Patent application number | Description | Published |
20090129353 | METHOD FOR RECOGNIZING AVAILABLE CHANNEL IN IEEE 802.15.4 PROTOCOL CSMA/CA MECHANISM - Disclosed is a method of recognizing an available channel in order to prevent channel occupation requirements from colliding with each other when one wireless channel is shared by plural terminals in a CSMA/CA mechanism using an IEEE 802.15.4 protocol slot, the method including: a first step of initializing a counter, CW, as 2, the CW being used for CCA which an attempt to perform is made before frame transmission; a second step of determining if a required channel is occupied; a third step of decreasing the CW by 1 when the channel is idle in the second step; a fourth step of re-determining if the channel is occupied; and a fifth step of, based on a determination result in the fourth step, determining if the CW is 1 when the channel is occupied. | 05-21-2009 |
20090154489 | METHOD FOR DISTRIBUTING CONTENTION AMONG TERMINALS IN CONTENTION ACCESS PERIOD OF SUPERFRAME - Disclosed is a method for distributing contention among terminals in a Contention Access Period (CAP) of a superframe in regard to a Medium (or Media) Access Control (MAC) layer employing a beacon-enabled mode in IEEE 802.15.4 standard. The method includes: dividing the CAP or the superframe into a plurality of sub-periods, all having the same size; receiving an association request message from a relevant terminal; and allocating one of the plurality of sub-periods to the relevant terminal, and transferring information on the sub-periods to the relevant terminal through a beacon frame, by a Personal Area Network (PAN) coordinator. | 06-18-2009 |
20090175622 | METHOD FOR ALLOCATING UPSTREAM TRANSMISSION BANDWIDTH IN WDM-EPON - Disclosed is a method fox allocating upstream transmission bandwidth so as to prevent Inter-Scheduling Cycle Gaps (ISCGs) from occurring in an N number of Optical Network Units (ONUs) by using an m number of wavelength channels for upstream transmission in a Wavelength-Division Multiplexing (WDM)-Ethernet Passive Optical Network (EPON). The method includes: grouping the ONUs to be allocated each of the m number of wavelength channels; and performing a Dynamic Bandwidth Allocation (DBA) algorithm in order for the grouped ONUs to efficiently use allocated wavelengths and time slots, thereby allocating each wavelength channel. Accordingly, by using a scheme of managing ONUs by each group, it is possible to more efficiently allocate bandwidth than the online scheduling scheme. As compared with the offline scheduling scheme, ISCGs caused by bandwidth allocation do not occur. | 07-09-2009 |
20090190606 | SYSTEM AND METHOD FOR POLLING IN ETHERNET PASSIVE OPTICAL NETWORK - Disclosed is a system and a method for polling in an Ether net Passive Optical Network (EPON). The system includes: multiple Optical Network Units (ONUs) for sharing optical channels of the EPON with one another and transmitting traffic; and an Optical Line Terminal (OLT) for discriminating a plurality of ONUs gaining access to the EPON among the multiple ONUs and then collecting routing information on the plurality of ONUs gaining access to the EPON, and for classifying the plurality of ONUs gaining access to the EPON into two or more ONU groups according to the collected routing information and then carrying out forming a polling cycle and allocating bandwidth on each ONU group. Therefore, a transmission idle period in a traffic channel is not only minimized, but an availability ratio of traffic channels can also be maximized. | 07-30-2009 |
20120115474 | METHOD FOR DECIDING UNREGISTERED MACROCELL USER EQUIPMENT ADJACENT TO FEMTOCELL BASE STATION - In a method for deciding an unregistered macrocell user equipment (MUE) adjacent to a femtocell base station (home evolved node B; HeNB), a macrocell base station (macro evolved node B; MeNB) decides occurrence of an unregistered MUE influenced by interference from a HeNB among MUEs. The MeNB requests an adjacent HeNB to transmit system information (SI) of the adjacent HeNB of which interference has influence on the unregistered MUE, and the unregistered MUE searches for the SI of the adjacent HeNB and transmits the searched SI to the MeNB, when it is decided that the unregistered MUE has occurred. The MeNB informs the adjacent HeNB of existence of the unregistered MUE using a closed subscriber group identifier (CSG ID) of the SI of the adjacent HeNB, transmitted from the unregistered MUE. | 05-10-2012 |
20120120822 | APPARATUS AND METHOD FOR HANDOVER USING RECEIVED SIGNAL STRENGTH AND RADIAL VELOCITY IN TERMINAL - Provided is a handover apparatus and method for a terminal based on a received signal strength (RSS) and a radial velocity. The handover method may measure an RSS from a currently accessed base station and RSSs from candidate base stations for handover, may measure a radial velocity with respect to the currently accessed base station and radial velocities with respect to the candidate base stations for handover, and may perform a handover by determining a base station for handover based on the measured RSSs and the measured radial velocities when the RSS from the currently accessed base station is less than or equal to a reference RSS. | 05-17-2012 |
