Michiya
Michiya Abe, Toyoake JP
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20090019873 | Showcase - A showcase where an illumination device is placed outside a receiving chamber to enable effective use of the space in the receiving chamber. The inside of an insulated box body ( | 01-22-2009 |
Michiya Higuchi, Nantan-Shi JP
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20110082229 | CARBOXYL RESIN, HARDENING COMPOSITION CONTAINING CARBOXYL RESIN, AND HARDENED MATERIAL THEREOF - A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent. | 04-07-2011 |
Michiya Higuchi, Nagaokakyo-Shi JP
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20140186766 | RESIN COMPOSITION FOR MASKS - The present invention provides a resin composition for resist to be efficiently formed into a cured product with high properties of crack resistance, bulge resistance, protrusion resistance, and the like for filling a through-hole, a via hole, or the like with the cured product. The resin composition for masks in accordance with the present invention contains a first resin and a second resin. The first resin is prepared by an addition reaction of polybasic acid anhydride with an adduct of an ethylenically unsaturated compound having a carboxyl group and bifunctional epoxy resin. The second resin having; a group obtained by an addition reaction of an epoxy group with monocarboxylic acid; and a group obtained by addition reaction of an epoxy group with polybasic acid. | 07-03-2014 |
Michiya Ishikawa, Shiga JP
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20120035299 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri—or more—functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg. | 02-09-2012 |
Michiya Ishikawa, Moriyama JP
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20110040111 | EPOXY COMPOUND AND MANUFACTURING METHOD THEREOF - A novel epoxy compound represented by the following formula and a method for producing the same are provided: | 02-17-2011 |
Michiya Ishikawa, Moriyama-Shi JP
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20130005855 | EPOXY RESIN COMPOSITION FOR USE IN A CARBON-FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND CARBON-FIBER-REINFORCED COMPOSITE MATERIAL - Disclosed is a carbon-fiber-reinforced composite material that is suitable for use as a construction material and exhibits high mechanical strength in harsh usage environments such as low-temperature environments and high-temperature moisture-absorbing environments. Also disclosed are an epoxy resin composition for producing the aforementioned carbon-fiber-rein-forced composite material and a prepreg obtained through the use of said epoxy resin composition. Said epoxy resin composition comprises at least the following constituents, by mass with respect to the total mass of the composition: (A) between 20% and 80% of an epoxy resin having the structure represented by formula (1); and (B) between 10% and 50% of an epoxy resin that has at least two ring structures with four or more members each and also has one amine glycidyl or ether glycidyl directly connected to a ring structure. | 01-03-2013 |
20130012730 | HIGH-PURITY EPOXY COMPOUND AND METHOD OF PRODUCING THEREOF - An epoxy compound of high-purity N,N,N′,N′-tetraglycidyl-3,4′-diaminodiphenyl ether is produced by: an addition reaction step of reacting 3,4′-diaminodiphenyl ether with epichloro-hydrin in a polar protic solvent at 65 to 100° C. for | 01-10-2013 |
Michiya Kazusawa, Kanagawa JP
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20110141603 | HEAD/DISK CONTACT DETERMINATION - A disk drive including a sensor element that senses contact between a head slider and a disk, a head integrated circuit (IC) comprising an amplification circuit section that amplifies a signal of the head slider, a controller IC comprising a controller that accesses a register of the head IC for controlling the head IC, and an identification section, within the head IC, that determines a contact frequency of the contact by the sensor element by using a timing control signal of the controller IC. | 06-16-2011 |
20150138937 | SELF-CONTROLLED LASER PULSING FOR THERMALLY ASSISTED RECORDING - A method of storing data includes providing a write signal for a write head of a hard disk drive, generating a transition pulse signal derived from the write signal using a transition pulse generator, and generating a logic signal to drive a thermal source associated with the write head of the hard disk drive. The logic signal includes the logical summation of a cyclical base pulse signal and the transition pulse signal. | 05-21-2015 |
Michiya Kohiki, Hitachi-Shi JP
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20150047884 | Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board - Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil. | 02-19-2015 |
20150195909 | Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ultrathin Copper Layer - Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less. | 07-09-2015 |
Michiya Kohiki, Ibaraki JP
