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Michiya

Michiya Abe, Toyoake JP

Patent application numberDescriptionPublished
20090019873Showcase - A showcase where an illumination device is placed outside a receiving chamber to enable effective use of the space in the receiving chamber. The inside of an insulated box body (01-22-2009

Michiya Higuchi, Nantan-Shi JP

Patent application numberDescriptionPublished
20110082229CARBOXYL RESIN, HARDENING COMPOSITION CONTAINING CARBOXYL RESIN, AND HARDENED MATERIAL THEREOF - A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.04-07-2011

Michiya Ishikawa, Shiga JP

Patent application numberDescriptionPublished
20120035299EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL - Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri—or more—functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.02-09-2012

Michiya Ishikawa, Moriyama JP

Patent application numberDescriptionPublished
20110040111EPOXY COMPOUND AND MANUFACTURING METHOD THEREOF - A novel epoxy compound represented by the following formula and a method for producing the same are provided:02-17-2011

Michiya Kazusawa, Kanagawa JP

Patent application numberDescriptionPublished
20110141603HEAD/DISK CONTACT DETERMINATION - A disk drive including a sensor element that senses contact between a head slider and a disk, a head integrated circuit (IC) comprising an amplification circuit section that amplifies a signal of the head slider, a controller IC comprising a controller that accesses a register of the head IC for controlling the head IC, and an identification section, within the head IC, that determines a contact frequency of the contact by the sensor element by using a timing control signal of the controller IC.06-16-2011

Michiya Kohiki, Ibaraki JP

Patent application numberDescriptionPublished
20100040873Two-Layered Copper-Clad Laminate - A two-layered copper-clad laminate having a copper layer formed on a polyimide film by sputtering and plating, characterized in that the two-layered copper-clad laminate shows a behavior of shrinkage in MD of the copper-clad laminate and expansion in TD of the copper-clad laminate, and a warpage of the materials for the laminate is 20 mm or less, wherein the warpage represents an extent of lift of the two-layered copper-clad laminate of 100 mm square after maintaining 50% humidity at a temperature of 23° C. for 72 hours. With respect to the two-layered CCL having a copper layer provided on a polyimide film by sputtering and plating, there is provided a two-layered CCL material exhibiting a reduced warpage of the laminate and provides a method for manufacturing the same.02-18-2010
20100215982Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite - Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and an apparatus for producing the composite.08-26-2010
20100221563Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board - Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.09-02-2010

Michiya Nakashima, Chiba-Shi JP

Patent application numberDescriptionPublished
20090168141ION CONDUCTOR AND ELECTROCHEMICAL DISPLAY DEVICE UTILIZING THE SAME - An ion conductor has fine particles of an organic polymer including 20 to 80% by mass of ultra-fine particles of an inorganic compound, and an electrolytic solution impregnated into the fine particles of the organic polymer, wherein the fine particles of the organic polymer have a specific surface area measured by the BET method of 30 m07-02-2009

Michiya Nakashima, Yotsukaido-Shi JP

Patent application numberDescriptionPublished
20110287201POLYARYLENE SULFIDE RESIN COMPOSITION AND FLUID PIPE MATERIAL - What is offered is: a polyarylene sulfide resin composition which includes 100 mass parts of a polyarylene sulfide resin (A), 0.1 to 8 mass parts of a metal fine particle (B) containing at least one metal species selected from the group consisting of copper, nickel, and zinc, and 0.1 to 5 mass parts of a thermoplastic elastomer (C); and a piping member for fluid obtained by molding of the pertinent resin composition. This piping member for fluid is useful for water-supply pipes, water-heater pipes, and the like in cold weather climates, as it is high in toughness at low-temperature, inhibits damage or rupture of pipes due to freezing, and also inhibits occurrence of creep deformation at high temperature.11-24-2011

Michiya Okada, Tsukuba JP

Patent application numberDescriptionPublished
20110028327Superconducting Circuit, Production Method of Superconducting Joints, Superconducting Magnet, and Production Method of Superconducting Magnet - A superconducting circuit including a superconducting joint that joints a niobium titanium superconducting wire having a structure where a filament made of niobium titanium alloy is arranged in a matrix made of copper or copper alloy and other superconducting wire, in which a volume ratio or a surface density of an α-Ti precipitation in the niobium titanium alloy of the filament in the superconducting joint is smaller than the volume ratio or the surface density of the α-Ti precipitation in the niobium titanium alloy of the filament in the niobium titanium superconducting wire in a portion other than the superconducting joint.02-03-2011

