Patent application number | Description | Published |
20090315069 | THIN GALLIUM NITRIDE LIGHT EMITTING DIODE DEVICE - Disclosed is a light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded. Preforms for manufacturing the LED device and a method for manufacturing the LED device are also disclosed. The sapphire substrate, on which the crystal structure of the light emitting diode has grown, is processed into a unit chip before being removed. Thus, any crack in the crystal structure of the light emitting diode that may occur during the removal of the sapphire substrate can be prevented. Therefore, a thin light emitting diode device can be manufactured in a mass production system. | 12-24-2009 |
20100179294 | ALKALI-SOLUBLE RESIN AND NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME - A heat-curable ink composition and a color filter produced using the ink composition are provided. The ink composition and the color filter are highly resistant to heat and chemicals due to the use of a polyester resin prepared by polycondensation. In addition, unreacted anhydride groups are removed using a monohydric alcohol in the preparation of the ink composition to make the ink composition and the color filter very stable during storage. | 07-15-2010 |
20110227009 | INK COMPOSITION FOR MANUFACTURING COLOR FILTER - Provided is an ink composition for manufacturing color filters. The ink composition includes an acrylic binder resin obtained by polymerizing the group of monomers containing a compound represented by Formula 1. The ink composition has good chemical resistance and adhesive properties and is used for manufacturing color filters exhibiting a high contrast ratio: | 09-22-2011 |
20140039112 | CURABLE COMPOSITION - Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness. | 02-06-2014 |
20140039113 | Curable Composition - Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness. | 02-06-2014 |
20140199527 | INK COMPOSITION USABLE IN SOLAR BATTERY MANUFACTURING PROCESS, AND METHOD OF FORMING PATTERN USING THE SAME - Provided are an ink composition usable in a solar battery manufacturing process, a method of forming a pattern using the ink composition, an insulation film formed of the ink composition, and an etching mask formed of the ink composition. The ink composition includes: a) a polymerizable compound having an ethylenically unsaturated bond; b) a fluorinated surfactant; and c) a solvent, wherein the ink composition has a solid content of 45 parts by weight to 99.99 parts by weight. | 07-17-2014 |
20140346550 | CURABLE COMPOSITION - Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time. | 11-27-2014 |
20140350194 | CURABLE COMPOSITION - Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device. | 11-27-2014 |