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20100040873 | Two-Layered Copper-Clad Laminate - A two-layered copper-clad laminate having a copper layer formed on a polyimide film by sputtering and plating, characterized in that the two-layered copper-clad laminate shows a behavior of shrinkage in MD of the copper-clad laminate and expansion in TD of the copper-clad laminate, and a warpage of the materials for the laminate is 20 mm or less, wherein the warpage represents an extent of lift of the two-layered copper-clad laminate of 100 mm square after maintaining 50% humidity at a temperature of 23° C. for 72 hours. With respect to the two-layered CCL having a copper layer provided on a polyimide film by sputtering and plating, there is provided a two-layered CCL material exhibiting a reduced warpage of the laminate and provides a method for manufacturing the same. | 02-18-2010 |
20100215982 | Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite - Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and an apparatus for producing the composite. | 08-26-2010 |
20100221563 | Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board - Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board. | 09-02-2010 |
20120132531 | Process and Apparatus for Producing a Metal Covered Polyimide Composite - A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided. | 05-31-2012 |
20130220685 | COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COPPER FOIL, RESIN SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 μm to 1.0 μm, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a producing method thereof, wherein a roughened layer of the copper foil can be improved to enhance the adhesiveness between the copper foil and a resin. | 08-29-2013 |
20130256140 | ELECTROLYTIC COPPER FOIL - Provided is an electrolytic copper foil having a surface roughness Rz of 2.0 μm or less, wherein a foil thickness difference in the width direction is 1.5% or less. Also provided is the electrolytic copper foil, wherein the foil thickness difference in the width direction is 1.3% or less. Further provided is the electrolytic copper foil, wherein a variation in the roughness in the width direction (Rzmax−Rzmin)/Rzavg is 15% or less. An object of the present invention is to provide an electrolytic copper foil having low surface roughness, wherein the formation of an “elongation wrinkle” and a discolored streak along the length direction is suppressed by allowing the thickness to be uniform in the width and length directions. | 10-03-2013 |
20140030591 | ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLECTOR IN A SECONDARY BATTERY AND METHOD OF PRODUCING THE SAME - The present invention provides an electrolytic copper foil which is excellent in the extension property and can endure the change in the expansion and contraction at the fine units while having high strength, and a method of producing the same. Specifically, the electrolytic copper foil for a negative electrode collector in a secondary battery, wherein in a nominal stress strain curve, a tensile strength is 45 to 70 kg/mm | 01-30-2014 |
20140318973 | ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPPER FOIL - The present invention provides an electrolytic copper foil that has a high normal tensile strength, a low decrease in tensile strength after a thermal history, and a low concentration of impurities in the copper foil and a method for producing the copper foil. Specifically, the electrolytic copper foil in which a sulfur concentration of the copper foil is not less than 10 ppm by mass but no more than 50 ppm by mass, wherein when lattices with a spacing of 10 nm in a STEM image observed with a scanning transmission electron microscope at a magnification of 1 million times are formed and intersections of each lattice are used as a measurement point for determining a sulfur concentration, there is a measurement point at which the sulfur concentration is higher as compared to the sulfur concentration of the copper foil. | 10-30-2014 |
20140346048 | Electrolytic Copper Foil, and Negative Electrode Current Collector for Secondary Battery - Present invention provides an electrolytic copper foil having a high normal tensile strength and a resistance to the lowering of the tensile strength after thermal treatment. An electrolytic copper foil having a normal tensile strength of 500-750 MPa and a tensile strength after heating at 400° C. for one hour of at least 350 MPa. | 11-27-2014 |
Michiya Kurohashi, Hyogo JP
Michiya Murakami, Kirishima-Shi JP
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20150311423 | PIEZOELECTRIC ACTUATOR, PIEZOELECTRIC VIBRATION APPARATUS, AND PORTABLE TERMINAL - There are provided a piezoelectric actuator having reduced noise caused by the vibration of a piezoelectric element is reduced, a piezoelectric vibration apparatus and a portable terminal. A piezoelectric actuator includes a piezoelectric element which includes a stacked body in which internal electrodes and piezoelectric layers are laminated, and a surface electrode disposed on one main surface of the stacked body so as to be electrically connected to the internal electrodes; and a flexible substrate electrically joined to the surface electrode; and a reinforcing plate fixedly attached to a region of the flexible substrate where the flexible substrate overlaps with the piezoelectric element, the reinforcing plate being provided with a bend portion. | 10-29-2015 |