Michiya Takagi, Wakayama JP

Patent application numberDescriptionPublished
20100008869METHOD FOR PREVENTING COLORATION OF CATECHINS AND DENTIFRICE COMPOSITION - The present invention relates to a method of suppressing coloration of catechins, which contains adding, to catechins, a water-soluble polymer forming a water-insoluble complex with catechins, as well as hydrogel particles containing a water-insoluble complex between catechins and a polymer forming a water-insoluble complex with catechins. Further, the present invention relates to a dentifrice composition containing hydrogel particles containing catechins and a polymer forming a water-insoluble complex with catechins, a binder and water.01-14-2010
20100015186HYDROGEL PARTICLE - A hydrogel particle contains a continuous phase portion of non-crosslinked hydrogel and a large number of disperse phase portions dispersed in the continuous phase portion. Each of the large number of disperse phase portions is a solid phase containing an oil component and particles of zinc oxide dispersed therein.01-21-2010
20110236446HYDROGEL PARTICLES - Hydrogel particles include a continuous phase portion of non-crosslinked hydrogel and disperse phase portions dispersed in the continuous phase portion. Each of the disperse phase portions contains a solid oil and a liquid oil as an oil component, and titanium oxide particles dispersed therein. The solid oil of the oil component contains a higher alcohol and a solid paraffin, and the content of the solid oil in the disperse phase portion is 1 to 12 mass %. The hydrogel particles have a volume-average particle diameter of 10 to 300 μm.09-29-2011

Michiya Takeda, Toyokawa-Shi JP

Patent application numberDescriptionPublished
20100329731FITTING STRUCTURE FOR PROCESS CARTRIDGES AND IMAGE FORMING APPARATUS BODY, AND IMAGE FORMING APPARATUS HAVING THIS STRUCTURE - A fitting structure for process cartridges and an image forming apparatus body of an image forming apparatus capable of fitting the process cartridges for plural colors thereto, the fitting structure including: an incompatible member with its cross-sectional shape in an axial direction being rotationally symmetrical, the incompatible member having at least one attaching projection and one displaying hole or one displaying notched portion formed on a position different from a rotational shaft of the rotationally symmetrical shape; an attached portion of the process cartridge capable of holding the incompatible member, having identification display portions for identifying the plural colors arranged on the position corresponding to the displaying hole or the displaying notched portion; and an acceptance portion of the image forming apparatus body having an acceptance concave portion for accepting the at least one attaching projection of the incompatible member.12-30-2010

Michiya Takeda, Hoi-Gun JP

Patent application numberDescriptionPublished
20080298829IMAGE FORMING APPARATUS - An object of the present invention is to provide an image forming apparatus which can achieve reduction in printing time, suppression of developer consumption, and implementation of silence. An image forming apparatus capable of forming a color image on an image carrier with use of developers of a plurality of different developing colors, including a plurality of developing devices respectively housing the developers of different colors, and a control section for controlling operation of the developing devices based on inputted image data, wherein the control section includes a concentration ratio recognition section for recognizing a concentration ratio of the respective colors for image data of every sheet from the image data, and controls so as to spare at least one color developer among the developers in response to the concentration ratio of respective colors recognized by the concentration ratio recognition section.12-04-2008

Michiya Takezoe, Osaka JP

Patent application numberDescriptionPublished
20090243525INVERTER CONTROL METHOD - Two current threshold values are adopted, which are larger than the upper limit of current of an operating region. When a rotating speed is smaller than a speed threshold value, the current threshold value is adopted as a criterion to judge whether an input current to an inverter is abnormal, and when the rotating speed Rot is larger than that, the other current threshold value is adopted as the criterion.10-01-2009

Michiya Yamada, Tokyo JP

Patent application numberDescriptionPublished
20090237050Switching power supply - A switching power supply, which operates intermittently under a light load for suppressing electric power consumption, reduces output voltage variations caused when a load current increases rapidly from a light load state, and reduces output voltage ringing. The switching power supply includes a comparator that compares a feedback signal obtained by isolating the output from an error amplifier with a burst threshold value and a comparator that compares the feedback signal with a power-supply-interruption threshold value preset to be lower than the burst threshold value. The switching power supply stops output of a driving pulse from a driver circuit when the feedback signal is lower than the burst threshold value. The switching power supply also stops the output of operation power from first power supply circuit when the feedback signal is lower than the power-supply-interruption threshold value.09-24-2009
20090244943Power Converter - A power converter includes a small-sized inductor connected to an AC voltage input line for power factor correction and a filter for suppressing conduction noise. The inductor is connected to a rectifier and comprises first and second windings and that are wound on a common magnetic core and loosely coupled with each other. A leakage inductance component of the inductor functions as an energy storage element in a main conversion operation and an excitation inductance component of the inductor functions as a noise reduction element for suppressing an conduction noise caused by on-off operation of a switching element.10-01-2009
20110310660MAGNETORESISTANCE ELEMENT AND STORAGE DEVICE USING THE SAME - A magnetic memory element having a memory cell of size 4F12-22-2011
20120012954MAGNETIC MEMORY ELEMENT AND STORAGE DEVICE USING THE SAME - An object of the invention is to ensure the thermal stability of magnetization even when a magnetic memory element is miniaturized. A magnetic memory element includes a first magnetic layer (01-19-2012

Patent applications by Michiya Yamada, Tokyo JP