20120182925 | SCHEDULING APPARATUS AND METHOD, USER EQUIPMENT, AND RELAY-BASED MOBILE COMMUNICATION SYSTEM - Provided are a scheduling apparatus and method, an user equipment, and a relay-based mobile communication system. The scheduling apparatus receives information on a channel state of the access zone from the eNB UE separately from the information on the channel state of the relay zone, performs scheduling for the eNB UE in a subsequent relay zone temporally following the relay zone on the basis of the information on the channel state of the relay zone, and performs scheduling for the eNB UE in a subsequent access zone temporally following the access zone on the basis of the information on the channel state of the access zone. | 07-19-2012 |
20140233432 | PCRF AND PCC RULE SETTING METHOD IN A MOBILE COMMUNICATION NETWORK - A PCEF for setting a PCC rule in a mobile communication network includes: a receiver for receiving a command message including a monitoring key list including at least one monitoring key corresponding to a PCC rule and a number of instances monitored in a corresponding service, from a Policy and Charging Rules Function (PCRF); a setting unit for setting the PCC rule based on the command message and setting a monitoring key according to the at least one monitoring key; and a monitoring processor for setting a range of monitoring in consideration of the number of instances and the at least one monitoring key, and performing monitoring based on the set range of the monitoring. | 08-21-2014 |
20140269387 | SCHEDULING METHOD AND APPARATUS IN SYSTEM PERFORMING DEVICE-TO-DEVICE COMMUNICATION - A link scheduling method in a system for performing Device-to-Device (D2D) communication includes periodically collecting information indicating whether to perform a medium access from at least one neighboring link determining at least one link expected to perform a medium access in a corresponding traffic slot among links with a higher priority than the terminal based on the collected information, and determining whether to perform the medium access of the terminal by considering only the at least one link expected to perform the medium access. | 09-18-2014 |
20150373651 | METHOD AND APPARATUS FOR CONTROLLING TRANSMISSION POWER OF DEVICE-TO-DEVICE COMMUNICATION NETWORK - The present invention is to provide a method and device for controlling transmission power by taking comprehensive consideration not only of the effect received onto itself in each device-to-device (D2D) link of a D2D communication network but also of the effect exerted onto the neighboring links. According to an embodiment of the present invention, a processing method in a transmission terminal of a first link for controlling the transmission power of the transmission terminals of links in a D2D communication network, which includes terminals of at least the first link and terminals of a second link adjacent to the first link includes: measuring the strengths of first detection signals transmitted from reception terminals of the first link and the second link; and determining a first transmission power adjustment ratio for the transmission terminal of the first link so that a signal-to-interference ratio of the second link is greater than or equal to a predetermined threshold value on the basis of the measured strengths of the first detection signals. | 12-24-2015 |
Patent application number | Description | Published |
20100251469 | UPPER BODY SUPPORT APPARATUS FOR TOILETS - An upper body support apparatus for toilets is disclosed. The upper body support apparatus includes a support board ( | 10-07-2010 |
20100286523 | ULTRASOUND DIAGNOSTIC SYSTEM AND METHOD FOR DISPLAYING DOPPLER SPECTRUM IMAGES OF MULTIPLE SAMPLE VOLUMES - The embodiment of the present invention provides an ultrasound diagnostic system, including: an ultrasound diagnosis unit for transmitting ultrasound signals to a target object and receiving ultrasound echo signals to acquire B-mode image signals and Doppler spectrum image signals; a processor for forming at least one B-mode image based on the B-mode image signals and forming a plurality of Doppler spectrum images for a plurality of sample volumes designated on the B-mode image based on the Doppler spectrum image signals; a user input unit for allowing a user to input selection information indicating locations and sizes of the plurality of sample volumes; and an image display unit for displaying at least one B-mode image and the plurality of Doppler spectrum images. | 11-11-2010 |
20100293705 | UPPER BODY SUPPORT APPARATUS FOR TOILETS - The preset invention provides an upper body support apparatus for toilets which enables a user to place his/her arms thereon when having a bowel movement. The upper body support apparatus ( | 11-25-2010 |
20120094022 | METHOD OF FORMING METAL THIN FILM - Provided is a method of forming a metal thin film which can reduce leakage current while improving electric properties by improving step coverage of a device. The method of forming a metal thin film includes supplying a metal precursor including chlorine, purging byproducts produced after the supplying of the metal precursor by injecting a purge gas, supplying a reactant to allow the reactant and the metal precursor to react with each other to form a thin film layer, and purging the byproducts produced after the reaction by injecting a purge gas, wherein before the supplying of the metal precursor, the method further includes supplying a reactant to be adsorbed on a treated product. | 04-19-2012 |
