| Patent application number | Description | Published |
|---|
| 20090034200 | HEAT SINK ASSEMBLY HAVING A FASTENER ASSEMBLY FOR FASTENING THE HEAT SINK TO AN ELECTROINC COMPONENT - A heat sink assembly for dissipating heat from an electronic component ( | 02-05-2009 |
| 20090059533 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component. | 03-05-2009 |
| 20090129019 | HEAT DISSIPATION DEVICE WITH FAN HOLDER - A heat dissipation device includes a heat sink attached to an electronic component, a fan and a fan holder mounting the fan onto the heat sink. The heat sink includes a plurality of fins. The fan holder includes a plurality of walls connecting with each other. A pair of tabs is formed on one of the walls for abutting against the fan, and a pair of fasteners is formed on another wall and opposite to the tabs. Each of the fasteners includes a sleeve formed on the another wall, a pressing member movably received in the sleeve, and a crank pivotally engaged with the sleeve. When the crank is positioned in a closed position, the pressing member is pushed out of the sleeve by the crank and abuts against the fan. The fasteners cooperate with the tabs to mount the fan onto the fan holder. | 05-21-2009 |
| 20090141453 | HEAT DISSIPATION DEVICE HAVING A CLIP ASSEMBLY - A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto. | 06-04-2009 |
| 20090151896 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a wire clip. The heat sink has a base plate and a plurality of parallel fins arranged on the base plate. The heat sink defining a plurality lengthways channels between every two neighboring fins and a plurality of transverse channels perpendicular to the lengthways channels. The clip comprises a main body spanning on the base plate of the heat sink and two latching legs extending contrary from two opposite ends of the main body. The main body comprises a pressing section received in the lengthways channels and two pivoting sections extending from two opposite ends of the pressing section and received in the transverse channels. The two latching legs are located at the two opposite sides of the heat sink. | 06-18-2009 |
| 20090154100 | HEAT DISSIPATING ASSEMBLY - A heat dissipating assembly for dissipating heat from a plurality of electronic components, including a heat sink ( | 06-18-2009 |
| 20090154110 | HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS - A heat sink assembly for removing heat from a plurality arrays of heat generating-components mounted on a printed circuit board includes a fist and a second heat sink, a plurality of fastening assemblies. Each of the first and second heat sinks comprises an elongated base and a plurality of fins mounted on the base. The base extends beyond the fins at two lateral sides of the fins to form a first shoulder and a second shoulder located above the first shoulder in a manner such that the second shoulder of the first heat sink is superposed on the first shoulder of the second heat sink. The fastener assembly extends through the superposed first and second shoulders of the first and second heat sinks to assemble the first and second heat sinks on the printed circuit board. | 06-18-2009 |
| 20090168355 | HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS - A heat sink assembly for removing heat from two heat generating-components mounted on a printed circuit board, includes a first heat sink, a second heat sink, a plurality of poles each having a head at a top end and a double-layer spring. The first heat sink includes a base and a plurality of fins arranged on the base. The second heat sink has a first shoulder extending from a lateral side thereof. The first shoulder is disposed on the base. The double-layer spring includes an outer spring and an inner spring having a top end connected to a top end of the outer spring. One of the poles wearing the double-layer spring extends through the first shoulder and the base. The outer spring is compressed between the head of the pole and the first shoulder. The inner spring is compressed between the head of the pole and the base. | 07-02-2009 |
| 20090180399 | METHOD AND NODE DEVICE FOR REALIZING THE NETWORK TOPOLOGY DISCOVERY - Method for realizing the network topology discovery, which relates to the field of internet technique, includes: receiving the network topology inquiring command from the previous node, the network topology inquiring command includes the address information of the specified node; feeding back the network topology information of this node to the specified node, the network topology information of this node includes the connection information between this node and the previous node. The invention also discloses a node device. With the technique scheme provided by this invention, it can obtain the connection information between the nodes in the network topology information, namely the connection state of point-to-point. | 07-16-2009 |
| 20100272562 | CENTRIFUGAL PUMP - A centrifugal pump includes a pump unit and a drive unit. The pump unit includes a volute and an impeller disposed in the volute. The drive unit includes a stator and a rotor having a shaft. The volute includes an inlet, an outlet and a chamber in communication with the inlet and outlet. The shaft of the rotor extends into the chamber of the volute and the impeller is attached to and driven by the shaft. The volute further includes a transition part connected between the outlet and the chamber and communicating the outlet with the chamber. The axis of the transition part is angled to the axis of the outlet. The transition part is configured to improve the effect of fluid turbulence to thereby reduce noise, especially in the air-water stage. | 10-28-2010 |
| 20100322794 | CENTRIFUGAL PUMP - A centrifugal pump has a pump unit and a drive unit. The pump unit includes a volute and an impeller disposed in the volute. The drive unit has a stator and a rotor having a shaft. The volute includes an inlet, an outlet and a chamber in communication with the inlet and outlet. The inlet is coaxial with the chamber. The shaft of the rotor extends into the chamber of the volute and the impeller is attached to and driven by the shaft. The volute further includes a baffle installed in the inlet. The baffle includes a guide plate angled to the axis of the inlet. | 12-23-2010 |
