Patent application number | Description | Published |
20090047757 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In the semiconductor device which has partial trench isolation as isolation between elements formed in an SOI substrate, resistance reduction of the source drain of a transistor and reduction of leakage current are aimed at. A MOS transistor is formed in the active region specified by the isolation insulating layer in the SOI layer formed on the buried oxide film layer (BOX layer). An isolation insulating layer is a partial trench isolation which has not reached a BOX layer, and source and drain regions include the first and the second impurity ion which differs in a mass number mutually. | 02-19-2009 |
20090127623 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a semiconductor device, a gate electrode, an impurity diffused region, a body potential fixing region, a first insulator, and a dummy gate electrode are provided on top of an SOI substrate consisting of an underlying silicon substrate, a buried insulator, and a semiconductor layer. The impurity diffused region is a region formed by implanting an impurity of a first conductivity type into the semiconductor layer around the gate electrode. The body potential fixing region is a region provided in the direction of an extension line of the length of the gate electrode and implanted with an impurity of a second conductivity type. The first insulator is formed at least in the portion between the body potential fixing region and the gate electrode. The dummy gate electrode is provided on the first insulator between the body potential fixing region and the gate electrode. | 05-21-2009 |
20090206425 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided are a semiconductor device having an MTJ element capable of intentionally shifting the variation, at the time of manufacture, of a switching current of an MRAM memory element in one direction; and a manufacturing method of the device. The semiconductor device has a lower electrode having a horizontally-long rectangular planar shape; an MTJ element having a vertically-long oval planar shape formed on the right side of the lower electrode; and an MTJ's upper insulating film having a horizontally-long rectangular planar shape similar to that of the lower electrode and covering the MTJ element therewith. As the MTJ's upper insulating film, a compressive stress insulating film or a tensile stress insulating film for applying a compressive stress or a tensile stress to the MTJ element is employed. | 08-20-2009 |
20090269860 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a manufacturing method of a semiconductor device capable of forming, as a protective film of an MTJ element, a silicon nitride film having good insulation properties without deteriorating the properties of the MTJ element. The method of the invention includes steps of forming a silicon nitride film over the entire surface including an MTJ element portion (MTJ element and an upper electrode) while using a parallel plate plasma CVD apparatus as a film forming apparatus and a film forming gas not containing NH | 10-29-2009 |
20090294881 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention makes it possible to obtain: a semiconductor device capable of forming a highly reliable upper wire without a harmful influence on the properties of the magnetic material for an MTJ device; and the manufacturing method thereof. Plasma treatment is applied with reducible NH | 12-03-2009 |
20100032779 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - To provide a semiconductor device that has an improved adhesion between a bottom conductive layer and a protection film protecting an MTJ element. | 02-11-2010 |
20100270634 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention makes it possible to obtain: a semiconductor device capable of forming a highly reliable upper wire without a harmful influence on the properties of the magnetic material for an MTJ device; and the manufacturing method thereof. Plasma treatment is applied with reducible NH | 10-28-2010 |
20110163401 | SEMICONDUCTOR DEVICE HAVING MEMORY ELEMENT WITH STRESS INSULATING FILM - Provided are a semiconductor device having an MTJ element capable of intentionally shifting the variation, at the time of manufacture, of a switching current of an MRAM memory element in one direction; and a manufacturing method of the device. The semiconductor device has a lower electrode having a horizontally-long rectangular planar shape; an MTJ element having a vertically-long oval planar shape formed on the right side of the lower electrode; and an MTJ's upper insulating film having a horizontally-long rectangular planar shape similar to that of the lower electrode and covering the MTJ element therewith. As the MTJ's upper insulating film, a compressive stress insulating film or a tensile stress insulating film for applying a compressive stress or a tensile stress to the MTJ element is employed. | 07-07-2011 |
20110169113 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention makes it possible to obtain: a semiconductor device capable of forming a highly reliable upper wire without a harmful influence on the properties of the magnetic material for an MTJ device; and the manufacturing method thereof. Plasma treatment is applied with reducible NH | 07-14-2011 |
20110171755 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE HAVING MEMORY ELEMENT WITH PROTECTIVE FILM - To provide a manufacturing method of a semiconductor device capable of forming, as a protective film of an MTJ element, a silicon nitride film having good insulation properties without deteriorating the properties of the MTJ element. The method of the invention includes steps of forming a silicon nitride film over the entire surface including an MTJ element portion (MTJ element and an upper electrode) while using a parallel plate plasma CVD apparatus as a film forming apparatus and a film forming gas not containing NH | 07-14-2011 |
20120211847 | SEMICONDUCTOR DEVICE INCLUDING A MAGNETIC TUNNEL JUNCTION AND METHOD OF MANUFACTURING THE SAME - To provide a semiconductor device that has an improved adhesion between a bottom conductive layer and a protection film protecting an MTJ element. | 08-23-2012 |