Minervini
Anthony Minervini, Palos Hills, IL US
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20080217709 | MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF - A plurality of individual MEMS packages are formed as a contiguous unit and each of the plurality of individual MEMS packages include at least one acoustic port. One or more separation boundaries from where to separate adjacent ones of the plurality of individual MEMS packages are determined. Each of the plurality of individual MEMS packages are subsequently separated from the others according to the one or more separation boundaries to provide separate and distinct individual MEMS packages. Each acoustic port disposed within each separate and distinct individual MEMS package is exposed due to the separating so as to allow sound energy to enter each separate and distinct individual MEMS package. | 09-11-2008 |
20100038733 | MICROELECTROMICHANICAL SYSTEM PACKAGE WITH STRAIN RELIEF BRIDGE - A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device. | 02-18-2010 |
20120161258 | PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE - A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate. | 06-28-2012 |
20120161259 | Package With A CMOS Die Positioned Underneath A MEMS Die - A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate. | 06-28-2012 |
20150102390 | INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF PRODUCING THE SAME - A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity. | 04-16-2015 |
Anthony Minervini, Palos Heights, IL US
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20100303274 | Microphone Having Reduced Vibration Sensitivity - A microphone assembly includes a first transducer and a second transducer. The first transducer is coupled to a first substrate layer on a first side of the first substrate layer. The second transducer is coupled to a second substrate layer on a second side of the second substrate layer. The first side and the second side are opposite to each other. The first substrate layer and the second substrate layer are substantially parallel and mechanically coupled. The first transducer and the second transducer have a shared volume and this shared volume is one of a front volume or a rear volume. | 12-02-2010 |
20120039499 | Microphone Having Reduced Vibration Sensitivity - A microphone assembly includes a first transducer and a second transducer. The first transducer is coupled to a first substrate layer on a first side of the first substrate layer. The second transducer is coupled to a second substrate layer on a second side of the second substrate layer. The first side and the second side are opposite to each other. The first substrate layer and the second substrate layer are substantially parallel and mechanically coupled. The first transducer and the second transducer have a shared volume and this shared volume is one of a front volume or a rear volume. | 02-16-2012 |
Anthony Minervini, Palo Hills, IL US
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20140240082 | COMPOSITE FUSE ELEMENT AND METHOD OF MAKING - An improved fuse element for use in a circuit protection fuse. The fuse element may include an insulating substrate portion and a conductive metallic portion disposed on at least one surface of the insulating substrate portion, wherein the metallic portion extends along, and is in continuous, intimate contact with the substrate portion. When the metallic portion melts and separates upon the occurrence of an overcurrent condition, the substrate portion bridges the resulting gap that is formed in the metallic portion and provides electrical arc suppression therein. | 08-28-2014 |
Anthony D. Minervini, Palo Hills, IL US
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20150289045 | MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE HAVING TWO BACK CAVITIES SEPARATED BY A TUNING PORT - Microelectromechanical systems (MEMS) microphones associated with a tunable back cavity are described. Provided implementations can comprise a MEMS acoustic sensor element associated with a first back cavity, which first back cavity can be separated and/or acoustically coupled by a tuning port to a second back cavity. In addition, various physical and acoustic filtering configurations of MEMS microphones and tunable back cavities are described. | 10-08-2015 |
Anthony D. Minervini, Palos Hills, IL US
Patent application number | Description | Published |
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20080217766 | ACOUSTIC TRANSDUCER MODULE | 09-11-2008 |
20110210409 | Surface Mount Silicon Condenser Microphone Package - The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. In some embodiments, the acoustic port is located in the substrate directly under the silicon condenser die which decreases the thickness of the inventive package. | 09-01-2011 |
20120043629 | Surface Mount Silicon Condenser Microphone Package - The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. | 02-23-2012 |
20150021718 | APPARATUS AND METHOD FOR REDUCED STRAIN ON MEMS DEVICES - A method and apparatus for coupling a MEMS device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the MEMS device to the substrate, wherein a first elastomer adheres the MEMS device to the substrate. The MEMS device is electrically connected to the conductor using a wire bond. | 01-22-2015 |
20150146887 | MICROPHONE ON PRINTED CIRCUIT BOARD (PCB) - A MEMS device includes a MEM-CMOS module having a CMOS chip and a MEMS chip. The MEMS chip includes a port exposed to the environment. The MEMS device further includes a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB. | 05-28-2015 |
20150217991 | MEMS DEVICE WITH SPLIT PAD PACKAGE - A device and a microphone are disclosed. The device comprises a circuit board and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. The microphone comprises a circuit board, a seal structure on the circuit board, and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. | 08-06-2015 |
Cristina Minervini, Paramus, NJ US
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20140149200 | DYNAMIC REWARDS PROGRAM - The systems are generally configured to provide rewards. The systems are capable of syncing transaction accounts with one or more reward programs and one or more channels. Moreover, the systems are capable dynamically provisioning rewards in one or more subsets to a rewards program to distribute high, medium and low value rewards to a reward program throughout the duration of the program. | 05-29-2014 |
Giancarlo Minervini, Chicago, IL US
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20100282636 | MICROWAVEABLE NESTED TRAYS - One embodiment includes a package system containing a main container with a smaller container nested in it. The smaller container is filled with a secondary food item designed to be mixed into the primary food item. The smaller container is placed within the main container. The area of the main container not occupied by the smaller container includes a main food item. Both containers are sealed with one film. Before consumption, a consumer will place the package in a microwave to heat. Once heated, the smaller container is removed from the main container, creating space in the main container previously occupied by the smaller container. The main food item in the main container will re-position creating space between the top of the main food item to the edge of the main container. The secondary item can be added into the main container without overflowing out of the main container. | 11-11-2010 |
