Patent application number | Description | Published |
20130023089 | LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE - A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. The heatsink and the lead frame preferably comprise the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square. | 01-24-2013 |
20130099670 | METHOD AND APPARATUS FOR LED STRING SHORT CIRCUIT DETECTION AND PROTECTION - An apparatus for LED string short circuit detection constituted of: a constant current drive circuit; a plurality of LED strings, a first end of each of the plurality of LED strings coupled to a common output of the constant current drive circuit; a first sense resistor coupled between a second end of each of the plurality of LED strings and a chassis; a second sense resistor coupled between the chassis and a return of the constant current drive circuit; and a comparing circuit arranged to compare the amount of current flow through the first sense resistor with amount of current flow through the second sense resistor, the comparing circuit arranged to assert a fault signal in the event that the amount of current flow through the second sense resistor exceeds the current flow through the first sense resistor by a predetermined minimum value. | 04-25-2013 |
20130131875 | APPARATUS AND METHOD FOR ASSESSING VOLUMETRIC MOISTURE CONTENT AND CONTROLLING AN IRRIGATOR - An apparatus for assessing at least one property of a target soil responsive to a first a first microwave signal, constituted of: a detector; a probe arranged to be embedded in the target soil; and a coupler arranged to couple a first portion of the first microwave signal to the first end of the probe, and to couple a second portion of the generated first microwave signal as a microwave reference signal to a reference input of the detector; the detector arranged to square each of the microwave signal exiting the probe and the microwave reference signal and to output a phase difference signal indicative of the phase difference between the squared probe output microwave signal and the squared microwave reference signal; and a control circuitry coupled to the output of the detector and arranged to output an irrigation control signal responsive to the phase difference signal. | 05-23-2013 |