20120225548 | METHODS OF FORMING DIELECTRIC LAYERS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME - To form a dielectric layer, an organometallic precursor is adsorbed on a substrate loaded into a process chamber. The organometallic precursor includes a central metal and ligands bound to the central metal. An inactive oxidant is provided onto the substrate. The inactive oxidant is reactive with the organometallic precursor. An active oxidant is also provided onto the substrate. The active oxidant has a higher reactivity than that of the inactive oxidant. | 09-06-2012 |
20130244445 | Method of Fabricating Semiconductor Device - Methods of fabricating a semiconductor device include forming a deposited film on a semiconductor substrate in a process chamber by repeatedly forming unit layers on the semiconductor substrate. The unit layer is formed by forming a preliminary unit layer on the semiconductor substrate by supplying a process material including a precursor material and film-control material into the process chamber, purging the process chamber, forming a unit layer from the preliminary unit layer, and again purging the process chamber. The precursor material includes a central atom and a ligand bonded to the central atom, and the film-control material includes a hydride of the ligand. | 09-19-2013 |
20140183201 | FOOD PACKING MATERIAL HAVING HYDROPHOBICITY, MANUFACTURING METHOD AND MOLD THEREOF - Provided is an food packing material, manufacturing method and mold thereof having hydrophobicity including a number of columns formed in one side of food packing material. The disclosure may provide food packing material, manufacturing method and mold thereof in which an amount of contents off a wall of the food packing material may be minimized by hydrophobicity. | 07-03-2014 |
20140234585 | FOOD PACKAGING MATERIAL HAVING UNIFORM COATING OF OIL, METHOD OF MANUFACTURING THE SAME, MOLD FOR MANUFACTURING THE SAME - The present invention relates to a food packaging material for packing food, more particularly to a food packaging material having a uniform coating of oil, a method of manufacturing the same, and a mold for manufacturing the same. The food packaging material includes a plurality of grooves formed on one surface of the food packaging material; and an oil layer uniformly applied to the one surface of the food packaging material, being put into the grooves. According to the present invention, there are provided a food packaging material which continuously maintains a uniform coating of oil and thus minimizes sticking of contents to a surface of the packaging material, a method of manufacturing the same, and a mold for manufacturing the same. | 08-21-2014 |
Patent application number | Description | Published |
20090282188 | MEMORY DEVICE AND CONTROL METHOD - A memory device includes a first controller and a second controller. The first controller receives a first command from a host and stores the first command in a first command queue, and transmits the first command to the second controller relating to the first command stored in the first command queue. The second controller transmits the first command stored in the second command queue to a flash memory. | 11-12-2009 |
20100088467 | MEMORY DEVICE AND OPERATING METHOD OF MEMORY DEVICE - A memory device may include a non-volatile memory and non-volatile RAM. The non-volatile memory may include a data block and a metadata block. Metadata information with respect to the data block may be included in the metadata block. A portion of metadata with respect to the data block or the metadata with respect to the metadata block may be stored in the non-volatile RAM. | 04-08-2010 |
20100131736 | MEMORY DEVICE AND METHOD OF OPERATION - A memory device includes a data block storing first data, and a log block storing second data that is an updated value of the first data. A spare area of the log block stores a first mapping table including mapping information between the first data and the second data. | 05-27-2010 |
20100146163 | MEMORY DEVICE AND MANAGEMENT METHOD OF MEMORY DEVICE - A memory device and a method of managing a memory are provided. The memory device includes a command queue configured to receive a first command from a host to store the first command, and to read and transmit the first command, a controller configured to read, from a storage device, data corresponding to the first command transmitted from the command queue, and to store the data in a buffer memory, and a first memory configured to store a data list of data stored in the buffer memory, wherein, in response to the command queue receiving the first command from the host, the controller updates the data list of data stored in the first memory. | 06-10-2010 |
20100235566 | FLASH MEMORY APPARATUS AND METHOD OF CONTROLLING THE SAME - Described herein is a flash memory apparatus and method controlling the same. The flash memory apparatus includes a processor and one or more flash memory units. The processor controls one or more memory operations performed in the one or more flash memory units. The processor stops controlling a memory operation in a flash memory unit when the memory operation is performed, and continues performing the memory operation in the flash memory unit when the flash memory unit generates an interrupt signal. | 09-16-2010 |
