively. The working fluid flows through the separated passages and the penetrating holes. Via the above arrangement, the heat-conducting efficiency of the vapor chamber can be enhanced. | 01-14-2010 |
20120037344 | FLAT HEAT PIPE HAVING SWIRL CORE - A flat heat pipe having a swirl core includes a flat sealed casing having smooth inner walls, a working fluid filled within the flat sealed casing, and a swirl core disposed along a central axis of the flat sealed casing to support upper and lower inner walls of the flat sealed casing. Two airflow channels are formed between the swirl core and left and right inner walls of the flat sealed casing for allowing vapors of the working fluid to flow through. The swirl core is made by winding a metallic woven mesh in at least two circles for allowing the working fluid to flow through. A center of the swirl core is formed with a reflow channel. By this arrangement, the swirl core is used as a wick structure for allowing the working fluid to flow through, thereby saving the cost and time for manufacturing the wick structure. | 02-16-2012 |
20120285662 | VAPOR CHAMBER WITH IMPROVED SEALED OPENING - The vapor chamber includes a casing, wick structure, working fluid and filling/degassing tube. The casing is composed of two plates and has a chamber therein. The wick structure and working fluid are disposed in the chamber. The filling/degassing tube is connected with the casing to form a passage communicating with the chamber. A portion of the plates which overlaps the filling/degassing tube is pressed to deform for making the passage closed. And the outer end of the filling/degassing tube is flush with the side of the casing. | 11-15-2012 |
20130168052 | HEAT PIPE AND COMPOSITION OF CAPILLARY WICK THEREOF - The present invention provides a heat pipe and a composition of a capillary wick thereof. The heat pipe includes a main body, a capillary wick and a working fluid. The main body has an inner wall surface. The capillary wick is combined on the inner wall surface. The capillary wick includes a first capillary powder of 30 weight percent and a second capillary powder of 70 weight percent. The size of particles of the first capillary powder is smaller than that of the second capillary powder. The working fluid is filled in the main body of the heat pipe. The first capillary powder and the second capillary powder are mixed to each other uniformly to be sintered on the inner wall surface of the heat pipe. By this arrangement, the heat pipe can achieve the maximum performance to remove the heat generated by an electronic element rapidly. | 07-04-2013 |
20130199757 | HEAT-DISSIPATING MODULE HAVING LOOP-TYPE VAPOR CHAMBER - A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium. | 08-08-2013 |