Ming-Hong
Ming-Hong Cha, Hsin-Chu TW
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20140048929 | Bonded Structures for Package and Substrate - The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance. | 02-20-2014 |
20140377946 | Bonded Structures for Package and Substrate - The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance. | 12-25-2014 |
Ming-Hong Chen, Taipei City TW
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20140163587 | NERVE GUIDE CONDUIT - A nerve guide conduit comprising a first open cover, a second open cover and a connecting portion is provided. The first open cover has a first guiding recess, a first terminal surface and a second terminal surface opposite to the first terminal surface. The first guiding recess is extended to the second terminal surface from the first terminal surface. The second open cover has a second guiding recess, a third terminal surface and a fourth terminal surface opposite to the third terminal surface. The second guiding recess is extended to the fourth terminal surface from the third terminal surface. When the first open cover covers the second open cover, the first guiding recess and the second guiding recess together provide a nerve receiving space. The connecting portion connects the first open cover and the second open cover. | 06-12-2014 |
Ming-Hong Chen, Taichung City TW
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20130134023 | THIN FILM SWITCH AND PRESS KEY/KEYBOARD USING THE SAME - A thin film switch, comprising: a first thin film, having a first conductor unit mounted thereon; and a second thin film, having a second conductor unit mounted on a surface thereof facing toward the first thin film; wherein, the first conductor unit is composed of at least one first electric conductor; and the second conductor is composed of a plurality of second electric conductors to be arranged in a manner that one of the plural second electric conductors is disposed at a first position defined on the second thin film while designating another one of the plural second electric conductors to be disposed at a second position of the second thin film. Operationally, the thin film switch is capable of outputting different signals in response to different forces exerted thereon for triggering different electric conductors mounted on different positions in the thin film switch. | 05-30-2013 |
Ming-Hong Hsieh, Bade City TW
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20130063175 | Semiconductor Device Components and Methods - Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end. | 03-14-2013 |
20140145194 | Semiconductor Device Components and Methods - Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end. | 05-29-2014 |
Ming-Hong Huang, Hsinchu City TW
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20140084188 | APPARATUS FOR MEASURING THE OPTOELECTRONIC CHARACTERISTICS OF LIGHT-EMITTING DIODE - An apparatus for measuring the optoelectronic characteristics of a light-emitting diode includes: a container including a light input port and a light output port; a measurement module connected to the light output port of the container; a sample holder under the container for holding a light-emitting diode under test, wherein a surface of the measurement module reflects more than 50% of the luminous flux generated by the light-emitting diode under test; and a light gathering unit between the container and the sample holder, wherein an interior wall of the light gathering unit reflects more than 50% of the luminous flux generated by the light-emitting diode under test. | 03-27-2014 |
Ming-Hong Koo, Taipei City TW
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20100106984 | Shared interface device for power supply over ethernet (POE) and wireless network mdoule - The present invention relates to a shared interface device for Power Over Ethernet (POE) and a wireless network module, comprises a motherboard and an interface device used for inserting a POE card or a wireless interface card. The motherboard includes an Ethernet connection interface, a signal processing unit, a logical conversion unit and an external power supply interface. When signals and power from an external network are transmitted via the Ethernet connection interface to the interface device, these signals and power will be further transmitted into the POE card for filtering to capture the power. Then, the captured power will be fed back to the interface device and transmitted via the logical conversion unit to the motherboard for use; when the logical conversion unit receives the power from the external power supply interface, the power is provided for the wireless interface card and the motherboard for use. Such shared design will effectively reduce complexity of circuit layout in the motherboard and lower costs for enterprises in developing a set of independent modules separately. | 04-29-2010 |
Ming-Hong Kuo, Taipei City TW
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20140021017 | TRANSMISSION MECHANISM OF VERTICAL CIRCUIT BOARD ETCHING DEVICE - Disclosed is a transmission mechanism of vertical circuit board etching device. The transmission mechanism includes a driving shaft unit that has power output terminals respectively coupled to power input terminals of driven shaft units that are of the same number as pairs of clamping/rolling/feeding roller shafts to drive the driven shaft units to rotate. Power output terminals of the driven shaft units are coupled to the pairs of clamping/rolling/feeding roller shafts. Transmission rollers that are contained in the driving shaft unit and the driven shaft units for coupling to each other for changing direction of power transmission and changing speeds of rotation are all rollers that include a plurality of circumferentially-distributed peg-like teeth extending from a roller surface thereof. | 01-23-2014 |