20140203451 | ELECTRONIC DEVICE PACKAGE AND PACKAGING SUBSTRATE FOR THE SAME - The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively. | 07-24-2014 |
20140265903 | LIGHT-EMITTING DEVICE PACKAGE AND LIGHT-EMITTING APPARATUS - A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit. | 09-18-2014 |
20140306261 | ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME - There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole. | 10-16-2014 |
20140339581 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - A semiconductor light emitting device package is provided having a light transmissive substrate, and a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially laminated on the light transmissive substrate. The light emitting structure comprises a first surface and a second opposing surface facing the light transmissive substrate. The semiconductor light emitting device package comprises a via penetrating the second conductivity-type semiconductor layer and the active layer, and exposing the first conductivity-type semiconductor layer. A first electrode has a first portion disposed on the first surface, and a second portion extending into the via and contacting the first conductivity-type semiconductor layer. An insulating layer is disposed between the first electrode, and each of the second conductivity type semiconductor layer, the active layer, and the first surface. A second electrode is disposed on the first surface. | 11-20-2014 |
20150228867 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DEVICE USING THE SAME - A light emitting diode package includes a package body having first and second electrode structures, a light emitting diode chip having a surface, on which first and second electrodes are disposed. The light emitting diode chip is disposed on the first and second electrode structures of the package body. A sheet-type wavelength conversion layer having a substantially constant thickness is disposed on an upper surface of the light emitting diode chip, and an encapsulating portion is disposed to surround the light emitting diode chip and the wavelength conversion layer. The encapsulating portion has an upper surface substantially parallel to the wavelength conversion layer. Side surfaces of the encapsulating portion have a plurality of side slope sections inclined toward the upper surface of the encapsulating portion. | 08-13-2015 |
20150236228 | LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween. | 08-20-2015 |
20150348906 | ELECTRONIC DEVICE PACKAGE - An electronic device package may include a package body, an electronic device, and at least one conductive via. The package body includes a first surface and a second surface opposite to the first surface. The electronic device is disposed on the first surface. The at least one conductive via extends through the package body and includes a first end located in a mounting region of the first surface corresponding to a region on which the electronic device is disposed. The first end may have a first dimension measured along a first direction greater than a second dimension measured along a second direction substantially perpendicular to the first direction. | 12-03-2015 |
Patent application number | Description | Published |
20090027529 | Image sensor with wide operating range - An image sensor includes a photoelectric converter, a source-follower transistor, and a selection transistor. The photoelectric converter generates electric charge in response to received light, and the electric charge varies a voltage of a detection node. The source-follower transistor is coupled between the detection node and an output node and has a first threshold voltage. The selection transistor is coupled between the source-follower transistor and a voltage node with a power supply voltage or a boosted voltage applied thereon, and has a second threshold voltage with a magnitude that is less than a magnitude of the first threshold voltage such that the source-follower transistor operates in saturation. | 01-29-2009 |
20090130792 | Method of fabricating image sensor - A method of fabricating an image sensor includes forming a photoelectric transformation device on a substrate and forming a dielectric layer structure on the substrate. The dielectric layer structure includes multi-layer interlayer dielectric layers and multi-layer metal interconnections which are located between the multi-layer interlayer dielectric layers. A cavity which penetrates the multi-layer interlayer dielectric layers on the photoelectric transformation device is formed. A heat treatment is performed on the substrate on which the cavity is formed. | 05-21-2009 |
20090137111 | METHOD OF FABRICATING METAL INTERCONNECTION AND METHOD OF FABRICATING IMAGE SENSOR USING THE SAME - A method of fabricating a metal interconnection and a method of fabricating image sensor using the same are provided. The method of fabricating a metal interconnection including forming a interlayer dielectric layer on a substrate, forming an interconnection formation region in the interlayer dielectric layer, performing an ultraviolet (UV) treatment on the substrate after the interconnection formation region is formed and forming a metal interconnection in the interconnection formation region. | 05-28-2009 |
