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Min Zheng

Min Zheng, Milpitas, CA US

Patent application numberDescriptionPublished
20090009907Laminated film for head applications - A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk).01-08-2009
20090323227Ta/W film as heating device for dynamic fly height adjustment - A dynamic fly heater (DFH) for improved lifetime and better film uniformity is disclosed for a magnetic head. The heater has a lower amorphous Ta layer and an upper W layer to promote small grain size and reduced electro-migration. The composite film is especially advantageous for heaters greater than 1000 Angstroms thick where dR/R is difficult to control in the prior art. The DFH may be a (Ta/W)12-31-2009
20100119874Laminated high moment film for head applications - A laminated high moment film with a non-AFC configuration is disclosed that can serve as a seed layer for a main pole layer or as the main pole layer itself in a PMR writer. The laminated film includes a plurality of (B/M) stacks where B is an alignment layer and M is a high moment layer. Adjacent (B/M) stacks are separated by an amorphous layer that breaks the magnetic coupling between adjacent high moment layers and reduces remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. The amorphous material layer may be made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, Ti, Cr, Nb, or Si, or may be Hf, Zr, Ta, Nb, CoFeB, CoB, FeB, or CoZrNb. Alignment layers are FCC soft ferromagnetic materials or non-magnetic FCC materials.05-13-2010
20100276272Method for fabricating a high coercivity hard bias structure for magnetoresistive sensor - A hard bias (HB) structure for longitudinally biasing a free layer in a MR sensor is disclosed that includes a mildly etched seed layer and a hard bias (HB) layer on the etched seed layer. The HB layer may contain one or more HB sub-layers stacked on a lower sub-layer which contacts the etched seed layer. Each HB sub-layer is mildly etched before depositing another HB sub-layer thereon. The etch may be performed in an IBD chamber and creates a higher concentration of nucleation sites on the etched surface thereby promoting a smaller HB average grain size than would be realized with no etch treatments. A smaller HB average grain size is responsible for increasing Hcr in a CoPt HB layer to as high as 2500 to 3000 Oe. Higher Hcr is achieved without changing the seed layer or HB material and without changing the thickness of the aforementioned layers.11-04-2010
20100330395Thin seeded Co/Ni multiplayer film with perpendicular anisotropy for read head sensor stabilization - A hard bias (HB) structure for producing longitudinal bias to stabilize a free layer in an adjacent spin valve is disclosed and includes a composite seed layer made of at least Ta and a metal layer having a fcc(111) or hcp(001) texture to enhance perpendicular magnetic anisotropy (PMA) in an overlying (Co/Ni)12-30-2010

Min Zheng, Shenzhen City CN

Patent application numberDescriptionPublished
20100332697STORAGE DEVICE AND STORAGE DEVICE ASSEMBLY - A storage device includes a USB connector, a storage module, a first USB receiver, and a multiplexer. The USB connector is configured for connected to a computer. The storage module is configured for storing data. The first USB receiver is configured to receive a second storage device. The multiplexer is connected to the USB connector and the first USB receiver, and is capable of accessing the storage module, wherein the multiplexer is capable of accessing the storage module and the second storage device at the same time when the USB connector is connected to the computer and the second storage device is connected to the first USB receiver.12-30-2010

Min Zheng, Pembroke Pines, FL US

Patent application numberDescriptionPublished
20100159605Method of Correction of Particle Interference to Hemoglobin Measurement - A method of correction of particle interference to hemoglobin measurement of a blood sample on a hematology analyzer is provided. The method includes mixing an aliquot of a blood sample with a lytic reagent to lyse red blood cells and forming a sample mixture; measuring absorbance of the sample mixture at a predetermined wavelength of a hemoglobin chromogen formed in the sample mixture, and obtaining an apparent hemoglobin concentration of the blood sample using obtained absorbance; measuring concentration and size of cellular particles remaining in the sample mixture; removing contribution of the cellular particles to the apparent hemoglobin concentration using the concentration and the size of the cellular particles to obtain a corrected hemoglobin concentration of the blood sample; and reporting the corrected hemoglobin concentration of the blood sample.06-24-2010

Min Zheng, Harrisburg, PA US

Patent application numberDescriptionPublished
20090130845DIRECT ELECTRODEPOSITION OF COPPER ONTO TA-ALLOY BARRIERS - A method of depositing copper directly onto a tantalum alloy layer of an on-chip copper interconnect structure, which includes electrodepositing copper from a neutral or basic electrolyte onto a surface of a tantalum alloy layer, in which the tantalum alloy layer is deposited on a substrate of the on-chip copper interconnect structure, and in which the copper nucleates onto the surface of the tantalum alloy layer without use of a seed layer to form a copper conductor.05-21-2009