Michiya Nakamura, Azumino-Shi JP
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20140183284 | NOZZLE PLATE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS - A silicon nozzle plate has excellent liquid resistance on an inner surface of a nozzle opening and a discharge surface. A plurality of the nozzle openings are disposed in a silicon substrate of the nozzle plate. A tantalum oxide film formed by atomic layer deposition is disposed on both surfaces of the silicon substrate and the inner surface of the nozzle opening. | 07-03-2014 |
20140184705 | LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - A liquid ejecting head suppresses erosion of silicon substrates by liquid, and whereby suppresses leakage of liquid, discharging failure of liquid droplets, and peeling-off of laminated substrates. The liquid ejecting head includes at least a nozzle plate on which nozzle openings for discharging liquid are provided, and a flow path formation substrate on which a pressure generation chamber communicating with the nozzle openings is provided. The nozzle plate is formed with a silicon substrate. At least the flow path formation substrate and the nozzle plate are bonded to each other after providing a tantalum oxide film formed by atomic layer deposition on the entire surfaces including a bonded surface. | 07-03-2014 |
Michiya Nakashima, Chiba-Shi JP
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20090168141 | ION CONDUCTOR AND ELECTROCHEMICAL DISPLAY DEVICE UTILIZING THE SAME - An ion conductor has fine particles of an organic polymer including 20 to 80% by mass of ultra-fine particles of an inorganic compound, and an electrolytic solution impregnated into the fine particles of the organic polymer, wherein the fine particles of the organic polymer have a specific surface area measured by the BET method of 30 m | 07-02-2009 |
Michiya Nakashima, Yotsukaido-Shi JP
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20110287201 | POLYARYLENE SULFIDE RESIN COMPOSITION AND FLUID PIPE MATERIAL - What is offered is: a polyarylene sulfide resin composition which includes 100 mass parts of a polyarylene sulfide resin (A), 0.1 to 8 mass parts of a metal fine particle (B) containing at least one metal species selected from the group consisting of copper, nickel, and zinc, and 0.1 to 5 mass parts of a thermoplastic elastomer (C); and a piping member for fluid obtained by molding of the pertinent resin composition. This piping member for fluid is useful for water-supply pipes, water-heater pipes, and the like in cold weather climates, as it is high in toughness at low-temperature, inhibits damage or rupture of pipes due to freezing, and also inhibits occurrence of creep deformation at high temperature. | 11-24-2011 |
Michiya Nakashima, Sakura-Shi JP
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20140329950 | RESIN COMPOSITION FOR ADHESIVE CONTAINING PLATE-LIKE INORGANIC COMPOUND, AND ADHESIVE - An object of the present invention is to provide a resin composition for adhesives, the resin composition mainly containing a resin that has a good adhesive strength or a good oxygen-barrier property, and an adhesive obtained by applying the resin composition onto a film. The object is achieved by providing a resin composition for adhesives, the resin composition containing (A) a resin that has, as functional groups, two or more hydroxyl groups per molecule, (B) an isocyanate compound that has, as functional groups, two or more isocyanate groups per molecule, and (C1) a plate-like inorganic compound or (C2) a light-blocking agent that can block light having a wavelength of 350 nm or less, and an adhesive obtained by curing the resin composition for adhesives. | 11-06-2014 |
20160053110 | POLYESTER RESIN COMPOSITION, ADHESIVE AND FILM - A polyester resin composition according to the present invention includes a polyester polyol having a glycerol skeleton and a curing agent, wherein 5 percent by mass or more of glycerol residue of the polyester polyol is contained in the polyester resin composition. The resin composition can provide an adhesive exhibiting an excellent adhesive force. The adhesive has a gas barrier property or a water vapor barrier property and, therefore, a gas barrier or water vapor barrier film can be provided by using the adhesive. | 02-25-2016 |
Michiya Nakashima, Yotsukai Do-Shi JP