Joseph V. Minervini, Still River, MA US
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20140028220 | Phase-Lock Loop Synchronization Between Beam Orbit And RF Drive In Synchrocyclotrons - The invention specifies the use of feedback in the radio frequency (RF) drive for a synchrocyclotron, controlling the phase and/or amplitude of the accelerating field as a means to assure optimal acceleration of the beam, to increase the average beam current and to alter the beam orbit in order to allow appropriate extraction as the beam energy is varied. The effect of space charge is reduced by rapid acceleration and extraction of the beam, and the repetition rate of the pulses can be increased. Several means are presented to monitor the phase of the beam in synchrocyclotrons and to adjust the phase and amplitude of the RF to optimize the acceleration of the beam and to adjust the extraction and injection of the beam. Also, the use of a pulsed ion source that matches the acceptance window of the synchrocyclotron is described. | 01-30-2014 |
20140087953 | Ultra-Light, Magnetically Shielded, High-Current, Compact Cyclotron - A cyclotron for ion acceleration is magnetically shielded during ion acceleration by passing electrical current in the same direction through both the first and second superconducting primary coils. A first magnetic-field-shielding coil is on the same side of the mid plane as the first superconducting primary coil, while a second magnetic-field-shielding coil is on the same side of the midplane as the second superconducting primary coil and beyond the outer radius of the second superconducting primary coil. Electrical current is also passed through the magnetic-field-shielding coils in a direction opposite to the direction in which electrical current is passed through the superconducting primary coils and generates a canceling magnetic field that reduces the magnetic field generated at radii from the central axis beyond the magnetic-field-shielding coils. | 03-27-2014 |
Joseph V. Minervini, Cambridge, MA US
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20100099570 | SUPERCONDUCTOR CABLE - Superconductor cable having a plurality of flat, tape-shaped ribbon superconductor wires assembled to form a stack having a rectangular cross section, the stack having a twist about a longitudinal axis of the stack. Multiple superconductor cables including twisted stacked-cables of the flat-tape-shaped superconductor wires, and power cable comprising the twisted flat-tape stacked cables are disclosed. Superconducting power cable disposed within and separated from an electrical insulator with a space passing cryo-coolant between the superconducting cable and insulator is also disclosed. | 04-22-2010 |
Leo Minervini, Paramus, NJ US
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20110215268 | MICRO-POWER GENERATOR FOR VALVE CONTROL APPLICATIONS - A micro-power generator is integrated in a pneumatic valve controller, such that the micro-power generator is powered by the same compressed air supply used to operate the valve. The micro-power generator includes a micro-turbine connected to a DC power generator, and a source of compressed air is used to drive the micro-turbine to generate power via the generator. The system may include a valve controller pneumatically connected to the compressed air supply. The valve controller may include electronics for displaying a condition of the controller. The system can include an electronic field device in communication with the valve controller for displaying a condition of the valve controller. The micro-turbine generator can be electrically connected to the field device to provide power to the electronic field device. Other embodiments are disclosed and claimed. | 09-08-2011 |
20120313625 | VISUAL INDICATOR DEVICE FOR PROXIMITY SENSOR - A device for visually indicating a change in the operational state of a proximity sensor. The device includes a transparent housing having a cavity and a magnet device for generating a magnetic field. In addition, a sleeve is attached to the housing. The magnet device is concealed within the sleeve in a first position to indicate a first operational state. When a target is positioned adjacent the sensor end, magnetic attraction occurs between the target and the magnet device due to the magnetic field to cause movement of the magnet device to a second position within the cavity wherein the magnetic field does not act on the proximity sensor to change the operational state from the first operational state to a second operational state. Further, the magnet device is visible in the second position to indicate the second operational state. The target is attached to a moving element of the valve such as a valve stem such that a change in operational state of the proximity sensor corresponds to a change in operational state of the valve. | 12-13-2012 |
Leo Minervini, Saddle Brook, NJ US
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20090088906 | KNOWLEDGE BASED VALVE CONTROL METHOD - A method associated with a valve controller configured to capture dynamic process conditions for monitoring, diagnosing and maintaining a valve assembly through knowledge-based valve performance criteria. The method includes determining the open and closed positions of a process valve. Measuring the peak torque value required by an actuator to open and close the process valve. Measuring the supply and exhaust pressure required by an actuator to open and close the valve. Determining a deviation zone associated with the peak torque value to open the valve where an alarm is triggered when the torque value falls outside the deviation zone. Creating the dynamic baseline over N | 04-02-2009 |
20100155632 | Valve Controller - A controller for controlling a valve is disclosed including a manifold assembly, a valve position indicator and a trigger assembly. An operating media distribution system is disposed in the manifold assembly and an electronic control unit is disposed in the controller. The electronic control unit operates at least one electromagnetic valve to control operating media flow via the operating media distribution system to activate an actuator which opens or closes the valve. The trigger assembly includes a cylinder adapted to receive an actuator shaft and provide a self setting mechanism corresponding to the stroke length of the actuator shaft. | 06-24-2010 |
Leo Minervini US
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20140069508 | Virtual Limit Switch - A method associated with a valve package having a process valve, an actuator and a controller. The method includes obtaining a baseline signature corresponding to opening or closing the valve as the valve moves from a first position to a second position. The method also includes obtaining an operating signature corresponding to values associated with the baseline signature each time the valve moves from the first position to the second position. In addition, the operating signature is compared to the baseline signature. The method further includes determining if one or more of the values associated with the operating signature is within an acceptable range from the corresponding one or more values in the baseline signature. | 03-13-2014 |