20110294288 | METHOD OF FABRICATING METAL INTERCONNECTION AND METHOD OF FABRICATING IMAGE SENSOR USING THE SAME - A method of fabricating a metal interconnection and a method of fabricating image sensor using the same are provided. The method of fabricating a metal interconnection including forming a interlayer dielectric layer on a substrate, forming an interconnection formation region in the interlayer dielectric layer, performing an ultraviolet (UV) treatment on the substrate after the interconnection formation region is formed and forming a metal interconnection in the interconnection formation region. | 12-01-2011 |
20120009719 | IMAGE SENSORS INCLUDING HYDROPHOBIC INTERFACES AND METHODS OF FABRICATING THE SAME - A method of fabricating an image sensor device includes forming an insulating layer on a substrate including a photodiode therein, and forming a wiring structure on the insulating layer. The wiring structure includes at least one wiring layer and at least one insulating interlayer. A cavity is formed extending into the wiring structure over the photodiode to expose a surface of the at least one insulating interlayer. The surface of the at least one insulating interlayer exposed by the cavity is modified to define a hydrophobic surface. Related systems and devices are also discussed. | 01-12-2012 |
20140264509 | Image Sensors Including Hydrophobic Interfaces and Methods of Fabricating the Same - A method of fabricating an image sensor device includes forming an insulating layer on a substrate including a photodiode therein, and forming a wiring structure on the insulating layer. The wiring structure includes at least one wiring layer and at least one insulating interlayer. A cavity is formed extending into the wiring structure over the photodiode to expose a surface of the at least one insulating interlayer. The surface of the at least one insulating interlayer exposed by the cavity is modified to define a hydrophobic surface. Related systems and devices are also discussed. | 09-18-2014 |
Patent application number | Description | Published |
20150221976 | ELECTROLYTE AND RECHARGEABLE LITHIUM BATTERY INCLUDING SAME - An electrolyte for a rechargeable lithium battery includes a lithium salt, a non-aqueous organic solvent, and an additive. The additive is represented by Chemical Formula 1, and is included in an amount of about 0.05 wt % to about 3 wt % based on the total amount of the electrolyte. A rechargeable lithium battery including the same is also disclosed. | 08-06-2015 |
20150244029 | ELECTROLYTE AND RECHARGEABLE LITHIUM BATTERY INCLUDING SAME - Disclosed are an electrolyte for a rechargeable lithium battery including a lithium salt, a non-aqueous organic solvent, and an additive represented by the following Chemical Formula 1, and a rechargeable lithium battery including the same. | 08-27-2015 |
20150295275 | ELECTROLYTE FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME - An electrolyte for a rechargeable lithium battery includes a lithium salt, an organic solvent and an additive. The organic solvent includes a sulfur-containing compound represented by Chemical Formula 1, and the additive includes a phosphazene compound represented by Chemical Formula 2. A rechargeable lithium battery including the electrolyte may have improved performance and safety. | 10-15-2015 |
20160006076 | ELECTROLYTE FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING SAME - Disclosed are an electrolyte for a rechargeable lithium battery including a lithium salt, organic solvent and an additive including a compound represented by the following Chemical Formula 1 and a rechargeable lithium battery including the same. | 01-07-2016 |
20160056505 | ELECTROLYTE AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME - An electrolyte for a rechargeable lithium battery and a rechargeable lithium battery, the electrolyte including a lithium salt, a non-aqueous organic solvent, and an additive represented by the following Chemical Formula 1: | 02-25-2016 |
Patent application number | Description | Published |
20080278921 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, AND PRINTED CIRCUIT BOARD - Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts. | 11-13-2008 |
20080291652 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE - Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess. | 11-27-2008 |
20080308913 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A stacked semiconductor package includes a first semiconductor package, a second semiconductor package and a conductive connection member. The first semiconductor package includes a first semiconductor chip, a first lead frame having first outer leads that are electrically connected to the first semiconductor chip, and a first molding member formed on the first semiconductor chip and the first lead frame to expose the first outer leads. The second semiconductor package includes a second semiconductor chip, a second lead frame formed on the first molding member and having second outer leads that may be electrically connected to the second semiconductor chip, and a second molding member formed on the second semiconductor chip and the second lead frame to expose the second outer leads. The conductive connection member may electrically connect the first outer leads and the second outer leads to each other. Further, the conductive connection member may have a crack-blocking groove. | 12-18-2008 |
