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| 20110241146 | MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MODULE WITH PACKAGE STRUCTURE - The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof. | 10-06-2011 |
| 20110241147 | WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME - The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process. | 10-06-2011 |
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| 20100134969 | PORTABLE COMPUTER AND HINGE MECHANISM THEREOF - A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display monitor, a host and a hinge mechanism. The hinge mechanism for rotating the display monitor and the host relatively includes a bottom board, a pivot, a power adapter, a locking bracket, a slanting board and a parallel board. The pivot is disposed on the bottom board. Two ends of the pivot are connected with the host and the display monitor respectively. The power adapter is disposed on the bottom board. The locking bracket having a locking hole is disposed on the bottom board. The slanting board disposed on the bottom board slants to the pivot. The slanting board has a first opening which exposes the power adapter. The parallel board disposed on the bottom board is parallel to the pivot. The parallel board has a second opening which exposes the locking hole. | 06-03-2010 |
| 20100134970 | PORTABLE COMPUTER AND HINGE MECHANISM THEREOF - A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display screen, a host and a hinge mechanism. The hinge mechanism is connected with the display screen and the host. The hinge mechanism is used for rotating the display screen around the host. The hinge mechanism includes a bottom board, a pivot, a network connecter and a slanting board. The pivot is disposed on the bottom board, wherein one end of the pivot is connected with the host and the other end of the pivot is connected with the display screen. The network connecter is disposed on the bottom board. The slanting board is disposed on the bottom board and slants to the pivot. The slanting board has an opening which exposes the network connecter. | 06-03-2010 |
| 20100136398 | PORTABLE COMPUTER AND LOCKING MECHANISM THEREOF - A portable computer and a locking mechanism thereof are provided. The portable computer includes a battery, a host and a locking mechanism. The battery has a locking hole. The battery includes a restraining protrusion. The host has a receiving through. The locking mechanism is disposed in the receiving through. The locking mechanism includes a main body and a locking protrusion. The main body has a first restraining concave and a second restraining concave. The locking protrusion is connected to the main body. When the restraining protrusion is placed in the first restraining concave, the locking protrusion is locked in the locking hole, so that the battery is locked in the receiving through. When the restraining protrusion is placed in the second restraining concave, the locking protrusion leaves the locking hole, so that the battery is dismounted from the receiving through. | 06-03-2010 |
| 20120329408 | ELECTRONIC DEVICE AND FIXING STRUCTURE THEREOF - A fixing structure including a metal housing and a fixing base is disclosed. The housing has a carrying plane and the fixing base having a first contact end and, opposite, a second contact end is disposed on the housing. The perpendicular distance from the first contact end to the carrying plane is greater than that from the second contact end to the carrying plane. A wireless transmission device is disposed on the fixing base and in contact with the first contact end and the second contact end, so that a perpendicular distance from an antenna end of the wireless transmission device to the carrying plane is greater than a perpendicular distance from a fixed end of the wireless transmission device to the carrying plane. Therefore, a relatively great distance is kept between the antenna end and the housing for preventing the antenna end from being interfered by the metal housing. | 12-27-2012 |
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| 20110279815 | MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MODULE WITH FIXED FOCAL LENGTH - This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material. | 11-17-2011 |
| 20110291215 | WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME - The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced. | 12-01-2011 |
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| 20090277764 | RESETTING MECHANISM FOR LAMP SWITCH WITH OVERCURRENT PROTECTION - A resetting mechanism for lamp switch with overcurrent protection. The resetting mechanism includes a pull switch having a rotary shaft, an overcurrent protection member positioned on one side of the pull switch and a resetting section having a push rod. At least one ratchet is formed on the rotary shaft. The overcurrent protection member includes a conductive section reciprocally movable between an open position and a close position. The push rod of the resetting section is drivable by the ratchet of the rotary shaft to reciprocally move between a reset position and a releasing position. When the rotary shaft rotates, the ratchet pushes the push rod to move from the releasing position to the reset position. In the meantime, the push rod pushes the conductive section from the open position to the close position to recover the power supply circuit from an outage state. | 11-12-2009 |
| 20100007278 | LAMP OVERLOAD DETECTION/MODULATION CIRCUIT - A lamp overload detection/modulation circuit including a microcontroller unit for detecting rectangular wave signal reflective of the power used by the lamp load and pulse width signal of AC power. The positive bandwidths of the two signals are compared with a predetermined full-load value. In the case that the positive bandwidths of the two signals are both larger than the full-load value, it is indicated that the lamp load is under an overload condition. Under such circumstance, the microcontroller unit controls a lamp load driving unit to change driving manner and lower the power used by the lamp load to a value within a nominal range. Then the lamp load automatically restores to the full-load state. Accordingly, the lamp is protected from long-term overload condition. | 01-14-2010 |