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20130158186 | OXYGEN-BARRIER FILM AND ADHESIVE - An oxygen-barrier film and an adhesive used therefor. Provided are an adhesive, which can be used for packaging foodstuffs and contains mainly a polyester having excellent oxygen-barrier properties, and an oxygen-barrier film that uses the adhesive. The oxygen-barrier film is prepared using an adhesive that includes: an amorphous polyester polyol, which is obtained by polycondensation of a polyvalent carboxylic acid component including at least one type of ortho-oriented aromatic dicarboxylic acid or anhydride thereof, and a polyhydric alcohol including at least one compound selected from the group consisting of ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol and cyclohexanedimethanol, and a curing agent capable of reacting with the amorphous polyester polyol. | 06-20-2013 |
Michiya Okada, Tsukuba JP
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20110028327 | Superconducting Circuit, Production Method of Superconducting Joints, Superconducting Magnet, and Production Method of Superconducting Magnet - A superconducting circuit including a superconducting joint that joints a niobium titanium superconducting wire having a structure where a filament made of niobium titanium alloy is arranged in a matrix made of copper or copper alloy and other superconducting wire, in which a volume ratio or a surface density of an α-Ti precipitation in the niobium titanium alloy of the filament in the superconducting joint is smaller than the volume ratio or the surface density of the α-Ti precipitation in the niobium titanium alloy of the filament in the niobium titanium superconducting wire in a portion other than the superconducting joint. | 02-03-2011 |
20120094840 | REFRIGERATOR COOLING-TYPE SUPERCONDUCTING MAGNET - Magnetic field attenuation in a persistent current mode operation is prevented, heat generation at a connecting part between the persistent current switch and the superconducting coil, and increase in a cooling temperature of the superconducting coil in a current supplying mode is suppressed to a minimum. | 04-19-2012 |
Michiya Sunaduka, Oyama-Shi JP
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20130192326 | METHOD FOR DRAWING METALLIC TUBE - In a method for drawing a tube blank while supplying lubricant to an inner surface of the tube blank from a discharge opening of a rod, the lubricant is adhered appropriately to the inner surface both in the circumferential direction of the tube blank and in the longitudinal direction thereof without using any application member such as a core. While drawing a metal tube blank | 08-01-2013 |
Michiya Takagi, Wakayama JP
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20100008869 | METHOD FOR PREVENTING COLORATION OF CATECHINS AND DENTIFRICE COMPOSITION - The present invention relates to a method of suppressing coloration of catechins, which contains adding, to catechins, a water-soluble polymer forming a water-insoluble complex with catechins, as well as hydrogel particles containing a water-insoluble complex between catechins and a polymer forming a water-insoluble complex with catechins. Further, the present invention relates to a dentifrice composition containing hydrogel particles containing catechins and a polymer forming a water-insoluble complex with catechins, a binder and water. | 01-14-2010 |
20100015186 | HYDROGEL PARTICLE - A hydrogel particle contains a continuous phase portion of non-crosslinked hydrogel and a large number of disperse phase portions dispersed in the continuous phase portion. Each of the large number of disperse phase portions is a solid phase containing an oil component and particles of zinc oxide dispersed therein. | 01-21-2010 |
20110236446 | HYDROGEL PARTICLES - Hydrogel particles include a continuous phase portion of non-crosslinked hydrogel and disperse phase portions dispersed in the continuous phase portion. Each of the disperse phase portions contains a solid oil and a liquid oil as an oil component, and titanium oxide particles dispersed therein. The solid oil of the oil component contains a higher alcohol and a solid paraffin, and the content of the solid oil in the disperse phase portion is 1 to 12 mass %. The hydrogel particles have a volume-average particle diameter of 10 to 300 μm. | 09-29-2011 |
20120237458 | HYDROGEL PARTICLES - Hydrogel particles include: (A) a water-insoluble complex containing catechins; (B) a compound which forms chelate together with divalent or trivalent metal ions; (C) a divalent or trivalent metal salt; (D) a gel-forming agent; and (E) water. | 09-20-2012 |
20150209267 | METHOD OF SUPPRESSING COLORATION OF CATECHINS AND A DENTIFRICE COMPOSITION - The present invention relates to a method of suppressing coloration of catechins, which contains adding, to catechins, a water-soluble polymer forming a water-insoluble complex with catechins, as well as hydrogel particles containing a water-insoluble complex between catechins and a polymer forming a water-insoluble complex with catechins. Further, the present invention relates to a dentifrice composition containing hydrogel particles containing catechins and a polymer forming a water-insoluble complex with catechins, a binder and water. | 07-30-2015 |
Michiya Takeda, Toyokawa-Shi JP