20090184410 | SEMICONDUCTOR PACKAGE APPARATUS HAVING REDISTRIBUTION LAYER - Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity. | 07-23-2009 |
Patent application number | Description | Published |
20080237889 | Semiconductor package, method of fabricating the same, and semiconductor package mold - Provided is a semiconductor package, which may include a plurality of semiconductor chips to form a multi-stack semiconductor package (MSP), a method of fabricating the semiconductor package and the MSP, and a semiconductor package mold for fabricating the semiconductor package. The semiconductor package may include a first semiconductor chip package having a first substrate including a first surface having a center portion on which a first semiconductor chip is mounted, and at least one first boundary portion on which a plurality of conductive connection pad groups are formed, and a molding member including a body that covers the first semiconductor chip, and at least one extension that extends from the body towards a corner portion of the first surface of the first substrate, wherein the extension extends while avoiding the conductive connection pad group. The semiconductor package may further include a second semiconductor chip package stacked on the first semiconductor chip package, the second semiconductor chip including a second substrate on which at least one second semiconductor chip that is electrically connected to the conductive connection pad group may be mounted. | 10-02-2008 |
20090121332 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring. | 05-14-2009 |
20100007007 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions. | 01-14-2010 |
20130154136 | METHOD AND DEVICE FOR FORMING REFLECTOR IN LIGHT EMITTING DEVICE PACKAGE - A method of forming a plurality of reflectors for a light emitting device (LED) package includes receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus; passing the first fluid material through a transfer passageway of the upper mold; expelling the first fluid material from the transfer passageway through a plurality of openings in a lower internal surface of a transfer chamber of the transfer passageway; depositing the first fluid material on a lead frame, disposed on a lower mold of the transfer apparatus, through the plurality of openings; forming the first fluid material into a plurality of molded structures using the upper mold and the lower mold; and hardening each of the molded structures to form a plurality of reflectors. | 06-20-2013 |
Patent application number | Description | Published |
20110235308 | BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME - A display apparatus with at least two light guide plates, each including a light incident surface and a light exiting surface, the light guide plates being spaced apart from each other so as to form a gap therebetween. The display apparatus also has a light source disposed adjacent to at least one side portion of the light guide plates to emit light to the light incident surface, a display panel positioned to receive light from the light exiting surfaces to facilitate display of an image, and a diffusion member. The diffusion member covers the gap, so as to diffuse light directed toward the display panel. | 09-29-2011 |
20120002444 | BACKLIGHT UNIT OF LIQUID CRYSTAL DISPLAY - Provided is a backlight unit of a liquid crystal display (LCD). The backlight unit includes: a plurality of light guide plates (LGPs) arranged in M layers and separated from each other by a predetermined gap, wherein M is a natural number equal to or greater than two, a light source unit disposed on at least one side surface of each of the LGPs and including N light source blocks whose brightnesses are controlled individually, and wherein N is a natural number equal to or greater than two. The backlight unit further includes a plurality of light output regions defined by each of the LGPs being divided into a plurality of regions according to a distance from the light source unit and by a plurality of light output patterns being formed in some of the regions, and wherein the light output regions do not overlap each other in a stacking direction of the LGPs and are arranged to correspond to a whole surface of the LGPs. | 01-05-2012 |
20120327685 | LIGHT GUIDE PLATE FOR BACKLIGHT AND MANUFACTURING METHOD THEREFOR - A light guide plate for a backlight. The light guide plate includes: a light source unit for generating light; a light guide plate proximate to the light source unit and including an upper surface and a lower surface; and a light emission pattern configured to diffuse a portion of the light directed toward an image display panel, and a first straight pattern configured to channel the light along a direction substantially parallel to a direction of propagation of the light generated by the light source unit, both the light emission pattern and the first straight pattern being disposed on one of the upper surface and the lower surface of the light guide plate, in which the first straight pattern has peaks and valleys formed in alternating and repeating manner in a direction substantially perpendicular to a direction of propagation of the light generated by the light source unit. | 12-27-2012 |