20140197027 | ELECTROPLATING AID BOARD AND ELECTROPLATING DEVICE USING SAME - An electroplating device includes a plating solution, at least one anode basket located in the plating solution, and a workpiece to be plated. An electroplating aid board is arranged between the anode basket and the workpiece to be plated. The electroplating aid board has at least one side that has a length exceeding the workpiece to be plated. The electroplating aid board is made of a plastic material that is not electrically conductive and includes a plurality of holes formed therein. In an electroplating operation, the holes provide an effect of tunnel that guides positive ions (such as copper ions) of the plating solution to flow from the anode basket (namely anode) straightforward to the nearest surface portion of the workpiece to be plated. | 07-17-2014 |
Ming-Hong Lin, Yuanlin Township TW
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20150061853 | REPEATER MODULE FOR TIRE PRESSURE MONITORING SYSTEM - A repeater module used in a TPMS and installed in a mother vehicle or daughter vehicle of a tow truck for receiving the status signal from each daughter vehicle tire pressure sensor and providing a corresponding wireless signal to the on-vehicle main unit in the mother vehicle by using the ID code and communication protocol of any mother vehicle tire pressure sensor so that the mother vehicle can receive the status information of the tires of the daughter vehicle without needing to modify the on-vehicle main unit. | 03-05-2015 |
Ming-Hong Lin, Hsinchu TW
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20110304044 | STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD - A stacked chip package structure includes: a first chip and a second chip stacked on a substrate; a first electrical connection structure electrically connecting the substrate and the first chip; and a second electrical connection structure electrically connecting the second chip and the first chip, wherein the second electrical connection structure, disposed on a third chip, includes an adhesive layer encapsulating a second solder ball structure on the second chip and a first solder ball structure on the first chip; and a plurality of conductive wires disposed in the adhesive layer for conducting the second solder ball structure and the first solder ball structure. A fabrication method for the stacked chip package structure is also disclosed. Forming conductive wires in the adhesive layer electrically connecting the upper and lower chips may improve potential problems caused when using wire bonding technology for the upper chip during stacking of the multilayer chips. | 12-15-2011 |
Ming-Hong Lin, Changhua County TW
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20150343859 | TPMS SENSOR POSITION SETTING METHOD - A TPMS (tire pressure monitoring system) sensor setting method is disclosed and performed by: using a setting tool to input a location code into the TPMS sensor to be set so that the TPMS sensor can feed the location code and its ID to the on-vehicle main unit for enabling the on-vehicle main unit to establish the relationship between the ID of the TPMS sensor and its location. | 12-03-2015 |
Ming-Hong Tai, Kaohsiung TW
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20080269350 | ST104P, AN ANTI-ANGIOGENIC AGENT - The present invention relates to a method of treating a non-tumor condition or disease associated with angiogenesis in a human or animal comprises administering thereto an effective angiogenesis inhibiting dose of a tetrameric cyclic compound of 4,5-dihydroxynaphthalene-2,7, disulfonic acid linked by methylene bridges in a pharmaceutically acceptable carrier. | 10-30-2008 |
20130296242 | MEDICATION AND THERAPY TREATING OF CHOROIDAL NEOVASCULARIZATION - A medication for treating choroidal neovascularization comprises an amino acid fragment that derives from an angiogenesis inhibiting factor and comprises amino acid sequences as set forth in SEQ ID NO: 1. Moreover, a therapy of treating choroidal neovascularization by administering the said medication to an individual, with the medication comprising 0.1-1000 μg of the amino acid fragment in 1 ml solvent. | 11-07-2013 |
Ming-Hong Tsai, Tainan City TW
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20140140207 | SYSTEM AND METHOD FOR REDUCING LOADS OF MOBILITY MANAGEMENT ENTITY (MME) IN CORE NETWORKS - The present invention provides a system and method for reducing loads of a mobility management entity in core networks. An object sending a connection-request message asking for network access to a base station through a wireless network; the base station receiving the connection-request message and sending it to core networks through a network; a mobility management entity (MME) in the core network receive the connection-request message. If the core network is busy and refuses to interconnect with the object, MME calculating according to a management rule a back-off time; MME transmitting a response message including the back-off time to the object through the base station, and the object sending out a connection-request message again after the back-off time has elapsed according to the response message. | 05-22-2014 |
Ming-Hong Tseng, Toufen Township TW