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20100329731 | FITTING STRUCTURE FOR PROCESS CARTRIDGES AND IMAGE FORMING APPARATUS BODY, AND IMAGE FORMING APPARATUS HAVING THIS STRUCTURE - A fitting structure for process cartridges and an image forming apparatus body of an image forming apparatus capable of fitting the process cartridges for plural colors thereto, the fitting structure including: an incompatible member with its cross-sectional shape in an axial direction being rotationally symmetrical, the incompatible member having at least one attaching projection and one displaying hole or one displaying notched portion formed on a position different from a rotational shaft of the rotationally symmetrical shape; an attached portion of the process cartridge capable of holding the incompatible member, having identification display portions for identifying the plural colors arranged on the position corresponding to the displaying hole or the displaying notched portion; and an acceptance portion of the image forming apparatus body having an acceptance concave portion for accepting the at least one attaching projection of the incompatible member. | 12-30-2010 |
Michiya Takeda, Hoi-Gun JP
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20080298829 | IMAGE FORMING APPARATUS - An object of the present invention is to provide an image forming apparatus which can achieve reduction in printing time, suppression of developer consumption, and implementation of silence. An image forming apparatus capable of forming a color image on an image carrier with use of developers of a plurality of different developing colors, including a plurality of developing devices respectively housing the developers of different colors, and a control section for controlling operation of the developing devices based on inputted image data, wherein the control section includes a concentration ratio recognition section for recognizing a concentration ratio of the respective colors for image data of every sheet from the image data, and controls so as to spare at least one color developer among the developers in response to the concentration ratio of respective colors recognized by the concentration ratio recognition section. | 12-04-2008 |
Michiya Takezoe, Osaka JP
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20090243525 | INVERTER CONTROL METHOD - Two current threshold values are adopted, which are larger than the upper limit of current of an operating region. When a rotating speed is smaller than a speed threshold value, the current threshold value is adopted as a criterion to judge whether an input current to an inverter is abnormal, and when the rotating speed Rot is larger than that, the other current threshold value is adopted as the criterion. | 10-01-2009 |
Michiya Uchida, Shimonoseki-Shi JP
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20120216896 | SERVO VALVE - It is an object to provide a servo valve that can be manufactured at low cost by simplifying adjustment of the relative position between a nozzle and a flapper and simplifying the configuration of a valve-element driving circuit. Provided is a servo valve ( | 08-30-2012 |
Michiya Yamada, Hino-City JP
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20120230089 | MAGNETORESISTANCE ELEMENT AND NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE USING SAME MAGNETORESISTANCE ELEMENT - A magnetoresistance element is disclosed. The magnetoresistance element includes a magnetic tunnel junction portion configured by sequentially stacking a perpendicularly magnetized first magnetic body, an insulation layer, and a perpendicularly magnetized second magnetic body. The second magnetic body has a configuration wherein a ferromagnetic layer and a rare earth-transition metal alloy layer are stacked sequentially from the insulation layer side interface. A heat assist layer that heats the second magnetic body with a heat generated based on a current flowing through the magnetic tunnel junction portion is further provided. | 09-13-2012 |
20140217534 | MAGNETIC MEMORY ELEMENT AND STORAGE DEVICE USING THE SAME - A magnetic miniaturized memory element with improved thermal stability of magnetization includes a first magnetic layer, an insulating layer that is formed on the first magnetic layer, a second magnetic layer that is formed on the insulating layer, and an expanded interlayer insulating film that comes into contact with side surfaces of the first and second magnetic layers, where at least one of the first magnetic layer and the second magnetic layer is strained and deformed so as to be elongated in an easy magnetization axis direction of the first magnetic layer or the second magnetic layer or compressive strain remains in any direction in the plane of at least one of the first magnetic layer and the second magnetic layer. | 08-07-2014 |