| 20100007291 | CURRENT-LIMITING PROTECTION CIRCUIT OF A REMOTELY CONTROLLED CEILING FAN-LAMP - A current-limiting protection circuit of remotely controlled ceiling fan-lamp is disclosed. The current-limiting protection circuit includes a microcontroller unit for detecting rectangular wave signal reflective of the power used by a lamp load. The rectangular wave signal is compared with nominal value. In the case that the positive bandwidth of the rectangular wave signal is larger than the nominal value, it is indicated that the lamp load is in an overloaded state. Under such circumstance, the microcontroller unit controls a lamp load driving unit to change driving manner and lower the power used by the lamp load to a value within the nominal range. | 01-14-2010 |
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| 20080204401 | Control apparatus - The present invention is to provide a control apparatus, which includes a casing with two sides each comprising a holding portion extending outwardly and towards a bottom thereof for being held by a user while viewing a front of the casing, the front is inclined progressively from a lateral edge of the front away from the user through the bottom to an opposite lateral edge of the front near the user; a direction input portion disposed on the front of the casing near one of the holding portions; an operation input portion disposed on the front of the casing near the other holding portion; and a sensing input portion disposed on the front of the casing between the direction input portion and the operation input portion and proximate to the user. Thus, a user can press or push any input portion easily for an input while holding the two holding portions by hands. | 08-28-2008 |
| 20080306616 | Control apparatus with a balance feedback function - A control apparatus with a balance feedback function includes a direction control module for outputting several direction signals of different directions; an operation control module outputting several control signals of different operations; a balance control module for detecting the control apparatus and presetting a tilting angle between horizontal planes to generate a horizontal shift vector signal or detecting a vertical shift in the vertical direction of the control apparatus to generate a corresponding vertical vector signal; a processing module coupled to the balance control module for receiving the direction signal to produce a corresponding direction data, for receiving the operation control signal to produce a corresponding operation control data, for receiving the horizontal shift vector signal to produce a horizontal vector data, and for receiving the vertical vector signal to produce vertical vector data; and a transmission module provided for transmitting any one of the data to an electronic device to achieve the balance feedback control. | 12-11-2008 |
| 20080310667 | Earphone for playing background sounds - The present invention is to provide an earphone for playing external background sounds which comprises a background audio module and a speaker, wherein said earphone may be connected to portable electronic devices and outputs audio signals such as voice, music, or radio received from the electronic devices through the speaker. Said earphone is able to acquire the external background sounds through background audio module and outputs the acquired background sounds along with the audio signals through the speaker. Thereby, user can still hear the external background sounds through the speaker while talking on a phone or listening to audio signals like music or radio. | 12-18-2008 |
| 20090251108 | PORTABLE ELECTRONIC DEVICE AND METHOD OF ADJUSTING CHARGING CURRENT FOR A RECHARGEABLE BATTERY UNIT THEREOF - A portable electronic device includes a charging unit coupled to a rechargeable battery, an internal electronic unit, and a temperature sensor for sensing temperature of the internal electronic unit. The charging unit receives an external input power so as to output a charging current for charging the rechargeable battery, and a supply current supplied to the internal electronic unit, and adjusts the charging current outputted to the rechargeable battery unit based on the temperature of the internal electronic unit. A method of adjusting a charging current for a rechargeable battery unit of a portable electronic device is also disclosed. | 10-08-2009 |
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| 20080248620 | Gated semiconductor device and method of fabricating same - A method for fabricating a gated semiconductor device, and the device resulting from performing the method. In a preferred embodiment, the method includes forming a hard mask for use in gate formation on one or more layers of alternately insulating and conducting material that have been formed on a substrate. The hard mask preferably includes three layers; a lower nitride layer, a middle oxide, and an upper nitride layer. In this embodiment, the middle oxide layer is formed with the rest of the hard mask, and then reduced in a lateral dimension, preferably using a DHF dip. A dielectric layer formed over the gate structure, including the hard mask, then etched back, self-aligns to be reduced-dimension oxide layer. In addition, where two conducting, that is gate layers are present, the lower layer is laterally reduced in dimension on at least one side to create an undercut. | 10-09-2008 |
| 20110006355 | Novel Structure for Flash Memory Cells - A flash memory cell structure is provided. A semiconductor structure includes a semiconductor substrate, a floating gate overlying the semiconductor substrate, a word-line adjacent to the floating gate, an erase gate adjacent to a side of the floating gate opposite the word-line, a first sidewall disposed between the floating gate and the word-line, and a second sidewall disposed between the floating gate and the erase gate. The first sidewall has a first characteristic and the second sidewall has a second characteristic. The first characteristic is different from the second characteristic. | 01-13-2011 |