20130039093 | BACKLIGHT ASSEMBLY WITH UNIFORM LIGHT DISTRIBUTION - A backlight assembly includes a light guide plate having at least five sides. There is a first side. A second side is parallel to and equal in length to the first side. A third side is perpendicular to the first and second sides. A fourth side is parallel to and shorter in length than the third side. There is at least one oblique side connecting the fourth side to the first or second side. The backlight assembly additionally includes a light source unit disposed the fourth side and the oblique side of the light guide plate. | 02-14-2013 |
20130077348 | LIGHT MODULE AND BACKLIGHT ASSEMBLY INCLUDING THE SAME - A light module for a backlight assembly that prevents metal wiring from being damaged at a bent portion and a backlight assembly including the same are presented. The light module for the backlight assembly includes: a printed circuit board (PCB) including a first portion and a second portion connected by a connection having a bend; a first light source formed on the first portion of the printed circuit board (PCB); a second light source formed on the second portion of the printed circuit board (PCB); a first wiring connecting member connected to the first light source and formed on the first portion; and a second wiring connecting member connected to the second light source and formed on the second portion, wherein the first wiring connecting member and the second wiring connecting member are connected to each other. | 03-28-2013 |
20130279200 | BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME - A display apparatus with at least two light guide plates, each including a light incident surface and a light exiting surface, the light guide plates being spaced apart from each other so as to form a gap therebetween. The display apparatus also has a light source disposed adjacent to at least one side portion of the light guide plates to emit light to the light incident surface, a display panel positioned to receive light from the light exiting surfaces to facilitate display of an image, and a diffusion member. The diffusion member covers the gap, so as to diffuse light directed toward the display panel. | 10-24-2013 |
20140049723 | DISPLAY APPARATUS - A display apparatus includes a backlight assembly which provides a light and a display panel which receives the light provided from the backlight assembly to display an image. The backlight assembly includes a light source which generates the light, and a light guide plate. The light guide plate receives the light generated from the light source through an incident surface thereof as an incident light, and outputs the incident light through an exit surface thereof as an exit light. The light guide plate includes a first optical pattern and a second optical pattern. The first optical pattern is disposed corresponding to a first area of the exit surface and collects the incident light. The second optical pattern is disposed corresponding to a remaining second area of the exit surface excluding the first area, and collects the exit light. | 02-20-2014 |
20140133178 | BACKLIGHT UNIT AND DISPLAY DEVICE HAVING THE SAME - A display device includes a backlight unit generating light and a display panel displaying an image using the light from the backlight unit. The backlight unit includes a circuit board, a plurality of light emitting devices, a light guide member including a light incident surface, and a guide member disposed between a surface of the circuit board and the light incident surface. The guide member uniformly maintains a distance between the light incident surface and the light emitting devices. Thus, a light loss is reduced. | 05-15-2014 |
20140204612 | LIGHT GUIDE PLATE FOR BACKLIGHT AND MANUFACTURING METHOD THEREFOR - A light guide plate for a backlight. The light guide plate includes: a light source unit for generating light; a light guide plate proximate to the light source unit and including an upper surface and a lower surface; and a light emission pattern configured to diffuse a portion of the light directed toward an image display panel, and a first straight pattern configured to channel the light along a direction substantially parallel to a direction of propagation of the light generated by the light source unit, both the light emission pattern and the first straight pattern being disposed on one of the upper surface and the lower surface of the light guide plate, in which the first straight pattern has peaks and valleys formed in alternating and repeating manner in a direction substantially perpendicular to a direction of propagation of the light generated by the light source unit. | 07-24-2014 |
20150092440 | LIGHT GUIDE PANEL, BACK LIGHT ASSEMBLY AND DIPLAY APPARATUS EACH HAVING THE LIGHT GUIDE PANEL AND METHOD OF MANUFACTURING THE LIGHT GUIDE PANEL - A Light guide panel, back light assembly and display apparatus are provided. According to an aspect of the inventive concept, there is provided the light guide panel which includes a top surface, a bottom surface, and four side surfaces, and one of the four side surfaces may be a light incident surface. | 04-02-2015 |
