Patent application number | Description | Published |
20120107545 | MICROMACHINED STRUCTURES - A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer. | 05-03-2012 |
20130139595 | Three-Dimensional Micro-Electro-Mechanical-System Sensor - The present invention discloses a three-dimensional micro-electro-mechanical-system sensor. The sensor includes movable first electrodes, plural movable second electrodes, plural fixed third electrodes, and plural fixed fourth electrodes. The first electrodes and their adjacent third electrodes form at least one first capacitor and at least one second capacitor, and the second electrodes and their adjacent fourth electrodes form at least one third capacitor. The capacitance change of the first capacitor reflects the displacement of the proof mass along a first axis, the capacitance change of the second capacitor reflects the displacement of the proof mass along a second axis, and the capacitance change of the third capacitor reflects the displacement of the proof mass along a third axis. The first, second, and third axes define a three-dimensional coordinate system. | 06-06-2013 |
20130152688 | MICRO-ELECTRO-MECHANICAL SENSING DEVICE AND MANUFACTURING METHOD THEREOF - A micro-electro-mechanical sensing device including a substrate, a semiconductor layer, a supporting pillar, a first suspended arm, a connecting member, a second suspended arm, and a proof mass is provided. The semiconductor layer is disposed on or above the substrate. The supporting pillar is disposed on or above the semiconductor layer. The first suspended arm is disposed on the supporting pillar. The supporting connects a portion of the first suspended arm. The connecting member directly or indirectly connects another portion of the first suspended arm. The second suspended arm has a first surface and a second surface opposite to the first surface. The connecting member connects a portion of the first surface. The proof mass connects the second suspended arm and it includes a portion of the second suspended arm as a portion of the proof mass. A method for manufacturing the device is also provided. | 06-20-2013 |
20130334623 | MEMS Sensing Device and Method for the Same - The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface. | 12-19-2013 |
20140109680 | MICRO-ELECTRO-MECHANICAL DEVICE AND METHOD FOR MAKING THE SAME - The invention provides a micro-electro-mechanical device which includes a substrate, an electrode, and a diaphragm. The electrode includes plural vent holes. The diaphragm is disposed above and in parallel to the electrode, to form a capacitive sensor with the electrode. The diaphragm includes plural ribs protruding upward and/or downward from the diaphragm; the ribs are respectively disposed in correspondence to the plural vent holes and do not overlap nor contact the electrode. A method for making the micro-electro-mechanical device is also provided according to the present invention. | 04-24-2014 |
20140144234 | MICRO-ELECTRO-MECHANICAL DEVICE HAVING LOW THERMAL EXPANSION DIFFERENCE - The invention provides a micro-electro-mechanical device which is manufactured by a CMOS manufacturing process. The micro-electro-mechanical device includes a stationary unit, a movable unit, and a connecting member. The stationary unit includes a first capacitive sensing region and a fixed structure region. The movable unit includes a second capacitive sensing region and a proof mass, wherein the first capacitive sensing region and the second capacitive sensing region form a capacitor, and the proof mass region consists of a single material. The connecting member is for connecting the movable unit in a way to allow a relative movement of the movable unit with respect to the stationary unit. | 05-29-2014 |
20150069538 | MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE HAVING DIFFERENTIAL CAPACITORS OF CORRESPONDING SIZES - The invention provides a micro-electro-mechanical device having differential capacitor of corresponding sizes, which includes a substrate; a top fixed electrode; a bottom fixed electrode; a mass, having a top electrode and a bottom electrode, wherein the top electrodes form a top capacitor with the top fixed electrode and the bottom electrodes form a bottom capacitor with the bottom fixed electrode; a top fixed electrode extension wall having an upper end connected to the top fixed electrode and a lower end connected to the substrate; and a bottom fixed electrode extension wall having a lower end connected to the substrate through the bottom electrode, wherein the bottom fixed electrode extension wall has no upper end connected to the top fixed electrode, and total areas of the top fixed electrode extension wall and the top fixed electrode facing the mass are substantially equal to total areas of the bottom fixed electrode extension wall and the bottom fixed electrode facing the mass. | 03-12-2015 |
20150097586 | MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MICRO-ELECTRO- MECHANICAL SYSTEM COMPENSATION STRUCTURE - This invention provides a MEMS device, including: a mass structure having at least one anchor; at least one flexible structure connected with the mass structure at the at least one anchor; a plurality of top electrodes located above the mass structure and forming a top capacitor circuit with the mass structure; and a plurality of bottom electrodes located under the mass structure and forming a bottom capacitor circuit with the mass structure. The projections of the plural top electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor, and the projections of the plural bottom electrodes on the mass structure along a normal direction of the mass structure are located at opposite sides of the anchor. This invention also provides a MEMS compensation structure. | 04-09-2015 |