20140242769 | METHOD OF MANUFACTURING A SUPER-JUNCITON SEMICONDUCTOR DEVICE - A method of manufacturing a super-junction semiconductor device is disclosed that allows forming a high concentration layer with high precision and improves the trade-off relationship between the Eoff and the dV/dt using a trench embedding method. The method comprises a step of forming a parallel pn layer using a trench embedding method and a step of forming a proton irradiated layer in the upper region of the pn layer. Then, heat treatment is conducted on the proton irradiated layer for transforming the protons into donors to form a high concentration n type semiconductor layer. Forming the high concentration n type semiconductor layer by means of proton irradiation allows forming a high concentration n type semiconductor layer with an impurity concentration and thickness with high precision as compared with forming the layer by means of an epitaxial growth process. | 08-28-2014 |
Michiya Yamada, Tokyo JP
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20090237050 | Switching power supply - A switching power supply, which operates intermittently under a light load for suppressing electric power consumption, reduces output voltage variations caused when a load current increases rapidly from a light load state, and reduces output voltage ringing. The switching power supply includes a comparator that compares a feedback signal obtained by isolating the output from an error amplifier with a burst threshold value and a comparator that compares the feedback signal with a power-supply-interruption threshold value preset to be lower than the burst threshold value. The switching power supply stops output of a driving pulse from a driver circuit when the feedback signal is lower than the burst threshold value. The switching power supply also stops the output of operation power from first power supply circuit when the feedback signal is lower than the power-supply-interruption threshold value. | 09-24-2009 |
20090244943 | Power Converter - A power converter includes a small-sized inductor connected to an AC voltage input line for power factor correction and a filter for suppressing conduction noise. The inductor is connected to a rectifier and comprises first and second windings and that are wound on a common magnetic core and loosely coupled with each other. A leakage inductance component of the inductor functions as an energy storage element in a main conversion operation and an excitation inductance component of the inductor functions as a noise reduction element for suppressing an conduction noise caused by on-off operation of a switching element. | 10-01-2009 |
20110310660 | MAGNETORESISTANCE ELEMENT AND STORAGE DEVICE USING THE SAME - A magnetic memory element having a memory cell of size 4F | 12-22-2011 |
20120012954 | MAGNETIC MEMORY ELEMENT AND STORAGE DEVICE USING THE SAME - An object of the invention is to ensure the thermal stability of magnetization even when a magnetic memory element is miniaturized. A magnetic memory element includes a first magnetic layer ( | 01-19-2012 |
20120075922 | MAGNETIC MEMORY ELEMENT AND STORAGE DEVICE USING THE SAME - A magnetic memory element capable of maintaining high thermal stability (retention characteristics) while reducing a writing current. The magnetic memory element includes a magnetic tunnel junction having a first magnetic body including a perpendicular magnetization film, an insulating layer, and a second magnetic body serving as a storage layer including a perpendicular magnetization film, which are sequentially stacked. A thermal expansion layer is disposed in contact with the magnetic tunnel junction portion. The second magnetic body is deformed in a direction in which the cross section thereof increases or decreases by the thermal expansion or contraction of the thermal expansion layer due to the flow of a current, thereby reducing a switching current threshold value required to change the magnetization direction. | 03-29-2012 |
20150214471 | Magnetoresistance element and non-volatile semiconductor storage device using same magnetoresistance element - The invention provides a magnetoresistance element with a configuration such that a stable switching action is possible with a current flowing in response to the application of a unipolar electrical pulse, and a non-volatile semiconductor storage device using the magnetoresistance element. | 07-30-2015 |
Michiya Yano, Wako JP
Patent application number | Description | Published |
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20160121711 | INTERNAL COMBUSTION ENGINE EXHAUST SYSTEM SUPPORTING STRUCTURE - An internal combustion engine exhaust system supporting structure includes a body fastening portion, an exhaust fastening portion, a bracket, and a stay. The body fastening portion is provided on a power plant or a vehicle body located on a side of an exhaust passage extending from an internal combustion engine to a rear of a vehicle so that exhaust emissions flow from the internal combustion engine to the rear of the vehicle. The bracket is fastened to the body fastening portion. The stay is fastened to the exhaust fastening portion and has lower stiffness than the bracket. The bracket and the stay are fastened to each other at a connecting portion so that a vertical distance between the exhaust fastening portion and the connecting portion in a vertical direction is greater than a vertical distance between the body fastening portion and the connecting portion in the vertical direction. | 05-05-2016 |