20150098249 | GUIDE PLATE AND BACKLIGHT ASSEMBLY INCLUDING THE SAME - Disclosed is a light guide plate including a base sheet and a first light transmissive adhesive layer disposed on a surface of the base sheet. The first light transmissive adhesive layer together with the base sheet define a light entrance portion. The thickness of the first light transmissive adhesive layer becomes gradually smaller from the light entrance portion toward a center portion of the base sheet. A backlight assembly includes the light guide plate. | 04-09-2015 |
20150160513 | BACKLIGHT ASSEMBLY AND DISPLAY DEVICE INCLUDING THE SAME - A backlight assembly and a display device including the same are provided. A backlight assembly includes a light source portion including a plurality of light sources having a first light source and a second light source, the second light source emits light of a color that is different from a color of light emitted from the first light source, and a reflective member that is adjacent to an edge portion of the light source portion, wherein the reflective member includes a base layer including a first region that faces the first light source and a second region that faces the second light source, and a plurality of color patterns including a plurality of first color patterns that are positioned on the first region of the base layer and a plurality of second color patterns that are positioned on the second region of the base layer, wherein the plurality of first color patterns and the plurality of second color patterns have different colors. | 06-11-2015 |
20150160514 | BACKLIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - Provided are a backlight assembly and a display device having the same. The backlight assembly includes a light source unit comprising a plurality of light sources, and a reflective member disposed adjacent to an edge portion of the light source unit. The reflective member includes a base layer, and a plurality of protruding patterns disposed on the base layer and facing the light source unit. | 06-11-2015 |
20150219817 | LIGHT GUIDE PANEL, RELATED BACKLIGHT UNIT, RELATED DISPLAY DEVICE, AND RELATED MANUFACTURING METHOD - A light guide panel may include a first surface, a second surface overlapping the first surface, and a third surface oriented at an angle with respect to the second surface. The first surface may include a first face, a second face, a third face connected between the first face and the second face, and a first light-scattering structure positioned at a first portion of the second face. A distance between the first face and the second surface may be unequal to a distance between the second face and the second surface. The third face may not be parallel to the first face and may not be parallel to the second face. | 08-06-2015 |
20150268409 | BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME - A display apparatus with at least two light guide plates, each including a light incident surface and a light exiting surface, the light guide plates being spaced apart from each other so as to form a gap therebetween. The display apparatus also has a light source disposed adjacent to at least one side portion of the light guide plates to emit light to the light incident surface, a display panel positioned to receive light from the light exiting surfaces to facilitate display of an image, and a diffusion member. The diffusion member covers the gap, so as to diffuse light directed toward the display panel. | 09-24-2015 |
20150369451 | LENS ASSEMBLY FOR BACKLIGHT SOURCE AND BACKLIGHT UNIT HAVING THE SAME - A lens assembly for a backlight light source includes: a plurality of light emitters, where each of the light emitters includes a first light-emitting device and a second light-emitting device, and the first and second light-emitting devices emit light having different colors from each other; and a lens disposed on the light emitter to cover the light emitter, where the lens is substantially symmetric with respect to a center axis thereof and has a bar shape extending in a direction parallel to the center axis, the light emitters are spaced apart from each other in the direction parallel to the center axis, and the first light-emitting device and the second light-emitting device of each of the light emitters are spaced apart from each other in the direction parallel to the center axis. | 12-24-2015 |
20150369987 | BACKLIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - A backlight assembly is provided. The backlight assembly includes a light source, a light guide plate, a light collimation unit, and a guide groove. The light guide plate faces the light source in a first direction. The light guide plate includes a first surface on which light emitted from the light source is incident on and a second surface through which the incident light is emitted. The light collimation unit protrudes from an upper surface of the light guide plate and faces the light source. The guide groove is formed in a lower surface of the light guide plate along the first surface of the light guide plate. | 12-24-2015 |