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20100102453 | Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure - A system, a structure and a method of manufacturing stacked semiconductor substrates is presented. A first substrate includes a first side and a second side. A through substrate via (TSV) protrudes from the first side of the first substrate. A first protruding portion of the TSV has a conductive protective coating and a second protruding portion of the TSV has an isolation liner. The system further includes a second substrate and a joint interface structure that bonds the second substrate to the first substrate at the conductive protective coating of the first protruding portion of the TSV. | 04-29-2010 |
20100213612 | THROUGH-SILICON VIA FORMED WITH A POST PASSIVATION INTERCONNECT STRUCTURE - An integrated circuit structure includes a semiconductor substrate, a through-silicon via (TSV) extending into the semiconductor substrate, a pad formed over the semiconductor substrate and spaced apart from the TSV, and an interconnect structure formed over the semiconductor substrate and electrically connecting the TSV and the pad. The interconnect structure includes an upper portion formed on the pad and a lower portion adjacent to the pad, and the upper portion extends to electrically connect the TSV. | 08-26-2010 |
20110169168 | THROUGH-SILICON VIA FORMED WITH A POST PASSIVATION INTERCONNECT STRUCTURE - An integrated circuit structure includes a semiconductor substrate, a through-silicon via (TSV) extending into the semiconductor substrate, a pad formed over the semiconductor substrate and spaced apart from the TSV, and an interconnect structure formed over the semiconductor substrate and electrically connecting the TSV and the pad. The interconnect structure includes an upper portion formed on the pad and a lower portion adjacent to the pad, and the upper portion extends to electrically connect the TSV. | 07-14-2011 |
Ming-Hong Tseng, Miaoli TW
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20100117201 | Cooling Channels in 3DIC Stacks - An integrated circuit structure includes a die including a semiconductor substrate; dielectric layers over the semiconductor substrate; an interconnect structure including metal lines and vias in the dielectric layers; a plurality of channels extending from inside the semiconductor substrate to inside the dielectric layers; and a dielectric film over the interconnect structure and sealing portions of the plurality of channels. The plurality of channels is configured to allow a fluid to flow through. | 05-13-2010 |
Ming-Hong Wang, Hsinchu TW
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20080281582 | Input system for mobile search and method therefor - An input system for mobile search and a method therefor are provided. The input system includes an input module receiving a code input for a specific term and a voice input corresponding thereto, a database including a glossary and an acoustic model, wherein the glossary includes a plurality of terms and a sequence list, and each of the terms has a search weight based on an order of the sequence list, a process module selecting a first number of candidate terms from the glossary according to the code input by using an input algorithm and obtaining a second number of candidate terms by using a speech recognition algorithm to compare the voice input with the first number of candidate terms via the acoustic model, wherein the second number of candidate terms are listed in a particular order based on their respective search weights, and an output module showing the second number of candidate terms in the particular order for selecting the specific term therefrom. | 11-13-2008 |
Ming-Hong Wu, Taipei TW
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20120057126 | METHOD FOR ANALYZING TEAR FILM THERMOGRAPH OF CONTACTLESS TEAR FILM THERMAL IMAGER - A method for analyzing tear film thermograph of contactless tear film thermal imager has steps of sequentially loading multiple thermographs of a tear film, recording a maximum and a minimum of temperatures for a region of interest of each one of the thermographs, dividing the thermograph into at least one temperature zone in accordance with the maximum and minimum temperatures recorded in the last step, and recording a size, a location and a bordering temperature of each one of the at least one temperature zone, analyzing a pattern and temperature variation of each one of the at least one temperature zone, and classifying stability of the tear film. The patterns of the temperature zones can be identified through circularity computation, mosaic and temperature gradient analysis. Accordingly, tear film break up patterns can be classified with the method to facilitate doctors to diagnose a dry eye patient. | 03-08-2012 |
Ming-Hong Xie, Foster City, CA US
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20140286951 | MET-BINDING AGENTS AND USES THEREOF - The present invention relates to binding agents that specifically bind human MET, binding agents that specifically bind one or more components of the WNT pathway, bispecific agents that bind both human MET and one or more components of the WNT pathway, and methods of using the agents for treating diseases such as cancer. | 09-25-2014 |
Ming-Hong Yeh, New Taipei City TW
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20150354788 | LAMP - A lamp is provided. The lamp has one of a first connection portion and a second connection portion. Another one of the first connection portion and the second connection portion belongs to another lamp. The first connection portion has a first electrode set, the second connection portion has a second electrode set, and the first electrode set and the second electrode set contact each other when the lamp and the another lamp are stacked each other. | 12-10-2015 |